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EP3C10F256I7N

Intel

EP3C10F256I7N by Intel

EP3C10F256I7N by Intel is a CMOS-based FPGA with 10320 logic cells and 182 inputs/outputs. It operates at a max clock frequency of 472.5 MHz and is commonly used in industrial applications requiring programmable ICs for high-speed data processing.

Median Price

$104.540

Lifecycle Status

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9

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DigiKey

USA . 85 parts In-Stock

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Arrow

USA . 13,140 parts In-Stock

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Verical

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Digiode

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Nova Conductors

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Component Electronics Inc.

Canada . 4 parts In-Stock

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Chip Stock

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Touchstone Systems

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Vyrian

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Vigor

Singapore . 780 parts In-Stock

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$61.880

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Modulus Dynamics

Lithuania . 1,484 parts In-Stock

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Ampacity Inc.

Singapore . 314 parts In-Stock

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Corohmni

South Africa . 162 parts In-Stock

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Corphita

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Continental Prestige Electronics

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Microchip USA

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Texas Native Microelectronics

USA . 8,052 parts In-Stock

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$104.984

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Semicontronic

India . 314 parts In-Stock

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Qasali Group International

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Authorized Procurement Solutions

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Argo Parts USA

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MARBEL Systems

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Alle Elektronik GmbH

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Supply Digital

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Netroflash

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Perfect Parts

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GreenTree Electronics

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Kepictronics

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Futuretech Components

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A-Z Elektronik GmbH

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Kenton Components

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Speed Components Ltd (Excess)

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Overview

Experience the power and versatility of Intel's EP3C10F256I7N Field Programmable Gate Array (FPGA). With its high-quality manufacturing, Intel has crafted a product that delivers unmatched performance and reliability. Whether you're in need of advanced signal processing, data encryption, or real-time system control, this FPGA is designed to meet your needs. Unlock a world of possibilities with its 10320 logic cells and 182 inputs and outputs. Say goodbye to limitations and hello to innovation with Intel's EP3C10F256I7N FPGA.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - The use of plastic/epoxy material in the package body provides durability and protection to the FPGA, making it suitable for various applications.

No. of Logic Cells

10320 - With a high number of logic cells, this FPGA offers extensive flexibility and capability for complex digital designs.

Surface Mount

YES - Being surface mountable, this FPGA allows for easy integration into electronic circuits, saving space and facilitating efficient PCB design.

Maximum Supply Voltage

1.25 V - The higher maximum supply voltage allows the FPGA to handle a wider range of power requirements, making it compatible with diverse systems.

No. of CLBs

10320 - The FPGA's large number of configurable logic blocks (CLBs) enables the implementation of intricate logic functions, enhancing its versatility for advanced designs.

Technology Used

CMOS - Utilizing CMOS technology ensures low power consumption, high reliability, and compatibility with a wide range of systems, making it an efficient and flexible choice.

No. of Inputs

182 - The FPGA's ample number of inputs allows for the integration of numerous input signals, accommodating complex input configurations in various applications.

Package Shape

RECTANGULAR - The rectangular shape of the package provides ease of handling and compatibility with standard packaging, simplifying integration into existing systems.

Form Of Terminal

BALL - The use of ball-shaped terminals facilitates reliable electrical connections and soldering during assembly, ensuring secure connections in demanding environments.

Nominal Supply Voltage (V)

1.2 - The nominal supply voltage of 1.2V ensures compatibility with standard power requirements and contributes to the overall power efficiency of the FPGA.

No. of Terminals

256 - With a high number of terminals, the FPGA allows for connections to multiple components and peripherals, enabling complex system integration.

Programmable IC Type

FIELD PROGRAMMABLE GATE ARRAY - As a programmable integrated circuit (IC), the FPGA offers flexibility and customization options for various applications, making it an adaptable choice.

Package Style (Meter)

GRID ARRAY, LOW PROFILE - The low profile and grid array package style provide a compact form factor and easy integration, suitable for space-constrained applications.

Minimum Supply Voltage

1.15 V - The lower minimum supply voltage accommodates power-sensitive designs and enables the FPGA to operate efficiently at reduced power levels.

Maximum Operating Temperature

100 °C - The high maximum operating temperature allows the FPGA to withstand extreme conditions, making it suitable for rugged industrial applications.

Pitch Of Terminal

1 mm - The terminal pitch of 1 mm enables precise and compact connections, contributing to overall system optimization and reliable performance.

Organization

10320 CLBS - With an organizational structure of 10320 configurable logic blocks (CLBs), the FPGA offers extensive flexibility and capability for diverse digital designs.

Minimum Operating Temperature

40 °C - The low minimum operating temperature range ensures reliable operation even in harsh environments or locations with extreme temperature variations.

Finishing Of Terminal Used

Tin/Silver/Copper (Sn/Ag/Cu) - The use of tin/silver/copper finishing on the terminals enhances solderability and conductivity, ensuring robust electrical connections.

Position Of Terminal

BOTTOM - The terminal position at the bottom of the FPGA facilitates easy PCB layout and integration, streamlining assembly processes and maximizing design efficiency.

Moisture Sensitivity Level (MSL)

3 - The moisture sensitivity level of 3 indicates that the FPGA has moderate sensitivity to moisture during handling, ensuring it maintains its reliability throughout its lifespan.

Maximum Seated Height

1.55 mm - The low seated height of the FPGA allows for compact placement in electronic circuitry, enabling miniaturized and space-saving designs.

Width

17 mm - With a width of 17 mm, the FPGA offers a compact form factor, contributing to space-efficient designs and flexibility in integration.

Maximum Clock Frequency

472.5 MHz - The high maximum clock frequency enables fast processing and response times, making the FPGA suitable for demanding applications requiring real-time operations.

No. of Outputs

182 - The FPGA's ample number of outputs enables connectivity to multiple devices and peripheral components, supporting complex system architectures and signal distribution.

Maximum Time At Peak Reflow Temperature (s)

30 - The maximum time at peak reflow temperature of 30 seconds ensures that the FPGA can withstand the required solder reflow processes, facilitating reliable assembly and robust solder connections.

Peak Reflow Temperature °C

260 - The peak reflow temperature of 260°C ensures proper soldering during assembly, ensuring secure and durable connections.

Length

17 mm - With a length of 17 mm, the FPGA offers a compact form factor, contributing to space-efficient designs and flexibility in integration.

Grading Of Temperature

INDUSTRIAL - The industrial-grade temperature grading makes the FPGA suitable for a wide range of demanding environments, ensuring reliable operation in harsh conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP3C10F256I7N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

10320

No. of Inputs:

182

No. of Outputs:

182

No. of CLBs:

10320

Maximum Clock Frequency:

472.5 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

10320 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

R-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP3C10F256I7N Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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