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10M40DAF256I7G

Intel

10M40DAF256I7G by Intel

Intel's 10M40DAF256I7G FPGA features 40000 logic cells, 2500 CLBs, and 500 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a max operating temperature of 100°C and a min of -40°C. The package style is grid array with a square shape and ball terminals.

Median Price

$136.618

Lifecycle Status

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6

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Nova Conductors

Japan . 10 parts In-Stock

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Digiode

USA . 586 parts In-Stock

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Vyrian

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VNN

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Chip Stock

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AZTECH Wire

Italy . 810 parts In-Stock

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$7.474

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Advanced Electronics

New Zealand . 81 parts In-Stock

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Vigor

Singapore . 546 parts In-Stock

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$93.070

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Corohmni

South Africa . 565 parts In-Stock

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Semicontronic

India . 118 parts In-Stock

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$128.060

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$124.858

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Texas Native Microelectronics

USA . 4,456 parts In-Stock

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$128.818

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$123.665

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$119.801

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$113.360

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Continental Prestige Electronics

USA . 2,018 parts In-Stock

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Microchip USA

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Corphita

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Modulus Dynamics

Lithuania . 686 parts In-Stock

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Ampacity Inc.

Singapore . 67 parts In-Stock

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Qasali Group International

UK . 10,566 parts In-Stock

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Supply Digital

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Argo Parts USA

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Authorized Procurement Solutions

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MARBEL Systems

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Netroflash

USA . 500 parts In-Stock

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Futuretech Components

Singapore . 310 parts In-Stock

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Kenton Components

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Lucentia Tech

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Glotronic Ltd.

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Overview

Unlock limitless possibilities with the Intel 10M40DAF256I7G Field Programmable Gate Array. Crafted by the renowned manufacturer Intel, this FPGA boasts 40000 logic cells and 2500 CLBs, making it a powerhouse for any application. From aerospace to telecommunications, this versatile device offers unparalleled flexibility and efficiency. With a maximum supply voltage of 1.25V and a wide temperature range, the Intel 10M40DAF256I7G ensures reliable performance in any environment. Elevate your projects with this cutting-edge FPGA and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material allows for a lightweight yet durable package, making it suitable for a wide range of applications.

No. of Logic Cells: 40000

With a large number of logic cells, this FPGA provides ample flexibility and functionality for complex designs.

Surface Mount: YES

The surface mount feature makes it easy to integrate this FPGA onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.25 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation.

No. of CLBs: 2500

The 2500 Configurable Logic Blocks (CLBs) offer a high level of customization and versatility for design implementation.

No. of Inputs: 500

With 500 inputs, this FPGA can accommodate a large number of external signals and data inputs.

Package Shape: SQUARE

The square package shape provides uniformity in design and facilitates easier placement on PCBs.

Form Of Terminal: BALL

The ball form of terminal allows for reliable connections and easy soldering during assembly.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V provides a stable operating voltage for the FPGA.

Power Supplies (V): 1.2

Having a single power supply voltage simplifies the power management and reduces design complexity.

No. of Terminals: 256

The 256 terminals offer sufficient connectivity options for interfacing with external components and devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this IC type allows for programmability and reconfigurability as per application requirements.

Package Style (Meter): GRID ARRAY

The grid array package style provides a systematic arrangement of terminals for easy connection and routing.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions and extended use.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals allows for fine-pitch mounting and ensures high density interconnection capabilities.

Organization: 2500 CLBS

The organization of 2500 CLBs enables efficient logic utilization and design optimization.

Minimum Operating Temperature: -40 °C

The FPGA can operate in extreme cold temperatures down to -40°C, making it suitable for a variety of environments.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin, silver, and copper finishing on terminals ensures good conductivity and reliability of connections.

Position Of Terminal: BOTTOM

The bottom position of terminals facilitates easy board mounting and integration into the overall system.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, this FPGA can withstand moderate exposure to moisture during handling and storage.

Maximum Seated Height: 1.55 mm

The low seated height of 1.55mm enables compact PCB design and allows for thinner form factors in end products.

Width: 17 mm

The 17mm width makes this FPGA suitable for applications where space is a constraint, without compromising on performance.

No. of Outputs: 500

With 500 outputs, this FPGA can drive a variety of external devices and interfaces, making it versatile in output capability.

Length: 17 mm

The 17mm length offers a square form factor, ensuring uniformity in placement and compatibility with standard board dimensions.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in demanding industrial environments with varying temperature conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M40DAF256I7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

40000

No. of Inputs:

500

No. of Outputs:

500

No. of CLBs:

2500

Sub-Category:

Field Programmable Gate Arrays

Organization:

2500 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

10M40DAF256I7G Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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