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10M50DAF484C8G

Intel

10M50DAF484C8G by Intel

Intel's 10M50DAF484C8G FPGA boasts 50000 logic cells, 3125 CLBs, and 500 inputs. Ideal for applications requiring high-speed processing and customization in fields like telecommunications, automotive, and aerospace due to its programmable nature and versatile package style.

Median Price

$191.670

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Arrow

USA . 540 parts In-Stock

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Verical

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Nova Conductors

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Digiode

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AZTECH Wire

Italy . 818 parts In-Stock

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Modulus Dynamics

Lithuania . 270 parts In-Stock

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MARBEL Systems

Belgium . 176 parts In-Stock

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Texas Native Microelectronics

USA . 4,950 parts In-Stock

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Kenton Components

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Aztec Data Supply Inc.

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Ampacity Inc.

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Vigor

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Microchip USA

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Corohmni

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Semicontronic

India . 152 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Continental Prestige Electronics

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Advanced Electronics

New Zealand . 55 parts In-Stock

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Corphita

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Component Stockers USA

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Alle Elektronik GmbH

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Supply Digital

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Qasali Group International

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Overview

Unleash the power of cutting-edge technology with the Intel 10M50DAF484C8G Field Programmable Gate Array. Designed by the trusted manufacturer, Intel, this FPGA boasts 50,000 logic cells and 3,125 CLBs, making it perfect for a wide range of applications. With a maximum supply voltage of 1.25V and a nominal supply voltage of 1.2V, this FPGA offers unparalleled performance and reliability. Whether you're looking to boost the speed and efficiency of your electronics projects or develop innovative solutions in various industries, the Intel 10M50DAF484C8G is the key to unlocking endless possibilities. Upgrade your projects today and experience the difference that Intel quality can make in your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable, ideal for various applications.

No. of Logic Cells: 50000

With a high number of logic cells, this FPGA offers a large capacity for complex digital designs.

Surface Mount: YES

Being surface mountable, this FPGA is easy to integrate into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.25 V

The low maximum supply voltage requirement makes this FPGA energy-efficient and reduces power consumption.

No. of CLBs: 3125

With a significant number of Configurable Logic Blocks, this FPGA offers flexibility in customizing digital logic functions.

No. of Inputs: 500

A high number of inputs allow this FPGA to handle a large amount of external data, suitable for data-intensive applications.

Package Shape: SQUARE

The square package shape provides uniform distribution of components, optimizing space utilization on circuit boards.

Form Of Terminal: BALL

The use of ball terminals ensures secure connections and easy soldering during assembly.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures stable and reliable operation of this FPGA in various voltage conditions.

Power Supplies (V): 1.2

The consistent power supply voltage of 1.2V contributes to the reliability and performance of this FPGA.

No. of Terminals: 484

The high number of terminals provides ample connectivity options, allowing for versatile integration into electronic systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As an FPGA, this product offers customization of digital logic functions, making it adaptable for a wide range of applications.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates easy placement and soldering on circuit boards, streamlining the assembly process.

Minimum Supply Voltage: 1.15 V

With a low minimum supply voltage requirement, this FPGA can operate efficiently even in low voltage conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows this FPGA to withstand elevated temperatures, suitable for harsh environments.

Pitch Of Terminal: 1 mm

The narrow pitch of terminals enables high-density mounting, maximizing space efficiency on circuit boards.

Organization: 3125 CLBS

The organized structure of 3125 Configurable Logic Blocks enhances the efficiency and performance of this FPGA.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable operation even in cold environments, increasing the versatility of this FPGA.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin/silver/copper finishing on terminals provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Position Of Terminal: BOTTOM

The bottom terminal placement simplifies the routing of connections and enables efficient heat dissipation in the system.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this FPGA can withstand moderate exposure to moisture during storage and operation.

Maximum Seated Height: 2 mm

The low maximum seated height of 2mm allows for slim and compact designs when integrating this FPGA into electronic systems.

Width: 23 mm

The compact width of 23mm enables space-efficient placement of this FPGA on circuit boards, ideal for applications with size constraints.

No. of Outputs: 500

A high number of outputs provides ample connectivity options for transmitting processed data, suitable for data-intensive applications.

Length: 23 mm

The moderate length of 23mm ensures a balanced form factor for this FPGA, making it easy to incorporate into various electronic designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M50DAF484C8G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

50000

No. of Inputs:

500

No. of Outputs:

500

No. of CLBs:

3125

Sub-Category:

Field Programmable Gate Arrays

Organization:

3125 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

10M50DAF484C8G Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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