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XC6SLX45-3CSG324C

Xilinx

XC6SLX45-3CSG324C by Xilinx

The Xilinx XC6SLX45-3CSG324C is a FPGA with 43661 logic cells, 3411 CLBs, and 218 inputs/outputs. Operating at a max frequency of 862 MHz, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. With a low profile grid array package style, it offers flexibility in design while maintaining reliability under varying operating conditions.

Median Price

$128.510

Lifecycle Status

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12

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Farnell

UK . 286 parts In-Stock

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$96.630

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DigiKey

USA . 209 parts In-Stock

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Mouser Electronics

USA . 42 parts In-Stock

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$126.490

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Digiode

USA . 455 parts In-Stock

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$91.798

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VNN

France . 660 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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Chip Stock

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Sensible Micro Corp

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Touchstone Systems

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Bristol Electronics

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Atlantic Semiconductor

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Aztec Data Supply Inc.

USA . 2,651 parts In-Stock

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$20.950

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Vigor

Singapore . 971 parts In-Stock

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Ampacity Inc.

Singapore . 254 parts In-Stock

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$82.140

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Corohmni

South Africa . 147 parts In-Stock

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$86.489

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Corphita

USA . 346 parts In-Stock

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$86.967

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Continental Prestige Electronics

USA . 286 parts In-Stock

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Modulus Dynamics

Lithuania . 1,086 parts In-Stock

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$97.717

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$97.717

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Texas Native Microelectronics

USA . 30 parts In-Stock

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$108.310

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$103.978

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Microchip USA

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$117.330

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Netroflash

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$119.406

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Advanced Electronics

New Zealand . 1,367 parts In-Stock

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Semicontronic

India . 254 parts In-Stock

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$178.770

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$174.301

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$173.407

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S.R.D Solutions

India . 13,000 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Kenton Components

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MARBEL Systems

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Argo Parts USA

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Perfect Parts

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Supply Digital

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Futuretech Components

Singapore . 610 parts In-Stock

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Qasali Group International

UK . 321 parts In-Stock

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RC Electronics

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Overview

Unlock the power of innovation with the XC6SLX45-3CSG324C by Xilinx. This cutting-edge Field Programmable Gate Array (FPGA) offers unparalleled quality and reliability, thanks to Xilinx's reputation as a top-tier manufacturer in the industry. Ideal for a wide range of applications, this FPGA provides customers with the flexibility and performance they need to bring their projects to life. Experience the value and benefits of the XC6SLX45-3CSG324C and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the package lightweight and cost-effective.

No. of Logic Cells: 43661

Large number of logic cells allows for complex programmable logic designs.

Maximum Supply Voltage: 1.26 V

Operates at a low maximum supply voltage, making it efficient in terms of power consumption.

Technology Used: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Maximum Operating Temperature: 85 °C

Can operate effectively in a wide range of temperatures, making it versatile for various applications.

Maximum Clock Frequency: 862 MHz

High clock frequency allows for fast processing speeds in digital circuits.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product can withstand reflow soldering processes, making it suitable for manufacturing.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX45-3CSG324C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

43661

No. of Inputs:

218

No. of Outputs:

218

No. of CLBs:

3411

Maximum Clock Frequency:

862 MHz

CLB Maximum Delay:

0.21 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

3411 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX45-3CSG324C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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