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XC7A12T-L1CSG325I

Xilinx

XC7A12T-L1CSG325I by Xilinx

XC7A12T-L1CSG325I by Xilinx is a Field Programmable Gate Array (FPGA) with 12800 logic cells and 1000 CLBs. It operates at a max clock frequency of 1098 MHz and is commonly used in industrial applications requiring high-speed processing.

Median Price

$52.630

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Nova Conductors

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AZTECH Wire

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Overview

Unlock endless possibilities with the XC7A12T-L1CSG325I by Xilinx. As a leading manufacturer in the field programmable gate array (FPGA) industry, Xilinx delivers exceptional quality and innovation. This powerful FPGA boasts 12,800 logic cells and 1,000 CLBs, offering unparalleled processing capabilities. With a maximum clock frequency of 1,098 MHz and a wide range of inputs and outputs, this versatile device is perfect for applications ranging from telecommunications to automotive systems. Experience the value and benefits that this product brings to your projects, with its low profile, fine pitch package style and high reliability. Transform your designs with the XC7A12T-L1CSG325I and unleash your creativity today.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - The use of plastic/epoxy material makes this FPGA lightweight and durable, making it suitable for various applications.

No. of Logic Cells

12800 - With a high number of logic cells, this FPGA offers exceptional capacity for complex designs and allows for efficient implementation of various algorithms.

Surface Mount

YES - The surface mount capability enables easy and convenient integration of the FPGA onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage

0.98 V - The low maximum supply voltage ensures efficient power consumption and reduces the risk of overheating, resulting in improved reliability and energy efficiency.

No. of CLBs

1000 - The FPGA's 1000 configurable logic blocks (CLBs) provide ample resources for designers to implement custom digital circuits, enabling flexibility and versatility in system designs.

Technology Used

HKMG - The use of high-k metal gate (HKMG) technology enhances the FPGA's performance by reducing power leakage and improving overall speed, making it ideal for demanding applications.

No. of Inputs

150 - With 150 input channels, this FPGA offers extensive connectivity options, enabling seamless integration with multiple external devices and allowing for complex input processing.

Package Shape

SQUARE - The square package shape simplifies board-level routing and facilitates easy placement on PCBs, optimizing space utilization in compact designs.

Form Of Terminal

BALL - The ball terminal form ensures reliable electrical connections and strong mechanical bonding, enhancing the FPGA's overall durability and reducing the risk of signal loss.

Nominal Supply Voltage (V)

0.95 - The low nominal supply voltage contributes to energy efficiency, enabling the FPGA to operate at reduced power consumption levels, which is beneficial in battery-powered devices.

No. of Terminals

325 - With 325 terminals, this FPGA provides ample options for interfacing with external components, maximizing design flexibility, and facilitating seamless integration into diverse system architectures.

Programmable IC Type

FIELD PROGRAMMABLE GATE ARRAY - The programmable nature of this IC type allows for on-the-fly reconfiguration, enabling rapid prototyping, customization, and adaptability to changing design requirements.

Package Style (Meter)

GRID ARRAY, LOW PROFILE, FINE PITCH - The grid array, low profile, and fine pitch package style optimize signal integrity, facilitate efficient heat dissipation, and enable high-density packaging for space-constrained applications.

Minimum Supply Voltage

0.92 V - The low minimum supply voltage ensures stable operation across varying supply conditions and contributes to improved power efficiency, increasing the overall reliability and lifespan of the FPGA.

Maximum Operating Temperature

100 °C - The high maximum operating temperature tolerance enables this FPGA to operate reliably in demanding thermal environments, making it suitable for industrial and automotive applications.

Pitch Of Terminal

0.8 mm - The small pitch size of the terminals allows for high-density interconnections, enabling the FPGA to accommodate more circuitry in a compact form factor and enhancing its overall functionality.

Maximum Combinatorial Delay of a CLB

1.27 ns - The FPGA's low maximum combinatorial delay ensures fast signal propagation and reduces timing uncertainties, enhancing overall system performance in critical applications.

Organization

1000 CLBS - With an organization of 1000 CLBs, this FPGA enables efficient partitioning of designs and efficient utilization of resources, offering flexibility and scalability for complex digital systems.

Minimum Operating Temperature

40 °C - The FPGA's ability to operate reliably at low temperatures makes it suitable for deployment in harsh environments, such as aerospace or outdoor applications.

Finishing Of Terminal Used

TIN SILVER COPPER - The use of tin silver copper finishing on the terminals enhances the FPGA's contact reliability and corrosion resistance, ensuring long-term performance and durability.

Position Of Terminal

BOTTOM - Positioning the terminals on the bottom surface of the FPGA simplifies PCB layout and allows for easier access to other components, facilitating ease of manufacturing and assembly.

Moisture Sensitivity Level (MSL)

3 - The MSL 3 rating indicates the FPGA's resistance to moisture damage during solder reflow and handling, ensuring product integrity and reliability during manufacturing and shipping processes.

Maximum Seated Height

1.5 mm - The low maximum seated height of the FPGA allows for compact and space-efficient designs, making it suitable for applications where size constraints are a consideration.

Width

15 mm - The compact width of the FPGA enables it to be integrated into space-constrained systems, offering flexibility in design and efficient board utilization.

Maximum Clock Frequency

1098 MHz - With a high maximum clock frequency, this FPGA facilitates high-speed data processing, enabling real-time applications with demanding timing requirements.

No. of Outputs

150 - The FPGA's 150 output channels provide ample connectivity options, allowing for seamless integration with various peripheral devices and enabling efficient data transmission.

Maximum Time At Peak Reflow Temperature (s)

30 - The FPGA's ability to withstand prolonged exposure to peak reflow temperatures lasting up to 30 seconds ensures reliable solder connections and reduces the risk of thermal stress-induced failures during assembly.

Peak Reflow Temperature °C

260 - The peak reflow temperature of 260°C ensures efficient and reliable soldering during the manufacturing process, resulting in robust electrical connections and improved overall product quality.

Length

15 mm - The compact length of the FPGA allows for space-saving integration into various hardware designs, enabling versatile deployment and efficient utilization of board real estate.

Grading Of Temperature

INDUSTRIAL - The FPGA's industrial temperature grading signifies its ability to operate reliably within a wide temperature range, making it suitable for demanding industrial environments that may experience extreme temperature variations.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A12T-L1CSG325I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

12800

No. of Inputs:

150

No. of Outputs:

150

No. of CLBs:

1000

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Technology:

HKMG

Organization:

1000 CLBS

Power Characteristics

Nominal Supply Voltage:

0.95

Minimum Supply Voltage:

.92 V

Maximum Supply Voltage:

.98 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA325,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

JESD-609 Code:

e1

Trade Compliance

XC7A12T-L1CSG325I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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