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M7A3P1000-FGG484I

Microchip Technology

M7A3P1000-FGG484I by Microchip Technology

M7A3P1000-FGG484I by Microchip Technology is a FPGA with 24576 logic cells, 1000000 gates, and 300 inputs/outputs. It operates at max frequency of 350 MHz and supports industrial temperature range. Ideal for high-performance applications requiring programmable ICs in compact form factor.

Median Price

$167.600

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$167.600

100+ parts

-

1k+ parts

-

10k+ parts

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10

$167.600

-

-

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Vyrian

USA . 655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

655

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-

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Digiode

USA . 346 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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346

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,426 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

10k+ parts

-

1,426

$6.000

$5.850

$5.820

-

AZTECH Wire

Italy . 244 parts In-Stock

1+ parts

$13.051

100+ parts

-

1k+ parts

-

10k+ parts

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244

$13.051

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Aztec Data Supply Inc.

USA . 3,151 parts In-Stock

1+ parts

$40.890

100+ parts

-

1k+ parts

-

10k+ parts

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3,151

$40.890

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-

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Advanced Electronics

New Zealand . 61 parts In-Stock

1+ parts

$92.142

100+ parts

$87.535

1k+ parts

$87.535

10k+ parts

-

61

$92.142

$87.535

$87.535

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Corohmni

South Africa . 102 parts In-Stock

1+ parts

$149.150

100+ parts

-

1k+ parts

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10k+ parts

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102

$149.150

-

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$167.600

100+ parts

-

1k+ parts

$159.220

10k+ parts

$155.868

2,000

$167.600

-

$159.220

$155.868

Continental Prestige Electronics

USA . 656 parts In-Stock

1+ parts

$167.600

100+ parts

-

1k+ parts

-

10k+ parts

$164.248

656

$167.600

-

-

$164.248

Microchip USA

USA . 1,548 parts In-Stock

1+ parts

$189.130

100+ parts

-

1k+ parts

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10k+ parts

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1,548

$189.130

-

-

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Component Stockers USA

USA . 108 parts In-Stock

1+ parts

$1,381.330

100+ parts

-

1k+ parts

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10k+ parts

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108

$1,381.330

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-

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RGB Technical Solutions

Ukraine . 8,285 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,285

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Argo Parts USA

USA . 2,172 parts In-Stock

1+ parts

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100+ parts

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2,172

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Corphita

USA . 213 parts In-Stock

1+ parts

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100+ parts

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213

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Overview

Unlock the power of cutting-edge technology with the M7A3P1000-FGG484I by Microchip Technology, a top-tier manufacturer in the industry. This Field Programmable Gate Array (FPGA) boasts unparalleled quality and reliability, offering customers a wide range of applications for their projects. Experience the value and benefits of this product, from its advanced features to its seamless performance. Choose Microchip Technology for innovative solutions that elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and reliability, making it a good choice for various applications.

No. of Logic Cells

24576 - With a high number of logic cells, this FPGA offers flexibility and scalability for complex designs.

Surface Mount

YES - This feature makes the FPGA easy to integrate into circuit boards, saving time and effort during production.

Maximum Supply Voltage

1.575 V - The wide voltage range allows for compatibility with different power sources, increasing versatility.

No. of CLBs

24576 - The large number of Configurable Logic Blocks offers a high degree of customization for specific project requirements.

Technology Used

CMOS - CMOS technology ensures low power consumption and high speed operation, making it suitable for energy-efficient applications.

No. of Inputs

300 - With a high number of input pins, this FPGA can accommodate multiple input signals, enabling complex functionality.

Package Shape

SQUARE - The square shape makes the FPGA easy to handle and install, optimizing space utilization on a circuit board.

Form Of Terminal

BALL - The ball terminal design simplifies the soldering process, enhancing the reliability of connections in the system.

No. of Equivalent Gates

1000000 - The abundance of equivalent gates allows for the implementation of intricate logic functions, suited for advanced applications.

Nominal Supply Voltage (V)

1.5 - The nominal supply voltage provides stable and consistent power delivery, ensuring consistent performance.

Packing Method

TRAY - The use of tray packing ensures safe transportation and handling of the FPGA, reducing the risk of damage during shipping.

No. of Terminals

484 - The high number of terminals offers ample connection points, enabling seamless integration with other components in a system.

Programmable IC Type

FIELD PROGRAMMABLE GATE ARRAY - Being an FPGA, this product provides the flexibility of reprogramming and optimizing the logic design as per project requirements.

Package Style (Meter)

GRID ARRAY - The grid array package style simplifies the PCB layout design and enhances heat dissipation for improved reliability.

Minimum Supply Voltage

1.425 V - The low minimum supply voltage enables energy-efficient operation and extends battery life in portable applications.

Maximum Operating Temperature

85 °C - The wide operating temperature range allows the FPGA to perform reliably in harsh environmental conditions.

Pitch Of Terminal

1 mm - The tight terminal pitch enables high-density mounting, saving space on the PCB and facilitating complex circuit designs.

Organization

24576 CLBS, 1000000 GATES - The organized layout of CLBs and gates facilitates efficient logic implementation and simplifies design optimization.

Minimum Operating Temperature

40 °C - The low minimum operating temperature ensures the FPGA can function in cold environments without performance degradation.

Finishing Of Terminal Used

TIN SILVER COPPER - The use of tin, silver, and copper finishing improves the durability and reliability of the terminal connections.

Position Of Terminal

BOTTOM - Terminal positioning at the bottom of the package enhances PCB layout flexibility and simplifies system integration.

Moisture Sensitivity Level (MSL)

3 - The designated MSL level ensures the FPGA can withstand varying humidity levels, maintaining performance and reliability over time.

Maximum Seated Height

2.44 mm - The low seated height profile allows for compact PCB designs and efficient use of space in constrained applications.

Width

27 mm - The moderate width dimension enables easy handling and installation of the FPGA in diverse systems.

Maximum Clock Frequency

350 MHz - The high clock frequency capability supports fast data processing and high-speed operations in demanding applications.

No. of Outputs

300 - With a high number of output pins, this FPGA can drive multiple output signals, enabling versatile system connectivity.

Maximum Time At Peak Reflow Temperature (s)

30 - This specified time ensures proper solder reflow during manufacturing, guaranteeing robust and reliable connections.

Peak Reflow Temperature °C

250 - The high peak reflow temperature tolerance allows for efficient soldering processes, ensuring secure component attachment.

Length

27 mm - The moderate length dimension facilitates easy integration of the FPGA into various electronic systems.

Grading Of Temperature

INDUSTRIAL - The industrial-grade temperature rating ensures the FPGA can withstand harsh environmental conditions, making it suitable for rugged applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M7A3P1000-FGG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

24576

No. of Inputs:

300

No. of Outputs:

300

No. of CLBs:

24576

No. of Equivalent Gates:

1000000

Maximum Clock Frequency:

350 MHz

Technology:

CMOS

Organization:

24576 CLBS, 1000000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.44 mm

Packing Method:

Tray

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

M7A3P1000-FGG484I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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