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LCMXO3LF-6900C-5BG324C

Lattice Semiconductor

LCMXO3LF-6900C-5BG324C by Lattice Semiconductor

LCMXO3LF-6900C-5BG324C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, operating b/w 0-85°C. It features a grid array package style, 0.8mm terminal pitch, and TIN SILVER COPPER finishing. Ideal for applications requiring low profile, fine pitch ICs in compact spaces.

Median Price

$23.075

Lifecycle Status

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7

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1k+

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Verical

USA . 12 parts In-Stock

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$21.340

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Chip1Stop

Japan . 126 parts In-Stock

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$22.500

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$17.800

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Mouser Electronics

USA . 109 parts In-Stock

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$23.650

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$19.830

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DigiKey

USA . 71 parts In-Stock

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$26.020

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$20.955

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Nova Conductors

Japan . 10 parts In-Stock

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$26.179

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Vyrian

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Chip Stock

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Semicontronic

India . 429 parts In-Stock

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$18.140

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$17.686

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$17.596

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Microchip USA

USA . 2,787 parts In-Stock

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$21.950

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Netroflash

USA . 2,000 parts In-Stock

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$26.179

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$25.655

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Continental Prestige Electronics

USA . 672 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$27.435

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Aztec Data Supply Inc.

USA . 965 parts In-Stock

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Ampacity Inc.

Singapore . 386 parts In-Stock

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Corohmni

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Argo Parts USA

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Futuretech Components

Singapore . 950 parts In-Stock

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Lucentia Tech

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Overview

Unlock limitless possibilities with the LCMXO3LF-6900C-5BG324C by Lattice Semiconductor. As a leading manufacturer in the field programmable gate arrays (FPGA) category, Lattice Semiconductor exceeds expectations with this high-quality product. With its advanced features and versatile applications, this FPGA offers unmatched value to customers seeking optimal performance and flexibility. Experience the benefits of seamless customization and rapid prototyping, making innovation easier and more efficient. Elevate your projects with the LCMXO3LF-6900C-5BG324C and unleash your creativity today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for various applications.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the PCB, improving overall design efficiency.

Maximum Supply Voltage: 3.465 V

With a high maximum supply voltage, this FPGA can handle a wide range of voltage inputs, enhancing compatibility with different systems.

No. of CLBs: 858

The large number of Configurable Logic Blocks provides flexibility for designing complex circuits and applications.

Package Shape: SQUARE

The square shape allows for efficient use of space on the PCB, maximizing component density in a compact design.

Form Of Terminal: BALL

The ball terminal form ensures secure connections and reliable electrical contact, enhancing overall performance and durability.

Nominal Supply Voltage (V): 2.5

The nominal supply voltage of 2.5V is commonly used in many electronic systems, making this FPGA compatible with a wide range of applications.

No. of Terminals: 324

The ample number of terminals allows for versatile connectivity options, enabling integration into various circuit configurations.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a FPGA provides the flexibility to reconfigure the device for different tasks, making it a versatile choice for prototyping and development.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with a high terminal count, enabling efficient layout and connection of the FPGA on the PCB.

Minimum Supply Voltage: 2.375 V

With a low minimum supply voltage, this FPGA can operate efficiently even in low power applications, saving energy and reducing heat generation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance allows the FPGA to function reliably in harsh environmental conditions, increasing its versatility.

Pitch Of Terminal: 0.8 mm

The small pitch of the terminals enables high-density mounting, optimizing PCB space and facilitating efficient signal routing.

Organization: 858 CLBS

The well-organized CLBs provide a structured layout for designing complex logic circuits, enhancing system performance and reliability.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the FPGA can function effectively in a wide range of temperature environments, enhancing its versatility.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finishing ensures excellent conductivity and oxidation resistance, improving overall signal integrity and reliability.

Position Of Terminal: BOTTOM

The terminal position at the bottom of the package allows for easy PCB mounting and soldering, simplifying the assembly process.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates that the FPGA is relatively resistant to moisture damage, improving its reliability in various operating conditions.

Maximum Seated Height: 1.7 mm

The low seated height of the package enables a compact design, reducing the overall profile of the PCB and improving airflow and cooling.

Width: 15 mm

The moderate width of the FPGA allows for efficient placement on the PCB, optimizing space utilization and facilitating streamlined circuit layout.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reflow of the terminals, improving the reliability of the connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C enables robust soldering of the terminals, ensuring secure electrical connections and long-term reliability.

Length: 15 mm

The moderate length of the FPGA allows for versatile placement options on the PCB, optimizing space usage and enabling flexible circuit configuration.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO3LF-6900C-5BG324C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of CLBs:

858

Organization:

858 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

3.465 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.7 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Trade Compliance

LCMXO3LF-6900C-5BG324C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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