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M7A3P1000-FGG256

Microchip Technology

M7A3P1000-FGG256 by Microchip Technology

M7A3P1000-FGG256 by Microchip Technology is a 1.5V FPGA with 24576 logic cells and 1000000 gates. It operates at up to 350MHz, suitable for commercial applications requiring high-speed processing in a compact form factor. With a package style of grid array and moisture sensitivity level of 3, it offers reliable performance in various environments.

Median Price

$146.049

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$146.049

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100

$146.049

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Vyrian

USA . 414 parts In-Stock

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414

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Digiode

USA . 133 parts In-Stock

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133

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 545 parts In-Stock

1+ parts

$10.528

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545

$10.528

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Semicontronic

India . 250 parts In-Stock

1+ parts

$16.000

100+ parts

$15.600

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$15.520

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-

250

$16.000

$15.600

$15.520

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$109.834

100+ parts

$104.342

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$104.342

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200

$109.834

$104.342

$104.342

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Aztec Data Supply Inc.

USA . 730 parts In-Stock

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$138.023

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730

$138.023

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Continental Prestige Electronics

USA . 1,881 parts In-Stock

1+ parts

$146.049

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$143.128

1,881

$146.049

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$143.128

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$146.049

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1k+ parts

$138.747

10k+ parts

$135.826

1,000

$146.049

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$138.747

$135.826

Microchip USA

USA . 1,865 parts In-Stock

1+ parts

$151.460

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$151.460

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Corohmni

South Africa . 866 parts In-Stock

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$161.888

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866

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Component Stockers USA

USA . 52 parts In-Stock

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$982.760

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$982.760

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Fulton Briggs Corp.

USA . 3,967 parts In-Stock

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3,967

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Argo Parts USA

USA . 3,053 parts In-Stock

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Corphita

USA . 280 parts In-Stock

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Overview

Unlock endless possibilities with the M7A3P1000-FGG256 by Microchip Technology. This cutting-edge Field Programmable Gate Array (FPGA) boasts superior quality and reliability, making it a top choice for a wide range of applications. With 24576 logic cells and 1000000 equivalent gates, this FPGA delivers exceptional performance while maintaining a low supply voltage. Perfectly suited for commercial environments, this FPGA is designed to maximize efficiency and productivity. Experience innovation at its finest with the M7A3P1000-FGG256 - the ultimate solution for all your FPGA needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the FPGA, making it ideal for portable and rugged applications.

No. of Logic Cells: 24576

Offers a large number of logic cells for complex programmable logic designs and high functionality.

Maximum Supply Voltage: 1.575 V

Operates at a low maximum supply voltage, making it energy efficient and suitable for low-power applications.

Technology Used: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, ensuring reliable performance.

No. of Inputs: 177

Provides a high number of input pins for connecting external devices and peripherals.

Maximum Clock Frequency: 350 MHz

Supports a high maximum clock frequency, enabling fast processing and data throughput.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M7A3P1000-FGG256 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

24576

No. of Inputs:

177

No. of Outputs:

177

No. of CLBs:

24576

No. of Equivalent Gates:

1000000

Maximum Clock Frequency:

350 MHz

Technology:

CMOS

Organization:

24576 CLBS, 1000000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.8 mm

Packing Method:

Tray

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

M7A3P1000-FGG256 Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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