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XC6SLX16-2CSG324C

Xilinx

XC6SLX16-2CSG324C by Xilinx

Xilinx XC6SLX16-2CSG324C FPGA features 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. Ideal for applications requiring a max clock frequency of 667 MHz, such as high-speed data processing in telecommunications or industrial automation systems. Operating temperature range from 0 to 85°C with a low profile grid array package style.

Median Price

$62.760

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DigiKey

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Overview

Unlock the power of cutting-edge technology with the XC6SLX16-2CSG324C by Xilinx, a leading manufacturer in the field programmable gate arrays (FPGA) industry. This high-quality product boasts unrivaled performance and versatility, making it ideal for a wide range of applications. From telecommunications to automotive electronics, this FPGA offers customers the value, benefits, and advantages they need to stay ahead of the competition. Experience innovation like never before with Xilinx's XC6SLX16-2CSG324C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the FPGA lightweight and durable, ideal for portable and rugged applications.

No. of Logic Cells: 14579

With a high number of logic cells, this FPGA offers ample resources for complex logic designs and processing capabilities.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly and compact design integration.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage contributes to power efficiency and reduced heat dissipation.

No. of CLBs: 1139

A high number of Configurable Logic Blocks (CLBs) provide flexibility and versatility in implementing various logic functions.

Technology Used: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, enhancing overall performance.

No. of Inputs: 232

Having a large number of inputs allows for more data to be processed simultaneously, improving overall system efficiency.

Package Shape: SQUARE

The square package shape simplifies PCB layout and alignment, making assembly easier.

Form Of Terminal: BALL

Ball terminals provide reliable electrical connections and are suitable for fine-pitch applications, ensuring optimal performance.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2 V is commonly used in modern electronic systems, ensuring compatibility and ease of integration.

Power Supplies (V): 1.2, 2.5/3.3

Support for multiple power supply voltages gives flexibility in system design and compatibility with various components.

No. of Terminals: 324

A high number of terminals enable connectivity to other components and peripherals, enhancing the versatility of the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for reconfigurability and adaptability, making it suitable for a wide range of applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style with a low profile and fine pitch enables high-density mounting and compact system designs.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures reliable operation at lower power levels, contributing to energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable operation in harsh environmental conditions.

Pitch Of Terminal: 0.8 mm

The small pitch of terminals enables high-density interconnection and saves space on the PCB.

Maximum Combinatorial Delay of a CLB: 0.26 ns

The low combinatorial delay of a Configurable Logic Block (CLB) results in high-speed logic processing and efficient performance.

Organization: 1139 CLBS

The organized structure with 1139 Configurable Logic Blocks (CLBs) offers a structured framework for implementing complex logic functions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finish on terminals provides corrosion resistance and reliable electrical connections.

Position Of Terminal: BOTTOM

Bottom terminal positioning simplifies PCB assembly and ensures proper alignment during installation.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level 3 indicates that the FPGA can withstand moderate exposure to moisture during storage and assembly.

Maximum Seated Height: 1.5 mm

The low maximum seated height allows for compact system integration without compromising on performance or functionality.

Width: 15 mm

The 15 mm width offers a balance between compact size and ease of handling during installation and assembly.

Maximum Clock Frequency: 667 MHz

The high maximum clock frequency enables high-speed operation and real-time processing capabilities for demanding applications.

No. of Outputs: 232

A large number of outputs provide flexibility in routing signals and data to external components, enhancing system connectivity.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly without damaging the FPGA.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering and ensures proper bonding of components during assembly.

Length: 15 mm

The 15 mm length offers a compact form factor suitable for space-constrained applications and efficient PCB layout.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX16-2CSG324C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

14579

No. of Inputs:

232

No. of Outputs:

232

No. of CLBs:

1139

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

1139 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX16-2CSG324C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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