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LCMXO3LF-6900C-5BG400C

Lattice Semiconductor

LCMXO3LF-6900C-5BG400C by Lattice Semiconductor

LCMXO3LF-6900C-5BG400C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, 0.8mm terminal pitch, and 400 terminals. Ideal for applications requiring low profile, fine pitch grid arrays in electronics operating b/w 0-85°C.

Median Price

$24.085

Lifecycle Status

Suppliers In-Stock

10

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1k+

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Verical

USA . 90 parts In-Stock

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Arrow

USA . 90 parts In-Stock

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$24.070

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Chip1Stop

Japan . 90 parts In-Stock

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Mouser Electronics

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Nova Conductors

Japan . 870 parts In-Stock

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IBS Electronics

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Chip Stock

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Component Sense

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AZTECH Wire

Italy . 345 parts In-Stock

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Aranea Global

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Continental Prestige Electronics

USA . 2,626 parts In-Stock

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Ampacity Inc.

Singapore . 95 parts In-Stock

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Semicontronic

India . 95 parts In-Stock

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Microchip USA

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Aztec Data Supply Inc.

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Corohmni

South Africa . 953 parts In-Stock

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Advanced Electronics

New Zealand . 929 parts In-Stock

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Argo Parts USA

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Futuretech Components

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Lucentia Tech

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Overview

Elevate your projects with the LCMXO3LF-6900C-5BG400C by Lattice Semiconductor, a top-tier manufacturer in the field of Field Programmable Gate Arrays (FPGA). With its cutting-edge technology and high-quality materials, this FPGA offers unparalleled performance and versatility. From automotive to industrial applications, this innovative product ensures optimal functionality and reliability. Trust Lattice Semiconductor to deliver the best-in-class solutions for your programming needs, providing exceptional value and benefits that set you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making the FPGA suitable for a variety of applications.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into existing systems.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage ensures stable performance and compatibility with various power sources.

No. of CLBs: 858

The large number of Configurable Logic Blocks (CLBs) provides ample resources for complex digital designs.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on a circuit board.

Form Of Terminal: BALL

The ball terminal design simplifies the soldering process and enhances connectivity.

Nominal Supply Voltage (V): 2.5

The nominal supply voltage of 2.5V ensures compatibility with standard power systems.

No. of Terminals: 400

The high number of terminals allows for versatile connectivity options and routing flexibility.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

The FPGA's programmable nature enables customization and reconfiguration for different applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch design make the package suitable for compact, high-density applications.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage ensures energy efficiency and reliable operation at lower power levels.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for use in a wide range of environmental conditions.

Pitch Of Terminal: 0.8 mm

The small terminal pitch allows for high-density routing and space-saving on the PCB.

Organization: 858 CLBS

The organized layout of 858 CLBs simplifies design implementation and optimization.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliability and performance in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing enhances conductivity and reliability of the terminals.

Position Of Terminal: BOTTOM

The bottom terminal position facilitates easy soldering and maintenance of the FPGA on the PCB.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates the level of protection against moisture, ensuring long-term reliability.

Maximum Seated Height: 1.7 mm

The low maximum seated height allows for slim, compact designs and easy integration into space-constrained systems.

Width: 17 mm

The 17mm width provides a compact form factor, ideal for applications with limited space.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering without damaging the FPGA.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables secure soldering and maintenance processes.

Length: 17 mm

The 17mm length offers a balanced form factor, suitable for various PCB layouts and designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO3LF-6900C-5BG400C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of CLBs:

858

Organization:

858 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

3.465 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.7 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

400

Standards

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Trade Compliance

LCMXO3LF-6900C-5BG400C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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