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XC6SLX25-2CSG324I

Xilinx

XC6SLX25-2CSG324I by Xilinx

Xilinx XC6SLX25-2CSG324I FPGA features 24051 logic cells, 1879 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

Median Price

$96.670

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Farnell

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VNN

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Nova Conductors

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AZTECH Wire

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Modulus Dynamics

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Vigor

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Advanced Electronics

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Ampacity Inc.

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Microchip USA

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Netroflash

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

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Overview

Unlock the world of limitless possibilities with the XC6SLX25-2CSG324I by Xilinx. As a leader in Field Programmable Gate Arrays (FPGA), Xilinx delivers top-notch quality and innovation. This versatile FPGA boasts 24051 logic cells and 1879 CLBs, offering unmatched flexibility for a wide range of applications. With a maximum clock frequency of 667 MHz and a low profile package style, this FPGA is ideal for industrial-grade projects that require high performance and reliability. Experience the power and efficiency of Xilinx technology with the XC6SLX25-2CSG324I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA.

No. of Logic Cells: 24051

Provides a large number of logic cells for complex programming and applications.

Maximum Supply Voltage: 1.26 V

Allows for efficient power usage and operation within safe voltage limits.

Technology Used: CMOS

CMOS technology ensures low power consumption and high-speed operation.

Maximum Clock Frequency: 667 MHz

Allows for high-speed processing and operation of the FPGA.

No. of Inputs: 226

Provides ample input channels for connecting external devices or signals.

No. of Outputs: 226

Provides a balanced number of output channels for effective communication and signal processing.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extreme cold temperatures.

Maximum Operating Temperature: 100 °C

Can withstand high temperatures without performance degradation, suitable for industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX25-2CSG324I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

24051

No. of Inputs:

226

No. of Outputs:

226

No. of CLBs:

1879

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

1879 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX25-2CSG324I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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