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EP1C4F324C8N

Intel

EP1C4F324C8N by Intel

EP1C4F324C8N by Intel is a 4000 logic cell FPGA with 400 CLBs and 249 inputs/outputs. Operating at a max frequency of 275 MHz, it's ideal for applications requiring high-speed processing such as signal processing, networking, and industrial automation. With a compact square package style and low power consumption at 1.5V, it offers versatile programmability for various electronic designs.

Median Price

$42.000

Lifecycle Status

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30

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1k+

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Verical

USA . 7,211 parts In-Stock

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$42.000

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Arrow

USA . 7,211 parts In-Stock

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$14.740

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$14.000

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$14.000

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Maritex

Poland . 91 parts In-Stock

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Nova Conductors

Japan . 35 parts In-Stock

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Digiode

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Flip Electronics

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J & M Industries LLC

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Semtec, LLC

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Atlantic Semiconductor

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Rebound Electronics

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Bristol Electronics

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Corohmni

South Africa . 6 parts In-Stock

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Advanced Electronics

New Zealand . 35 parts In-Stock

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Component Stockers USA

USA . 9,950 parts In-Stock

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Microchip USA

USA . 5,803 parts In-Stock

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Ampacity Inc.

Singapore . 7,831 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 7,607 parts In-Stock

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Corphita

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Aztec Data Supply Inc.

USA . 217 parts In-Stock

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Modulus Dynamics

Lithuania . 439 parts In-Stock

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Texas Native Microelectronics

USA . 3,957 parts In-Stock

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Kenton Components

USA . 440 parts In-Stock

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$212.657

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$204.151

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$197.771

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Qasali Group International

UK . 100 parts In-Stock

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Perfect Parts

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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Kepictronics

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Authorized Procurement Solutions

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Supply Digital

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Netroflash

USA . 2,000 parts In-Stock

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GreenTree Electronics

Israel . 1,415 parts In-Stock

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Vigor

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Metaverse IC Inc.

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Lucentia Tech

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Computer Components Inc. - USA

USA . 134 parts In-Stock

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MARBEL Systems

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Cyclops Electronics Ltd (Excess)

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ChipstoGo Electronic ltd

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Overview

Unlock the power of cutting-edge technology with the EP1C4F324C8N by Intel. This top-of-the-line Field Programmable Gate Array boasts unrivaled quality and performance, making it a game-changer in the industry. With countless applications in various fields, this FPGA offers unmatched flexibility and customization for your specific needs. Experience the value and benefits that only Intel can deliver with this innovative product, revolutionizing the way you approach your projects and achieving outstanding results. Elevate your work to the next level with the EP1C4F324C8N today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FPGA, ensuring it can withstand various environmental conditions.

No. of Logic Cells: 4000

Having a high number of logic cells allows for complex programming and customization, making this FPGA suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability makes it easy to integrate this FPGA onto circuit boards, saving space and simplifying the overall design.

Maximum Supply Voltage: 1.575 V

The ability to operate at a relatively low supply voltage helps to reduce power consumption and heat dissipation, making it energy-efficient.

No. of CLBs: 400

With a high number of Configurable Logic Blocks, this FPGA offers flexibility in implementing a wide range of logic functions to meet specific application requirements.

No. of Inputs: 249

A large number of input pins allow for interfacing with multiple external devices, enhancing the versatility and connectivity of the FPGA.

Package Shape: SQUARE

The square shape provides a compact form factor, maximizing space efficiency when integrating the FPGA into electronic systems.

Nominal Supply Voltage (V): 1.5

Stable supply voltage ensures reliable performance of the FPGA, contributing to the overall system stability.

Power Supplies (V): 1.5,1.5/3.3

Multiple power supply options allow for compatibility with different voltage requirements in various applications, making it versatile.

No. of Terminals: 324

Sufficient terminal connections provide ample connectivity for interfacing with other components, enabling seamless integration into the system design.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array gives users the ability to reprogram the FPGA for different functions, making it adaptable for evolving needs.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates easy soldering and mounting onto circuit boards, ensuring a reliable connection for optimal performance.

Minimum Supply Voltage: 1.425 V

Low minimum supply voltage allows for operation in power-saving modes, conserving energy and extending battery life in mobile applications.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this FPGA can withstand elevated temperatures without compromising performance, suitable for industrial applications.

Pitch Of Terminal: 1 mm

The small pitch distance between terminals enables high-density packaging, enabling more functionality in a limited space.

Organization: 400 CLBS

The organizational structure of 400 Configurable Logic Blocks allows for efficient and logical implementation of complex logic functions, enhancing performance.

Minimum Operating Temperature: 0 °C

The ability to operate at a low temperature ensures reliable performance in cold environments, making it suitable for a wide range of applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of multiple finishing materials on terminals ensures good conductivity and corrosion resistance, enhancing the reliability and longevity of the FPGA.

Position Of Terminal: BOTTOM

Bottom terminal placement simplifies the routing of connections and allows for more efficient board layout when integrating the FPGA into a system.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that this FPGA has moderate sensitivity to moisture, making it suitable for use in environments with controlled humidity levels.

Maximum Seated Height: 3.5 mm

The low seated height of the FPGA allows for a slim profile when mounted on a PCB, contributing to space-saving and improved airflow for cooling.

Width: 19 mm

Compact width dimensions make this FPGA suitable for applications where space is limited, enabling efficient use of board real estate.

Maximum Clock Frequency: 275 MHz

High maximum clock frequency allows for fast processing of data and signals, making this FPGA suitable for high-speed applications that require quick response times.

No. of Outputs: 249

A large number of output pins enable the FPGA to drive multiple external devices, facilitating complex system integration and signal processing capabilities.

Length: 19 mm

With a compact length dimension, this FPGA offers a space-efficient design for applications where board space is limited, providing flexibility in system integration.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP1C4F324C8N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

4000

No. of Inputs:

249

No. of Outputs:

249

No. of CLBs:

400

Maximum Clock Frequency:

275 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

400 CLBS

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Power Supplies:

1.5,1.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA324,18X18,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP1C4F324C8N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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