Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
LFE5U-12F-6BG256C by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 1500 CLBs, 197 inputs/outputs, and a max supply voltage of 1.155V. It is used for various applications such as digital signal processing, telecommunications, and industrial automation.
Median Price
$15.125
Lifecycle Status
Suppliers In-Stock
8
In-Stock Inventory
1k+
Arrow
1+ parts
$13.470
100+ parts
$12.450
1k+ parts
-
10k+ parts
Verical
DigiKey
$16.780
$13.475
Mouser Electronics
$14.060
$13.480
Nova Conductors
$9.665
Cyclops Electronics Ltd
Chip Stock
Vyrian
Vigor
$6.500
Aranea Global
$9.472
$9.093
Continental Prestige Electronics
Ampacity Inc.
$10.460
Semicontronic
$10.198
$10.146
Microchip USA
$12.000
$11.000
$10.500
$10.000
Advanced Electronics
$45.657
$43.374
Aztec Data Supply Inc.
$55.440
Corohmni
$180.243
A-Z Elektronik GmbH
Argo Parts USA
Glotronic Ltd.
This product's use of plastic/epoxy as the package body material provides excellent durability and protection for the internal components, making it a reliable choice for various applications.
With its surface mount capability, this FPGA can be easily integrated into circuit boards, enhancing ease of assembly and reducing manufacturing costs.
The maximum supply voltage of 1.155V ensures stable and reliable performance, allowing for efficient operation and minimizing the risk of overvoltage damage.
The inclusion of 1500 configurable logic blocks (CLBs) in this FPGA allows for a high level of flexibility and customization, making it suitable for complex and versatile digital designs.
With 197 available inputs, this FPGA provides ample connectivity options, enabling seamless integration with other components and devices in the system.
The square shape of the package offers efficient use of space, ensuring compatibility with various board layouts and optimizing overall system design.
The use of ball terminals allows for easy soldering and improved electrical connections, contributing to the overall reliability and performance of the product.
The nominal supply voltage of 1.1V ensures stable and consistent power delivery, promoting efficient operation and minimizing voltage variations.
This FPGA incorporates 256 terminals, providing extensive connectivity options and supporting complex circuit designs, making it suitable for a wide range of applications.
Being a field-programmable gate array (FPGA), this product offers the advantage of reprogrammability, allowing for iterative design improvements and flexibility in adapting to changing system requirements.
The package style, featuring a grid array design with low profile and fine pitch, promotes compact and efficient board layouts, maximizing space utilization and simplifying assembly processes.
The minimum supply voltage requirement ensures that the FPGA can operate reliably and efficiently even under low voltage conditions, increasing its versatility and suitability for various applications.
With a maximum operating temperature of 85°C, this FPGA can withstand demanding environmental conditions, ensuring stable performance and reliability in rigorous applications.
The terminal pitch of 0.8mm allows for fine-pitch connections, enabling high-density circuit designs and maximizing the number of interconnections within limited board space.
The organization of 1500 configurable logic blocks (CLBs) offers a significant level of computational capability, enabling the FPGA to handle complex digital processing tasks effectively.
With a minimum operating temperature of 0°C, this FPGA is suitable for use in a wide range of environments, including both indoor and outdoor applications.
The use of tin silver copper as the terminal finishing enhances the electrical conductivity and resistance to corrosion, ensuring reliable and long-lasting connections.
The terminal positioned at the bottom of the device facilitates efficient and organized board layout designs, enhancing ease of connectivity and overall system integration.
With an MSL rating of 3, this FPGA can withstand moderate levels of moisture exposure during storage and assembly, ensuring product integrity and reliability.
The maximum seated height of 1.7mm contributes to space-saving designs, allowing for compact and slim form factors in various electronic systems.
The width of 14mm makes this FPGA compatible with standard form factors and facilitates integration into existing system designs.
This FPGA provides 197 outputs, offering ample options for transmitting signals and data, making it ideal for complex digital designs and multi-functional applications.
The maximum time allowed at peak reflow temperature helps ensure proper and reliable solder joint formation, minimizing the risk of thermal damage during assembly.
The peak temperature of 260°C during the reflow process ensures proper solder melting and component attachment, contributing to reliable solder joints and overall product performance.
The length of 14mm allows for compatibility with standard form factors and facilitates integration into existing system designs.
Field Programmable Gate Arrays (FPGA) LFE5U-12F-6BG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor
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LFE5U-12F-6BG256C Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Top Mark Format Change 20/Dec/2023
PCN Assembly/Origin - Mult Dev 16/Dec/2019
PCN Packaging - All Dev Pkg Mark Chg 12/Nov/2018
Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
LM107H/883
Linear Technology
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
BAV99
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
2N2222A
Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Shanghai Lunsure Electronic Technology
General Semiconductor
MBR0520L-T1
Won-top Electronics
MBR0520L-T1 by Won-top Electronics is a Schottky rectifier diode with 20V peak reverse voltage and 0.5A output current. It is a single-config, surface-mount diode in a small outline package, suitable for applications requiring high-speed switching and low forward voltage drop. Operating temperature range from -65°C to 125°C makes it ideal for various electronic circuits.
