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XC6SLX150T-2FGG676C

Xilinx

XC6SLX150T-2FGG676C by Xilinx

Xilinx XC6SLX150T-2FGG676C is a FPGA with 147443 logic cells, 11519 CLBs, and 396 inputs/outputs. It operates at max frequency of 667 MHz, suitable for high-speed applications like signal processing and telecommunications due to its advanced CMOS technology. The package style is grid array with a square shape and plastic/epoxy material.

Median Price

$370.280

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VNN

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Modulus Dynamics

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Overview

Unlock the power of cutting-edge technology with the Xilinx XC6SLX150T-2FGG676C FPGA. Manufactured by industry leader Xilinx, this FPGA boasts unparalleled quality and reliability. Ideal for a wide range of applications, from telecommunications to automotive, this versatile device offers customers unmatched value and flexibility. Experience lightning-fast speeds, high performance, and seamless integration with the XC6SLX150T-2FGG676C FPGA. Elevate your projects to new heights with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and thermal resistance, making the product suitable for various environments.

No. of Logic Cells: 147443

The large number of logic cells allows for complex designs and high-performance capabilities.

Maximum Supply Voltage: 1.26 V

Provides flexibility in power supply options while maintaining operational reliability.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the device.

Maximum Clock Frequency: 667 MHz

With a high clock frequency, the product can handle fast data processing and real-time applications effectively.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX150T-2FGG676C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

147443

No. of Inputs:

396

No. of Outputs:

396

No. of CLBs:

11519

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

11519 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.44 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX150T-2FGG676C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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