Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Xilinx XC7S15-1FTGB196C is a 12800 logic cell FPGA with 1000 CLBs and 100 inputs/outputs. Operating at up to 1098 MHz, it has a combinatorial delay of 1.27 ns and supports a max supply voltage of 1.05 V. Ideal for applications requiring high-speed processing in compact form factors like telecommunications equipment and industrial automation systems.
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Digiode
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Vyrian
ComSIT USA
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AZTECH Wire
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Semicontronic
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Ampacity Inc.
Corphita
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Vigor
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Continental Prestige Electronics
Corohmni
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Advanced Electronics
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Microchip USA
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Netroflash
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Modulus Dynamics
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Texas Native Microelectronics
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$161.407
Kenton Components
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$495.226
$460.560
MARBEL Systems
Futuretech Components
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Perfect Parts
This material is commonly used for electronic components due to its durability and resistance to temperature variations.
A high number of logic cells allows for complex designs and increased functionality in the FPGA.
Surface mount technology makes the installation of the FPGA easier and more efficient.
Efficient power consumption with a low maximum supply voltage.
A high number of Configurable Logic Blocks allows for flexible and customizable circuit designs.
Sufficient input ports for connecting external devices and signals.
Square packages are often space-saving and easier to mount on circuit boards.
Ball terminals provide reliable connectivity and are commonly used in modern electronics.
A moderate number of terminals for connecting various components and interfaces.
FPGAs offer flexibility and reprogrammability, making them suitable for prototyping and customization.
This package style offers a compact, low-profile design with closely spaced terminals for efficient signal routing.
Operates efficiently at a low minimum supply voltage.
Withstands high operating temperatures, suitable for a wide range of applications.
Close terminal pitch allows for more terminals in a smaller space, enabling compact designs.
Low delay in combinational logic blocks enables high-speed processing and reduced latency.
Organized into 1000 Configurable Logic Blocks for structured and efficient circuit design.
Can operate in low-temperature environments without performance degradation.
Matte tin finish provides corrosion resistance and good solderability for reliable connections.
Bottom terminals offer easy access for soldering and connecting to external components.
Low profile design with a maximum seated height of 1.55mm for space-constrained applications.
Compact width for easy integration into circuit board layouts.
High clock frequency for fast data processing and real-time applications.
Sufficient output ports for delivering processed data to external devices or components.
Compact length for space-efficient placement on circuit boards.
Field Programmable Gate Arrays (FPGA) XC7S15-1FTGB196C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
Programmable IC Type:
No. of Logic Cells:
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No. of Outputs:
No. of CLBs:
Maximum Clock Frequency:
CLB Maximum Delay:
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Minimum Supply Voltage:
Maximum Supply Voltage:
Minimum Operating Temperature:
Maximum Operating Temperature:
Temperature Grade:
Package Body Material:
Surface Mountable:
Package Style:
Package Code:
Package Shape:
Length:
Width:
Maximum Seated Height:
Package Equivalence Code:
Terminal Position:
Terminal Style:
Terminal Finish:
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No. of Terminals:
JESD-30 Code:
JESD-609 Code:
XC7S15-1FTGB196C Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
M24308/2-1F
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
MS3V-T1R32.768KHZ+/-20PPM12.5PF
Golledge Electronics
MS3V-T1R32.768KHZ+/-20PPM12.5PF by Golledge Electronics is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 12.5 pF load capacitance. It is ideal for applications requiring precise timing in temperature-sensitive environments due to its -40 to 85 °C operating range.
DP83848IVVX/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
LM358ADR
Texas Instruments
LM358ADR by Texas Instruments is an operational amplifier with 2 functions, featuring a max input offset voltage of 5000 uV and nominal voltage of 5V. Widely used in applications requiring high voltage gain, it operates within a temperature range of 0-70°C and offers frequency compensation for stability.
2N2222A
Telcom Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
FDN5618P
Onsemi
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
2N7002
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
Defense Logistics Agency
CONNECTOR ACCESSORY; Contact Type: CRIMP REAR RELEASE; Mating Contacts: M39029/56-348, M39029/57-354; Insertion Tool Sources: MILITARY; Contact Gender: MALE; Alternate Contact Sources: MILITARY;
STM32F405RGT6
STMicroelectronics
STM32F405RGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 16 external interrupts, and 196608 RAM bytes. Ideal for industrial applications, it features CAN(2), I2C(3), SPI(3) connectivity options and operates at a max clock frequency of 26 MHz. With low power mode and DMA support, it offers versatile performance in compact dimensions.
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
BAV99
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
XC7A12T-2CPG238I
Xilinx
Xilinx XC7A12T-2CPG238I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with low profile grid array style.
EP2C20F484I8N
Intel
The Intel EP2C20F484I8N FPGA features 18752 logic cells, 1172 CLBs, and a max clock frequency of 402.5 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact grid array package with bottom terminals.
10M08SAE144C8G
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
LCMXO2-1200HC-4TG100IR1
Lattice Semiconductor
LCMXO2-1200HC-4TG100IR1 by Lattice Semiconductor is a CMOS FPGA with 1280 logic cells, 80 inputs/outputs, and 133 MHz clock frequency. Ideal for applications requiring high-speed processing in fields like telecommunications and industrial automation.
EP2C8Q208I8N
The Intel EP2C8Q208I8N is a FPGA with 8256 logic cells, 516 CLBs, and 138 inputs. It operates at a max clock frequency of 402.5 MHz and has a supply voltage range of 1.15-1.25 V. Ideal for applications requiring high-speed processing and programmable logic capabilities in compact form factors.
