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10M08DCF256I7G

Intel

10M08DCF256I7G by Intel

The Intel 10M08DCF256I7G is an FPGA with 8000 logic cells, 500 CLBs, and 250 inputs/outputs. It operates at a voltage range of 1.15V to 1.25V and can withstand temperatures from -40°C to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

Median Price

$47.031

Lifecycle Status

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9

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DigiKey

USA . 53 parts In-Stock

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$39.890

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Verical

USA . 60 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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$29.073

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Digiode

USA . 831 parts In-Stock

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Vyrian

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Chip Stock

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VNN

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Cyclops Electronics Ltd

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Prism Electronics

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AZTECH Wire

Italy . 812 parts In-Stock

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$9.458

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MARBEL Systems

Belgium . 6,382 parts In-Stock

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$22.545

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Corohmni

South Africa . 546 parts In-Stock

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$25.564

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Texas Native Microelectronics

USA . 8,409 parts In-Stock

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$25.914

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$26.331

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$25.014

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Continental Prestige Electronics

USA . 5,765 parts In-Stock

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$29.073

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$28.492

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One Stop Electronics

USA . 112 parts In-Stock

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$30.820

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Ampacity Inc.

Singapore . 112 parts In-Stock

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Semicontronic

India . 22 parts In-Stock

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$30.050

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$29.895

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Kenton Components

USA . 823 parts In-Stock

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$31.097

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Corphita

USA . 891 parts In-Stock

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Microchip USA

USA . 1,459 parts In-Stock

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$37.780

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$36.780

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$36.280

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$35.780

Modulus Dynamics

Lithuania . 994 parts In-Stock

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$50.714

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$50.714

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Vigor

Singapore . 55 parts In-Stock

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Qasali Group International

UK . 2,859 parts In-Stock

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Argo Parts USA

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Authorized Procurement Solutions

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S.R.D Solutions

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A-Z Elektronik GmbH

Germany . 2,795 parts In-Stock

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Lucentia Tech

USA . 950 parts In-Stock

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GreenTree Electronics

Israel . 540 parts In-Stock

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Supply Digital

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Futuretech Components

Singapore . 300 parts In-Stock

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Lixinc

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Glotronic Ltd.

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Overview

Unleash endless possibilities with the Intel 10M08DCF256I7G FPGA! Crafted by the renowned manufacturer Intel, this cutting-edge Field Programmable Gate Array boasts 8000 logic cells and 500 CLBs, offering unparalleled performance for a variety of applications. From industrial automation to consumer electronics, this FPGA delivers flexibility and efficiency like never before. Embrace innovation, reliability, and value with the Intel 10M08DCF256I7G FPGA - your gateway to limitless creativity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring reliability and affordability.

No. of Logic Cells: 8000

High number of logic cells allow for complex designs and functionality to be implemented.

Surface Mount: YES

Ease of installation and soldering on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 1.25 V

Efficient power consumption with a relatively low maximum supply voltage requirement.

No. of CLBs: 500

Abundance of Configurable Logic Blocks (CLBs) for flexible design implementation.

No. of Inputs: 250

Sufficient number of inputs for handling multiple data streams and signals.

Package Shape: SQUARE

Space-efficient package shape for easier integration onto PCBs.

Nominal Supply Voltage (V): 1.2

Stable and standard supply voltage for consistent performance.

Power Supplies (V): 1.2

Consistent power supply voltage for reliable operation.

No. of Terminals: 256

Adequate number of terminals for connectivity and interfacing with external components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Flexibility in reconfiguring the logic and functionality of the IC for various applications.

Package Style (Meter): GRID ARRAY

Efficient grid array package style for optimal layout and routing on a PCB.

Minimum Supply Voltage: 1.15 V

Low minimum supply voltage for energy efficiency and extended battery life.

Maximum Operating Temperature: 100 °C

Wide operating temperature range suitable for industrial environments.

Pitch Of Terminal: 1 mm

Fine pitch terminals for compact design and high component density.

Organization: 500 CLBS

Well-organized and structured CLBs for easier design implementation and debugging.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation in extreme environmental conditions.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

Durable metal finishing for reliable connections and extended lifespan.

Position Of Terminal: BOTTOM

Bottom terminal placement for easier PCB layout and routing.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for standard handling and storage precautions.

Maximum Seated Height: 1.55 mm

Low profile design for space-constrained applications.

Width: 17 mm

Compact width for efficient PCB integration and layout.

No. of Outputs: 250

Sufficient number of outputs for driving multiple external devices or components.

Maximum Time At Peak Reflow Temperature (s): 30

Fast reflow process time for efficient manufacturing and assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable solder joints and connections.

Length: 17 mm

Compact length for space-saving PCB design and layout.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating for reliable operation in harsh environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M08DCF256I7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

8000

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

500

Sub-Category:

Field Programmable Gate Arrays

Organization:

500 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

10M08DCF256I7G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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