Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EP1C3T100C8N by Intel is a Field Programmable Gate Array (FPGA) with 2910 logic cells and 291 configurable logic blocks (CLBs). It has a max clock frequency of 275 MHz and is commonly used in applications requiring programmable ICs for various electronic systems.
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PLASTIC/EPOXY - The use of plastic/epoxy material makes the FPGA package lightweight and durable, making it an ideal choice for applications where weight and resilience are important factors.
2910 - With a high number of logic cells, this FPGA is capable of handling complex digital functions and large-scale designs, making it suitable for advanced applications requiring extensive logic processing.
YES - The surface mount capability of this FPGA allows for easy and efficient PCB assembly, reducing production time and effort, making it a convenient choice for mass manufacturing.
1.575 V - The high maximum supply voltage of this FPGA enables it to work with a wide range of voltage levels, providing flexibility in circuit design and power management options.
291 - The significant number of Configurable Logic Blocks (CLBs) ensures that this FPGA is capable of implementing a wide range of digital functions, providing versatility and flexibility in designs.
65 - The ample number of input pins allows for the integration of multiple input signals, making this FPGA suitable for applications requiring extensive input/output capabilities.
SQUARE - The square package shape offers efficient use of board space and easy alignment during assembly, maximizing the utilization of PCB real estate for compact designs.
GULL WING - The gull wing terminal style simplifies the soldering process during PCB assembly, enhancing reliability and ease of manufacturing, making it a favorable choice for large-scale production.
1.5 - With a standard nominal supply voltage, this FPGA is compatible with common power supply configurations, ensuring ease of integration into various electronic systems.
1.5,1.5/3.3 - The availability of multiple power supply options enables flexibility in designing power management schemes and adapting to different voltage level requirements in the system.
100 - The abundant number of terminals allows for versatile connectivity options and offers flexibility in interfacing with peripheral devices, making it versatile and suitable for diverse applications.
FIELD PROGRAMMABLE GATE ARRAY - Being a field-programmable gate array, this IC allows for reprogramming of the logic functions, facilitating customization and adaptability to changing requirements.
FLATPACK, THIN PROFILE, FINE PITCH - The combination of a flatpack, thin profile, and fine pitch package style offers a space-saving solution, enabling compact and high-density designs that are advantageous in applications where size is a constraint.
1.425 V - The low minimum supply voltage allows for efficient power consumption and operation in systems with stringent power limitations, enhancing energy efficiency and extending battery life.
85 °C - The high maximum operating temperature ensures reliable performance and robustness in demanding environments with elevated temperatures, making it suitable for industrial and automotive applications.
0.5 mm - The small pitch size of the terminals allows for high-density pin configurations, maximizing the number of I/O interfaces within a limited space, which is beneficial in applications requiring extensive connectivity.
291 CLBS - The organization of 291 Configurable Logic Blocks (CLBs) allows for efficient utilization of logic resources, providing a balance between flexibility and complexity in designing digital circuits.
0 °C - With a low minimum operating temperature, this FPGA can function reliably in cold environments, making it suitable for applications in various temperature conditions.
Matte Tin (Sn) - annealed - The use of matte tin (Sn) with annealed finishing on the terminals provides excellent solderability and prevents corrosion, ensuring robust and reliable connections during PCB assembly.
QUAD - The quad terminal position simplifies the PCB layout and enhances signal routing efficiency, optimizing PCB design and facilitating easy integration with other components, making it a suitable choice for complex circuitries.
3 - With an MSL level of 3, this FPGA can withstand standard moisture exposure during storage and assembly processes, ensuring product reliability and reducing the risk of manufacturing defects.
1.2 mm - The compact maximum seated height of this FPGA allows for low-profile PCB designs, enabling more flexible board stacking and compact device arrangements, suitable for space-constrained applications.
14 mm - The compact width dimension of this FPGA ensures efficient utilization of board space, allowing for compact designs and high-density integration in electronic systems.
275 MHz - With a high maximum clock frequency, this FPGA can process data and perform operations at a fast rate, making it suitable for applications requiring real-time processing and high-speed communication.
65 - The generous number of output pins allows for a wide range of output signal configurations, facilitating the integration of various peripherals and enabling versatile connectivity options.
30 - This FPGA can withstand the peak reflow temperature for a maximum period of 30 seconds during the soldering process, ensuring reliable and durable assembly during PCB manufacturing.