EP3C10E144I7N
Intel's EP3C10E144I7N FPGA boasts 10320 logic cells, 94 inputs/outputs, and a clock frequency of 472.5 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a max operating temperature of 100°C.
10CX150YF672E5G
Intel's 10CX150YF672E5G FPGA boasts 150,000 logic cells and 54770 CLBs. Operating at 0.93V max voltage, it offers TSMC technology with 236 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor.
10M02SCU169C8G
The Intel 10M02SCU169C8G FPGA features 2000 logic cells, 125 CLBs, and 246 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-performance programmable ICs in a compact square package with ball terminals.
10M08SCE144C8G
XC3S50AN-4TQG144C
XC3S50AN-4TQG144C by Xilinx is a CMOS-based FPGA with 1584 logic cells and 176 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.
XC7S25-1CSGA324Q
XC7S25-1CSGA324Q by Xilinx is a PLASTIC/EPOXY FPGA with 23360 logic cells, 1825 CLBs, and a max clock frequency of 1098 MHz. It is commonly used in automotive applications due to its AUTOMOTIVE temperature grading.
10M16SAU169I7G
The Intel 10M16SAU169I7G is a FPGA with 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. It operates at supply voltages b/w 2.85V to 3.15V and temperatures from -40°C to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.
XC7A200T-1FBG676C
Xilinx XC7A200T-1FBG676C FPGA offers 215360 logic cells, 16825 CLBs, and 400 inputs/outputs. Ideal for high-performance applications requiring a max clock frequency of 1098 MHz. Package style is grid array with plastic/epoxy material and tin silver copper finishing.
10M04DCU324I7G
Intel's 10M04DCU324I7G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. With a max supply voltage of 1.25V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with 0.8mm terminal pitch.
EP3C40F484I7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
10M40DAF256I7G
Intel's 10M40DAF256I7G FPGA features 40000 logic cells, 2500 CLBs, and 500 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a max operating temperature of 100°C and a min of -40°C. The package style is grid array with a square shape and ball terminals.
XC7S50-2FGGA484I
The Xilinx XC7S50-2FGGA484I is a Field Programmable Gate Array with 52160 logic cells and 4075 CLBs. It operates at a max clock frequency of 1286 MHz, making it ideal for industrial applications requiring high-speed processing. With a package style of grid array and surface mount capability, this FPGA offers versatile programmability in various electronic systems.
ICE40LP384-SG32TR1K
ICE40LP384-SG32TR1K by Lattice Semiconductor is a CMOS FPGA with 48 CLBs, 32 terminals, and max supply voltage of 1.26V. Ideal for industrial applications requiring high performance in compact form factor with operating temp range of -40 to 100°C. Package style includes chip carrier and very thin profile for versatile integration.
XC7S15-1FTGB196C
10M25SAE144C8GES
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
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XC7S25-1FTGB196I
Xilinx XC7S25-1FTGB196I FPGA offers 23360 logic cells, 1825 CLBs, and 1098 MHz max clock frequency. Ideal for industrial applications requiring high-speed processing in a compact form factor with a wide operating temperature range from -40 to 100 °C.
XC7S25-1FTGB196C
Xilinx XC7S25-1FTGB196C is a 23360 logic cell FPGA with 1825 CLBs, 150 inputs/outputs, and max clock freq of 1098 MHz. Ideal for high-speed applications requiring low power consumption and compact design. Package style: grid array, low profile, fine pitch.
XC7S50-2FTGB196I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;
XC7S6-1FTGB196C
The Xilinx XC7S6-1FTGB196C is a FPGA with 6000 logic cells, 469 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
XC7S6-2FTGB196I
XC7S6-1FTGB196I
XC7S25-L1FTGB196I
XC7S50-1CSGA324I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;
XC7S15-1FTGB196I
Xilinx XC7S15-1FTGB196I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. The package style is grid array, low profile, fine pitch with matte tin finishing.
XC7S25-L1CSGA324I
Xilinx XC7S25-L1CSGA324I FPGA offers 23360 logic cells, 1825 CLBs, and 1098 MHz max clock frequency. Ideal for industrial applications requiring high-speed processing in a compact form factor with -40 to 100 °C operating temp range. Features low profile grid array package with 0.8 mm terminal pitch.
XC7S50-L1FTGB196I
Xilinx XC7S50-L1FTGB196I FPGA features 52160 logic cells, 4075 CLBs, and 100 inputs/outputs. With a max supply voltage of 0.98V and operating temperature range of -40 to 100°C, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The package style is grid array with matte tin finishing on bottom terminals.
XC7S25-1CSGA225C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;
XC7S25-L1CSGA225I
Xilinx XC7S25-L1CSGA225I FPGA offers 23360 logic cells, 1825 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a wide operating temperature range from -40 to 100 °C.
XC7S25-1CSGA225Q
The Xilinx XC7S25-1CSGA225Q is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. It is used in automotive applications due to its low profile grid array package style and fine pitch terminals. Operating temperature ranges from -40°C to 125°C.
XC7S6-2CSGA225C
The Xilinx XC7S6-2CSGA225C is a FPGA with 6000 logic cells, 469 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
XC7S6-2CPGA196I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;
XC7S50-1CSGA324C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;
XC7S50-2CSGA324C
The Xilinx XC7S50-2CSGA324C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
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