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M7A3P1000-FGG256I

Microchip Technology

M7A3P1000-FGG256I by Microchip Technology

M7A3P1000-FGG256I by Microchip Technology is a FPGA with 24576 logic cells, 1.5V nominal voltage, and 350MHz max clock frequency. Ideal for industrial applications requiring high-speed processing, it features 177 inputs/outputs and 1000000 equivalent gates in a compact grid array package.

Median Price

$158.857

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

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$158.857

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550

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Vyrian

USA . 1,547 parts In-Stock

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Digiode

USA . 477 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 668 parts In-Stock

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$18.131

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$18.131

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Semicontronic

India . 495 parts In-Stock

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$26.000

100+ parts

$25.350

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$25.220

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495

$26.000

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$25.220

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$93.386

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$88.717

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$88.717

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$93.386

$88.717

$88.717

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Corohmni

South Africa . 318 parts In-Stock

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$107.653

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318

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Aztec Data Supply Inc.

USA . 4,090 parts In-Stock

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$140.185

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Continental Prestige Electronics

USA . 2,560 parts In-Stock

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$158.857

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$155.680

2,560

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$155.680

Netroflash

USA . 100 parts In-Stock

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$158.857

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$150.914

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$147.737

100

$158.857

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$150.914

$147.737

Microchip USA

USA . 2,549 parts In-Stock

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$174.111

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Argo Parts USA

USA . 1,281 parts In-Stock

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West Coast Incorporated

USA . 190 parts In-Stock

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190

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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150

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Corphita

USA . 110 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the M7A3P1000-FGG256I by Microchip Technology. As a leader in the field programmable gate arrays (FPGA) category, Microchip Technology delivers unparalleled quality and reliability. With 24576 logic cells and 1000000 equivalent gates, this FPGA offers endless possibilities for your projects. Whether you're designing advanced electronics or pushing the boundaries of innovation, the M7A3P1000-FGG256I provides the value, benefits, and advantages you need to succeed. Elevate your creations to new heights with Microchip Technology's exceptional FPGA solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package material offers good protection for the internal components of the FPGA, making it durable and reliable for various applications.

No. of Logic Cells: 24576

With a large number of logic cells, this FPGA can handle complex logic functions and calculations effectively.

Maximum Supply Voltage: 1.575 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the FPGA energy efficient.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA suitable for a wide range of applications.

No. of Inputs: 177

With a high number of inputs, the FPGA can handle a large amount of incoming data and signals efficiently.

Nominal Supply Voltage (V): 1.5

The nominal supply voltage of 1.5V provides a stable operating voltage for the FPGA, ensuring reliable performance.

Maximum Clock Frequency: 350 MHz

The high maximum clock frequency allows the FPGA to process data and perform operations at a fast pace, making it suitable for real-time applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M7A3P1000-FGG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

24576

No. of Inputs:

177

No. of Outputs:

177

No. of CLBs:

24576

No. of Equivalent Gates:

1000000

Maximum Clock Frequency:

350 MHz

Technology:

CMOS

Organization:

24576 CLBS, 1000000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.7 mm

Packing Method:

Tray

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

M7A3P1000-FGG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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