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M2S090-FCSG325

Microchip Technology

M2S090-FCSG325 by Microchip Technology

Microchip Technology's M2S090-FCSG325 FPGA offers 86184 logic cells, 180 inputs/outputs, and operates at a voltage range of 1.14V to 1.26V. Ideal for applications requiring high-speed processing and programmable logic in compact form factors with a grid array package style.

Median Price

$131.840

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 32 parts In-Stock

1+ parts

$131.840

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32

$131.840

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Vyrian

USA . 419 parts In-Stock

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419

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Digiode

USA . 63 parts In-Stock

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63

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,625 parts In-Stock

1+ parts

$7.000

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1,625

$7.000

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AZTECH Wire

Italy . 681 parts In-Stock

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$9.226

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681

$9.226

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Semicontronic

India . 517 parts In-Stock

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$17.000

100+ parts

$16.575

1k+ parts

$16.490

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517

$17.000

$16.575

$16.490

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Corohmni

South Africa . 738 parts In-Stock

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$84.782

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738

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Continental Prestige Electronics

USA . 1,780 parts In-Stock

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$131.050

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$128.429

1,780

$131.050

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$128.429

Advanced Electronics

New Zealand . 1,173 parts In-Stock

1+ parts

$155.295

100+ parts

$147.530

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$147.530

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1,173

$155.295

$147.530

$147.530

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Aztec Data Supply Inc.

USA . 2,298 parts In-Stock

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$168.090

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2,298

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QUARKTWIN TECHNOLOGY LTD

USA . 15,062 parts In-Stock

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RGB Technical Solutions

Ukraine . 4,611 parts In-Stock

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4,611

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$129.203

1k+ parts

$125.248

10k+ parts

$122.611

2,000

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$129.203

$125.248

$122.611

Argo Parts USA

USA . 1,438 parts In-Stock

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1,438

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

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500

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Corphita

USA . 166 parts In-Stock

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166

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Overview

Unlock limitless possibilities with the M2S090-FCSG325 by Microchip Technology. As a leading manufacturer in the field programmable gate arrays (FPGA) category, this product offers unparalleled quality and performance. With 86184 logic cells and 180 inputs/outputs, this FPGA is perfect for a wide range of applications. From telecommunications to automotive, this versatile device provides flexibility and reliability. Experience the value and benefits of Microchip Technology's innovative solutions with the M2S090-FCSG325.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product suitable for a wide range of applications.

No. of Logic Cells: 86184

With a high number of logic cells, this FPGA offers significant processing power and flexibility for complex applications.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, simplifying the assembly process.

Maximum Supply Voltage: 1.26 V

A higher maximum supply voltage allows for greater flexibility in power supply design and compatibility.

Nominal Supply Voltage (V): 1.2

This nominal supply voltage is commonly used in many electronic systems, ensuring compatibility and ease of integration.

Minimum Operating Temperature: 0 °C

The wide operating temperature range from 0°C ensures reliable performance in a variety of environments.

Pitch Of Terminal: 0.5 mm

The small pitch of terminals allows for high-density mounting on circuit boards, saving valuable space.

Maximum Seated Height: 1.16 mm

The low profile and seated height make this FPGA suitable for compact designs where space is limited.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates that the product can withstand moderate exposure to moisture during storage and handling.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M2S090-FCSG325 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

86184

No. of Inputs:

180

No. of Outputs:

180

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

40 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

13.5 mm

Width:

11 mm

Maximum Seated Height:

1.16 mm

Package Equivalence Code:

BGA325,21X21,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.5 mm

No. of Terminals:

325

Standards

JESD-30 Code:

R-PBGA-B325

Trade Compliance

M2S090-FCSG325 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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