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XC7A15T-2CSG325I

Xilinx

XC7A15T-2CSG325I by Xilinx

Xilinx XC7A15T-2CSG325I FPGA features 16640 logic cells, 1300 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing with a wide operating temperature range from -40 to 100°C. Package style is grid array with low profile and fine pitch terminals.

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$71.295

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Element14

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Overview

Experience unprecedented versatility and performance with the XC7A15T-2CSG325I by Xilinx, a leading manufacturer in the Field Programmable Gate Arrays (FPGA) category. This cutting-edge product boasts 16640 logic cells, 1300 CLBs, and a maximum clock frequency of 1286 MHz, making it an ideal solution for a wide range of applications. With its low profile, fine pitch package style and industrial grading, this FPGA offers unmatched value and benefits to customers seeking high-quality, reliable performance for their projects. Elevate your design possibilities with the XC7A15T-2CSG325I from Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the FPGA, making it suitable for a variety of operating environments.

No. of Logic Cells: 16640

A high number of logic cells allow for complex programmable logic designs to be implemented effectively, making this FPGA versatile for different applications.

Surface Mount: YES

Surface mount capability makes the FPGA easy to integrate into PCB designs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage requirement of 1.05 V helps in reducing power consumption and heat dissipation, resulting in energy-efficient operation.

No. of CLBs: 1300

Having 1300 Configurable Logic Blocks (CLBs) allows for flexible logic configuration, enabling the FPGA to be tailored to specific application requirements.

No. of Inputs: 250

With 250 inputs, the FPGA can interface with a wide range of external signals and devices, enhancing its connectivity and versatility.

Package Shape: SQUARE

Square package shape facilitates easy placement on PCBs and ensures efficient use of space within the system design.

Form Of Terminal: BALL

Ball terminals provide reliable electrical connections and mechanical stability, ensuring secure mounting and operation of the FPGA.

No. of Terminals: 325

Having 325 terminals allows for robust connectivity and signal routing capabilities, enabling the FPGA to effectively interface with external components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) means that the device offers reprogrammable logic functionality, allowing for flexible design iterations and updates.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style provides high packing density, efficient heat dissipation, and compatibility with modern PCB designs.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage requirement of 0.95 V ensures efficient power operation and compatibility with low-power applications.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, the FPGA can withstand high-temperature environments and demanding thermal conditions.

Pitch Of Terminal: 0.8 mm

The small terminal pitch of 0.8 mm enables high-density mounting and precise signal routing, contributing to the overall compactness and efficiency of the FPGA design.

Maximum Combinatorial Delay of a CLB: 1.05 ns

The low combinatorial delay of 1.05 ns in the Configurable Logic Blocks (CLBs) ensures fast signal processing and high-speed operation of the FPGA.

Organization: 1300 CLBS

Having 1300 Configurable Logic Blocks (CLBs) organized in the FPGA provides a structured and scalable framework for implementing complex logic functions and designs.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the FPGA can function reliably in cold environments and withstand temperature variations without performance degradation.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of Tin, Silver, and Copper finishing on the terminals ensures good conductivity, corrosion resistance, and solderability for reliable electrical connections.

Position Of Terminal: BOTTOM

The bottom positioning of the terminals facilitates easier PCB mounting, soldering, and routing of signals, enhancing the overall ease of integration and assembly.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level (MSL) of 3 indicates that the FPGA is sensitive to moisture but can be stored and handled under controlled conditions to prevent damage or reliability issues.

Maximum Seated Height: 1.5 mm

The low maximum seated height of 1.5 mm allows for compact PCB designs and efficient utilization of vertical space within electronic assemblies.

Width: 15 mm

With a width of 15 mm, the FPGA offers a compact form factor that is suitable for integration into small form factor electronic systems and devices.

Maximum Clock Frequency: 1286 MHz

A high maximum clock frequency of 1286 MHz enables rapid signal processing and high-speed operation, making the FPGA suitable for demanding real-time applications.

No. of Outputs: 250

Having 250 outputs allows the FPGA to drive multiple signals and interact with a variety of external devices, expanding its functionality and versatility.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature of 260°C ensures proper soldering and reliability during the assembly process, enhancing the long-term performance of the FPGA.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C is within standard soldering guidelines, allowing for safe and effective soldering of the FPGA during PCB assembly.

Length: 15 mm

With a length of 15 mm, the FPGA maintains a balanced form factor that is suitable for various PCB layouts and system designs, offering flexibility in placement and integration.

Grading Of Temperature: INDUSTRIAL

The industrial temperature grade ensures that the FPGA can operate reliably in a wide range of temperature conditions, making it suitable for industrial applications with extended temperature requirements.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A15T-2CSG325I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

16640

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

1300

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Organization:

1300 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA325,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

JESD-609 Code:

e1

Trade Compliance

XC7A15T-2CSG325I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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