260 - The high peak reflow temperature of 260°C allows for efficient and reliable soldering during the assembly process, ensuring strong and secure connections within the PCB assembly.
14 mm - The compact length dimension of this FPGA enables space-saving designs and efficient use of board space, making it suitable for applications with limited physical dimensions.
Field Programmable Gate Arrays (FPGA) EP1C3T100C8N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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EP1C3T100C8N Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
2N7002
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMMBT3904LT1G
Onsemi
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
LL4148
Panjit International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
STM32H743BIT6
STMicroelectronics
STM32H743BIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 208 terminals, and 1085440 bytes of RAM. It features 2 DAC channels, 32 ADC channels, and operates at a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity.
BAV99
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
1N4148WT
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Won-top Electronics
Eic Semiconductor
LM107H/883C
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Package Equivalence Code: CAN8,.2;
BAV99LT1G
BAV99LT1G by Onsemi is a series connected diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.006 us and can handle up to 100V repetitive peak reverse voltage. Ideal for rectification applications, this diode operates b/w -65°C to 150°C temperature range.
SS14
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Itt Semiconductor
0462-201-16141
TE Connectivity
TE Connectivity's 0462-201-16141 is a CRIMP terminal with MACHINED contact design. It operates b/w -55 to 125 °C, suitable for wire gauges from 20 to 16 AWG. With a rated current of 13A, it is ideal for applications requiring FEMALE ROUND PIN-SOCKET contacts.
DS18B20+
Analog Devices
DS18B20+ by Analog Devices is a 12-bit temperature sensor with 3.3/5V supply, -55 to 125°C range, and ±0.50°C accuracy. It features a 1-Wire interface for digital output and is commonly used in applications requiring precise temperature monitoring in various industries.
EU2B-YS303C
Idec
ROTARY SWITCH;
EP3C10E144I7N
Intel
Intel's EP3C10E144I7N FPGA boasts 10320 logic cells, 94 inputs/outputs, and a clock frequency of 472.5 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a max operating temperature of 100°C.
EP3C120F780I7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: RECTANGULAR;
XC7A15T-2CSG325I
Xilinx
Xilinx XC7A15T-2CSG325I FPGA features 16640 logic cells, 1300 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing with a wide operating temperature range from -40 to 100°C. Package style is grid array with low profile and fine pitch terminals.
LFD2NX-40-7BG256C
Lattice Semiconductor
Lattice Semiconductor's LFD2NX-40-7BG256C FPGA features 39000 logic cells, FDSOI technology, and 9750 CLBs. Ideal for applications requiring high performance with 111 inputs/outputs, low profile grid array package style, and operating temperatures from 0 to 85°C.
M1A3P1000-FG256I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
LFE5U-25F-7BG256I
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
M7A3P1000-FG256I
Actel
10M08SCE144I7G
The Intel 10M08SCE144I7G is a Field Programmable Gate Array with 8000 logic cells and 500 CLBs. It operates at a max supply voltage of 3.15V, suitable for industrial applications requiring high-performance FPGA solutions in compact form factors. The package style includes flatpack, heat sink/slug, low profile, and fine pitch options for versatile integration.
5CEBA2F23C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
LCMXO2-256HC-4SG48C
LCMXO2-256HC-4SG48C by Lattice Semiconductor is a 256 Logic Cells FPGA with 32 CLBs and 40 Inputs/Outputs. It operates at a max voltage of 3.6V, suitable for applications requiring high-speed processing in compact electronic devices. Ideal for projects needing efficient programmable ICs in tight spaces with temp range of 0-85°C.
LCMXO2-2000HC-4BG256C
LCMXO2-2000HC-4BG256C by Lattice Semiconductor is a FPGA with 2112 logic cells, 206 inputs/outputs, and max clock frequency of 133 MHz. It operates at 2.375-3.465 V, suitable for applications requiring high-speed processing in industrial automation and telecommunications sectors.
10CL025YU256I7G
Intel 10CL025YU256I7G is a FPGA with 1539 CLBs, operating voltage of 1.15-1.25V, and temp range -40 to 100°C. Ideal for industrial applications requiring low profile, fine pitch grid array package style with moisture sensitivity level of 3.
