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XC7A200T-2FB676I

Xilinx

XC7A200T-2FB676I by Xilinx

XC7A200T-2FB676I by Xilinx is a FPGA with 16825 CLBs, 1.05V max supply voltage, and 1.05ns combinatorial delay. Ideal for industrial applications requiring high-speed processing and programmable logic capabilities in a compact 27mm square package with 676 terminals.

Median Price

$536.260

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Mouser Electronics

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Nova Conductors

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AZTECH Wire

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$159.064

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Argo Parts USA

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Microchip USA

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Overview

Unlock limitless possibilities with the Xilinx XC7A200T-2FB676I Field Programmable Gate Array. Manufactured by industry leader Xilinx, this FPGA offers unparalleled quality and reliability for a wide range of applications. With 16825 CLBs and a maximum combinatorial delay of just 1.05 ns, this versatile device is perfect for high-performance designs. Whether you're designing cutting-edge electronics or pushing the boundaries of innovation, the XC7A200T-2FB676I provides the value, benefits, and advantages you need to succeed. Experience the power of Xilinx with this top-of-the-line FPGA today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides a durable and cost-effective solution for the package body.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards.

Maximum Supply Voltage: 1.05 V

A low maximum supply voltage helps in reducing power consumption and minimizing heat dissipation.

No. of CLBs: 16825

With a high number of Configurable Logic Blocks, this FPGA offers a wide range of customization options for various applications.

Package Shape: SQUARE

The square shape of the package allows for better utilization of space on circuit boards.

Form Of Terminal: BALL

The use of ball terminals enhances the reliability and robustness of the connections.

No. of Terminals: 676

This high number of terminals allows for more flexibility in routing connections for complex designs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

The FPGA design enables reconfiguration and optimization of the product for different tasks.

Package Style (Meter): GRID ARRAY

The grid array package style offers enhanced mechanical strength and better electrical performance.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature allows for reliable performance in harsh environments.

Pitch Of Terminal: 1 mm

The tight pitch spacing of terminals enables high-density PCB designs.

Maximum Combinatorial Delay of a CLB: 1.05 ns

The low delay in combinational operations contributes to high-speed performance.

Organization: 16825 CLBS

The organized layout of CLBs facilitates efficient design implementation and optimization.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality even in extreme cold conditions.

Finishing Of Terminal Used: TIN LEAD

The use of tin-lead finish provides good solderability and reliability in connections.

Position Of Terminal: BOTTOM

The bottom positioning of terminals simplifies routing and improves signal integrity.

Moisture Sensitivity Level (MSL): 4

The MSL rating of 4 indicates a low sensitivity to moisture, enhancing product reliability.

Maximum Seated Height: 2.54 mm

The low seated height allows for compact and slim PCB designs.

Width: 27 mm

The moderate width of the package offers a balanced size for fitting into various board layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The short peak reflow time contributes to efficient manufacturing processes.

Peak Reflow Temperature °C: 225

The high peak reflow temperature ensures proper soldering and component reliability.

Length: 27 mm

The moderate length of the package provides a balanced form factor for integration into different systems.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in demanding industrial environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A200T-2FB676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of CLBs:

16825

CLB Maximum Delay:

1.05 ns

Organization:

16825 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.54 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e0

Trade Compliance

XC7A200T-2FB676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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