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XC7S25-1CSGA324Q

Xilinx

XC7S25-1CSGA324Q by Xilinx

XC7S25-1CSGA324Q by Xilinx is a PLASTIC/EPOXY FPGA with 23360 logic cells, 1825 CLBs, and a max clock frequency of 1098 MHz. It is commonly used in automotive applications due to its AUTOMOTIVE temperature grading.

Median Price

$44.700

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DigiKey

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 286 parts In-Stock

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Modulus Dynamics

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Continental Prestige Electronics

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Semicontronic

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Ampacity Inc.

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Vigor

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Microchip USA

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Netroflash

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Aztec Data Supply Inc.

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Kenton Components

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Advanced Electronics

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Overview

Discover the XC7S25-1CSGA324Q, a cutting-edge Field Programmable Gate Array (FPGA) by Xilinx. With its exceptional quality and advanced technology, Xilinx continues to be a leading manufacturer in the industry. This versatile FPGA offers countless applications, making it an invaluable tool for engineers and designers alike. Experience the value, benefits, and advantages this product brings to your projects, from its high-performance capabilities to its reliable build. Stay ahead of the competition with the XC7S25-1CSGA324Q and unlock a world of possibilities for your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body of this FPGA ensures a lightweight and durable construction, making it suitable for various applications.

No. of Logic Cells: 23360

With a high number of logic cells, this FPGA offers significant processing capabilities, allowing for complex and advanced designs.

Surface Mount: YES

The surface mount feature enables easy and efficient installation of the FPGA onto circuit boards, saving valuable production time.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage ensures stable and reliable operation, providing consistent performance in demanding environments.

No. of CLBs: 1825

The ample number of configurable logic blocks (CLBs) in this FPGA allows for flexible and versatile implementation of different logic functions, accommodating a wide range of applications.

No. of Inputs: 150

With a generous number of inputs, this FPGA enables the connection of numerous external devices, facilitating complex input/output operations.

Package Shape: SQUARE

The square package shape allows for efficient space utilization, making this FPGA suitable for compact electronic designs.

Form Of Terminal: BALL

The use of ball terminals simplifies the soldering process, providing reliable electrical connections and ensuring proper functioning of the FPGA.

Nominal Supply Voltage (V): 1

The nominal supply voltage of 1V ensures compatibility with standard power sources, making it easier to integrate this FPGA into existing systems.

No. of Terminals: 324

The abundance of terminals allows for multiple connections and improved signal routing capabilities, facilitating complex circuit designs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array, this IC type offers the advantage of reconfigurability, allowing users to modify the hardware design according to changing requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures efficient and reliable electrical connections, making it suitable for high-density applications.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage enables energy-efficient operation, reducing power consumption and offering cost-saving benefits.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this FPGA can withstand harsh environmental conditions, ensuring reliable performance in demanding applications.

Pitch Of Terminal: 0.8 mm

The small pitch of the terminal allows for compact designs and high-density interconnections, providing flexibility and versatility in circuit layout.

Maximum Combinatorial Delay of a CLB: 1.27 ns

The low maximum combinatorial delay of a configurable logic block ensures fast processing speed, enabling real-time operations and high-performance applications.

Organization: 1825 CLBS

The organizational structure of 1825 configurable logic blocks provides a sufficient number of resources for implementing various logical functions, making this FPGA suitable for diverse applications.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature (-40°C) allows for reliable operation even in extremely cold environments, expanding the usability of this FPGA.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper as terminal finishing materials ensures excellent conductivity, corrosion resistance, and solderability, enhancing the overall reliability and lifespan of the product.

Position Of Terminal: BOTTOM

The bottom-positioned terminals facilitate easy and convenient mounting of the FPGA on circuit boards, simplifying the assembly process.

Maximum Seated Height: 1.5 mm

The low maximum seated height allows for compact and slim designs, making this FPGA suitable for space-constrained applications.

Width: 15 mm

With a width of 15mm, this FPGA offers a compact form factor, making it easy to integrate into various system designs without sacrificing performance.

Maximum Clock Frequency: 1098 MHz

With a high maximum clock frequency, this FPGA allows for rapid data processing, contributing to the overall efficiency and performance of the system.

No. of Outputs: 150

The generous number of outputs facilitates the connection of multiple devices and enables simultaneous data transmission, offering flexibility in complex system architectures.

Length: 15 mm

With a length of 15mm, this FPGA maintains a compact size, allowing for easy integration into tight spaces or small electronic enclosures.

Grading Of Temperature: AUTOMOTIVE

The automotive temperature grading ensures the FPGA's reliability and durability in automotive applications, where it may be subjected to extreme temperature variations.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7S25-1CSGA324Q attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

23360

No. of Inputs:

150

No. of Outputs:

150

No. of CLBs:

1825

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Organization:

1825 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Trade Compliance

XC7S25-1CSGA324Q Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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