MBRS130LT3G
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
1N4148
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
BSS138LT3G
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
LM7805CT/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Max): 125 Cel; Maximum Output Voltage-1: 5.25 V;
SMBJ18CA
Zowie Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
Vishay Telefunken
Changzhou Starsea Electronics
Sangdest Microelectronics (Nanjing)
A3P1000-PQG208
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XC7A12T-L1CSG325I
Xilinx
XC7A12T-L1CSG325I by Xilinx is a Field Programmable Gate Array (FPGA) with 12800 logic cells and 1000 CLBs. It operates at a max clock frequency of 1098 MHz and is commonly used in industrial applications requiring high-speed processing.
EP3C5E144I7N
Intel
EP3C5E144I7N by Intel is a CMOS FPGA with 5136 logic cells, 94 inputs/outputs, and operates at temperatures from -40 to 100°C. It comes in a rectangular package with gull wing terminals, suitable for industrial applications requiring high-performance programmable ICs. With a low profile and fine pitch style, it offers flexibility and reliability in various electronic designs.
LFE5U-45F-6MG285C
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
XC7S100-1FGGA484I
Xilinx XC7S100-1FGGA484I FPGA features 102400 logic cells, 8000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 484 terminals.
XC7A200T-2FBG676I
Xilinx XC7A200T-2FBG676I FPGA features 215360 logic cells, 16825 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
A3P250-VQG100I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC6VLX760-1FFG1760I
Xilinx XC6VLX760-1FFG1760I FPGA features 758784 logic cells, operates at max 1098 MHz clock frequency, and supports CMOS technology. Ideal for industrial applications requiring high-speed processing with a wide range of inputs/outputs and low power consumption.
LFE5UM-25F-6BG381I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
ICE40HX1K-TQ144
Siliconblue Technologies
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
M7A3P1000-FG256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
A3P250-FGG256I
Microchip Technology
A3P250-FGG256I by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 6144 CLBs and 250000 gates. It operates at a max clock frequency of 350 MHz and has a package style of GRID ARRAY. This FPGA is commonly used in industrial applications requiring high-speed processing and programmability.
M1A3P1000-FG256I
10M16DAF256A7G
Intel's 10M16DAF256A7G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a package style of grid array and programmable IC type, it is ideal for automotive applications requiring high performance in a compact form factor.
M2GL025T-1FGG484I
M2GL025T-1FGG484I by Microchip Technology is a 27696 logic cell FPGA with 267 inputs/outputs. Operating at 1.2V, it has a temperature range of -40 to 100°C and uses a grid array package for industrial applications.
A3P1000-FGG484I
Microchip Technology's A3P1000-FGG484I is a CMOS FPGA with 24576 CLBs and 1000000 gates. It operates at a max frequency of 350 MHz, suitable for industrial applications requiring high-speed processing. With a package size of 23x23 mm and MSL level of 3, it offers reliable performance in harsh environments.
EP1C12Q240C8N
EP1C12Q240C8N by Intel is a FPGA with 12060 logic cells, 173 inputs/outputs, and max clock frequency of 275 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities. With a package style of flatpack and fine pitch, it offers versatility in design and integration.
10M02SCM153C8G
Intel 10M02SCM153C8G FPGA features 2000 logic cells, 125 CLBs, and 246 inputs/outputs. With a supply voltage range of 2.85V to 3.15V, it is ideal for applications requiring high-performance programmable ICs in a compact square package with ball terminals.
ICE5LP1K-SG48ITR
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
XC7A100T-1FTG256I
XC7A100T-1FTG256I by Xilinx is a Field Programmable Gate Array (FPGA) with 101,440 logic cells and 7,925 configurable logic blocks (CLBs). It operates at a max clock frequency of 1.098 GHz and is commonly used in industrial applications requiring high-speed processing and programmability.
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LFE5U-25F-6BG256C
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
LFE5U-25F-6BG256I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
LFE5U-25F-8BG381C
LFE5U-25F-6BG381C
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): NOT SPECIFIED;
LFE5U-45F-8BG381I
LFE5U-25F-6BG381I
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
LFE5U-25F-8BG381I
LFE5U-45F-7BG256I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;
LFE5UM-85F-8BG381I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): NOT SPECIFIED; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
LFE5U-25F-6MG285C
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; Peak Reflow Temperature (C): 260;
LFE5U-25F-8BG256I
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 260;
LFE5UM-85F-8BG554I
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
LFE5U-45F-6BG256I
LFE5U-45F-6BG554I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 554; Package Code: FBGA; Package Shape: SQUARE; No. of Outputs: 245;
LFE5UM-85F-8BG554C
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
LFE5U-12F-7BG256I
FIELD PROGRAMMABLE GATE ARRAY; Finishing Of Terminal Used: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
LFE5U-85F-8BG381C
LFE5U-12F-8MG285I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 285; Package Code: LFBGA; Package Shape: SQUARE;
Supply Digital Components
$106.00
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