EP4CE6E22I7N
EP4CE6E22I7N by Intel is a FPGA with 6272 logic cells, 392 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
5CEFA7F23I7N
The Altera 5CEFA7F23I7N is a field programmable gate array (FPGA) with 149500 logic cells. It has a maximum supply voltage of 1.13V and uses CMOS technology. The package style is a grid array with 484 terminals, and it has 240 inputs and outputs. This FPGA is suitable for applications requiring high-level customization and versatility.
EP1C3T144I7N
EP1C3T144I7N by Intel is a Field Programmable Gate Array (FPGA) with 2910 logic cells and 291 CLBs. It operates at a max clock frequency of 320 MHz, making it suitable for industrial applications requiring high-speed processing. With a package style of flatpack and low profile, this FPGA offers versatility in design while maintaining a compact form factor.
10M08SCU169I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: .8 mm;
M2GL005-VF256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
XC6SLX16-2CSG225I
Xilinx XC6SLX16-2CSG225I FPGA features 14579 logic cells, 1139 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.
10M25SAE144C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
10M02SCE144A7G
Intel's 10M02SCE144A7G FPGA features 2000 logic cells, 125 CLBs, and 246 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for automotive applications requiring high performance in a compact package. The device operates b/w -40 to 125°C and offers versatility with its field programmable gate array technology.
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EP1C6Q240C6N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;
EP1C6Q240C6N by Intel is a Field Programmable Gate Array (FPGA) with 5980 logic cells and 598 CLBs. It operates at a max clock frequency of 405 MHz, making it suitable for high-speed applications in industries like telecommunications and signal processing. With a package style of flatpack and fine pitch, this FPGA offers versatility in design while maintaining compact dimensions.
EP1C3T144C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EP1C3T144C8N by Intel is a Field Programmable Gate Array (FPGA) with 2910 logic cells, 291 CLBs, and a max clock frequency of 275 MHz. It is ideal for applications requiring high-speed processing and customizable logic circuits in compact electronic designs.
EP1C6Q240C8N
EP1C6Q240C8N by Intel is a Field Programmable Gate Array (FPGA) with 5980 logic cells, 598 CLBs, and a max clock frequency of 275 MHz. It is ideal for applications requiring high-speed processing and customization in electronics design, offering versatility with its 185 inputs and outputs. With a compact square package style and low power supply requirements, it suits various embedded systems projects.
EP1C12Q240C8N
EP1C12Q240C8N by Intel is a FPGA with 12060 logic cells, 173 inputs/outputs, and max clock frequency of 275 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities. With a package style of flatpack and fine pitch, it offers versatility in design and integration.
EP1C12Q240C8N by Altera is a field programmable gate array (FPGA) with 12060 logic cells, 173 inputs/outputs, and maximum clock frequency of 275 MHz. It operates at a nominal supply voltage of 1.5V and is suitable for various applications requiring programmable ICs.
EP1C3T100C8N
EP1C3T100C8N by Altera is a Field Programmable Gate Array (FPGA) with 2910 logic cells, 291 CLBs, 65 inputs/outputs, and a maximum clock frequency of 275 MHz. It is suitable for applications requiring programmable ICs in various industries.
EP1C4F324C8N
EP1C4F324C8N by Intel is a 4000 logic cell FPGA with 400 CLBs and 249 inputs/outputs. Operating at a max frequency of 275 MHz, it's ideal for applications requiring high-speed processing such as signal processing, networking, and industrial automation. With a compact square package style and low power consumption at 1.5V, it offers versatile programmability for various electronic designs.
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
The Altera EP1C3T144I7N is a field programmable gate array (FPGA) with 2910 logic cells and 291 configurable logic blocks (CLBs). It has a maximum supply voltage of 1.575V and a nominal supply voltage of 1.5V. This FPGA is surface mountable and has a package shape of square. It operates in a temperature range of -40°C to 100°C and has a maximum clock frequency of 320MHz. With 104 inputs and outputs, it offers flexibility for various applications.
EP1C6T144I7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EP1C3T100I7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
EP1C12Q240I7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;
EP1C12Q240I7N by Intel is a Field Programmable Gate Array (FPGA) with 12060 logic cells and 1206 CLBs. It operates at a max clock frequency of 320 MHz, making it suitable for industrial applications requiring high-speed processing. With a package style of flatpack and fine pitch, this FPGA offers versatility in design while maintaining a compact form factor.
EP1C3T100I6
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