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XC7A200T-2FBG676I

Xilinx

XC7A200T-2FBG676I by Xilinx

Xilinx XC7A200T-2FBG676I FPGA features 215360 logic cells, 16825 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

Median Price

$429.000

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Farnell

UK . 137 parts In-Stock

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DigiKey

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Mouser Electronics

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EBV Elektronik

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Digiode

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VNN

France . 776 parts In-Stock

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Nova Conductors

Japan . 39 parts In-Stock

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Touchstone Systems

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Cyclops Electronics Ltd

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Aztec Data Supply Inc.

USA . 244 parts In-Stock

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Corohmni

South Africa . 106 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Advanced Electronics

New Zealand . 346 parts In-Stock

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Modulus Dynamics

Lithuania . 576 parts In-Stock

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Ampacity Inc.

Singapore . 342 parts In-Stock

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Semicontronic

India . 297 parts In-Stock

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Corphita

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Vigor

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Continental Prestige Electronics

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Argo Parts USA

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Netroflash

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Perfect Parts

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Lixinc

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Supply Digital

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GreenTree Electronics

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Robosynatics

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Lucentia Tech

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MARBEL Systems

Belgium . 540 parts In-Stock

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RC Electronics

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Qasali Group International

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Futuretech Components

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Overview

Discover the power of innovation with the XC7A200T-2FBG676I by Xilinx. As a leading manufacturer in the Field Programmable Gate Arrays (FPGA) category, Xilinx delivers unmatched quality and reliability. With 215360 logic cells and 16825 CLBs, this FPGA offers endless possibilities for customization and optimization. Whether you're designing cutting-edge technology or pushing the boundaries of performance, the XC7A200T-2FBG676I provides the value, benefits, and advantages you need to bring your ideas to life. Experience the future of technology with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FPGA, making it a reliable choice for various applications.

No. of Logic Cells: 215360

With a high number of logic cells, this FPGA can handle complex designs and processing tasks efficiently.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration into PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 1.05 V

This voltage range ensures compatibility with a wide range of power sources, offering flexibility in system design.

No. of CLBs: 16825

The large number of Configurable Logic Blocks allows for versatile and customizable functionality to meet diverse project requirements.

Technology Used: CMOS

CMOS technology offers low power consumption and high-speed operation, enhancing the overall performance of the FPGA.

No. of Inputs: 400

With a generous number of input options, the FPGA can accommodate multiple data sources, contributing to its versatility.

Package Shape: SQUARE

The square shape of the package enables a compact footprint, saving space on the PCB and optimizing layout design.

Form Of Terminal: BALL

The ball terminals provide a reliable and robust connection, ensuring stable signal transmission and reducing the risk of faults.

No. of Terminals: 676

The high number of terminals allows for sufficient connectivity options, enabling seamless integration with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As an FPGA, this device offers reprogrammability, allowing for flexibility and adaptability in various applications.

Package Style (Meter): GRID ARRAY

The grid array style facilitates easy soldering and mounting, contributing to a more efficient and cost-effective assembly process.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage requirement enhances energy efficiency and extends battery life in portable devices.

Maximum Operating Temperature: 100 °C

The high operating temperature range ensures reliability and performance under challenging environmental conditions.

Pitch Of Terminal: 1 mm

The tight pitch of terminals enables high-density PCB designs, maximizing component placement and optimizing space usage.

Maximum Combinatorial Delay of a CLB: 1.05 ns

This low delay value ensures fast signal processing, enhancing the overall speed and efficiency of the FPGA.

Organization: 16825 CLBS

The organized layout of Configurable Logic Blocks facilitates logical design implementation and simplifies system integration.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for operation in harsh environments, providing versatility for various applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of these terminal materials ensures reliable connections, preventing corrosion and maintaining signal integrity.

Position Of Terminal: BOTTOM

The bottom terminal position simplifies PCB layout and routing, improving signal integrity and reducing interference.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates the FPGA's resistance to moisture, making it suitable for use in humid or damp conditions.

Maximum Seated Height: 2.54 mm

The low seated height allows for a slim profile, ideal for compact device designs and space-constrained applications.

Width: 27 mm

The standard width measurement ensures compatibility with industry-standard PCB sizes, facilitating integration into existing systems.

Maximum Clock Frequency: 1286 MHz

The high clock frequency capability enables fast data processing and real-time performance, making the FPGA suitable for high-speed applications.

No. of Outputs: 400

With a generous number of output options, the FPGA can drive multiple external devices or components, increasing system flexibility and functionality.

Maximum Time At Peak Reflow Temperature (s): 30

This spec indicates the maximum time the FPGA can withstand peak reflow temperatures, ensuring proper soldering during assembly.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance allows for reliable solder joints and durable connections, ensuring long-term performance.

Length: 27 mm

The standard length measurement enables easy compatibility with PCB layouts and enclosure designs, facilitating seamless integration into systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A200T-2FBG676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

215360

No. of Inputs:

400

No. of Outputs:

400

No. of CLBs:

16825

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

16825 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.54 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A200T-2FBG676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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