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XC6SLX45T-2FGG484C

Xilinx

XC6SLX45T-2FGG484C by Xilinx

Xilinx XC6SLX45T-2FGG484C FPGA features 43661 logic cells, 3411 CLBs, and 296 inputs/outputs. Utilized in applications requiring high-speed processing up to 667 MHz with a max operating temperature of 85°C. Ideal for projects demanding versatile programmable ICs in a compact grid array package.

Median Price

$172.480

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AZTECH Wire

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Modulus Dynamics

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Overview

Unleash the power of innovation with the Xilinx XC6SLX45T-2FGG484C FPGA, a cutting-edge solution that combines quality craftsmanship with unmatched performance. Manufactured by industry leader Xilinx, this FPGA offers endless possibilities in a wide range of applications. Whether you're looking to enhance your data processing capabilities or streamline your system design, the XC6SLX45T-2FGG484C delivers value and efficiency like never before. Experience the benefits of advanced technology and precision engineering with this versatile FPGA, designed to meet the evolving needs of today's dynamic market. Step into the future with Xilinx and revolutionize the way you create, innovate, and succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides a lightweight and cost-effective solution.

No. of Logic Cells: 43661

With a high number of logic cells, this FPGA offers ample capacity for complex designs and applications.

Surface Mount: YES

Being surface mountable makes it easier to integrate this FPGA onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps to reduce power consumption and heat generation in the system.

No. of CLBs: 3411

The large number of Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic functions.

Technology Used: CMOS

The use of CMOS technology ensures a good balance between performance, power consumption, and versatility.

No. of Inputs: 296

With a high number of inputs, this FPGA can handle a wide range of input signals for diverse applications.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easier placement on the PCB.

Form Of Terminal: BALL

Ball terminals enable secure connections and facilitate easy soldering during assembly.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2 V is commonly used in many electronic systems, ensuring compatibility.

Power Supplies (V): 1.2, 2.5/3.3

The availability of multiple power supply options allows for flexibility in design and compatibility with different systems.

No. of Terminals: 484

The high number of terminals provides ample connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a FPGA, this IC offers reconfigurability and customization, making it suitable for prototyping and fast development cycles.

Package Style (Meter): GRID ARRAY

The grid array package style provides a reliable and robust mechanical connection to the PCB.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures compatibility with low-power applications and extends battery life.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable performance in harsh environments.

Pitch Of Terminal: 1 mm

The tight pitch of terminals enables high-density mounting on the PCB, maximizing space efficiency.

Maximum Combinatorial Delay of a CLB: 0.26 ns

The low combinatorial delay ensures fast processing of logic functions, enhancing overall system performance.

Organization: 3411 CLBS

The organized structure of 3411 CLBs simplifies logic design and implementation, improving efficiency.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range ensures reliable performance in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on terminals enhances conductivity and reliability of connections.

Position Of Terminal: BOTTOM

Bottom-mounted terminals make it easier to route traces on the PCB and improve signal integrity.

Moisture Sensitivity Level (MSL): 3

A MSL of 3 indicates moderate sensitivity to moisture, requiring proper storage and handling procedures.

Maximum Seated Height: 2.6 mm

The low seated height allows for slim and compact designs, ideal for space-constrained applications.

Width: 23 mm

The width of 23 mm is suitable for various PCB sizes, offering flexibility in board layout and design.

Maximum Clock Frequency: 667 MHz

The high maximum clock frequency allows for fast data processing and real-time operations in applications.

No. of Outputs: 296

With a high number of outputs, this FPGA can drive multiple loads and provide rich output capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

This FPGA can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable solder joints during assembly.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance of 250°C enables robust soldering processes for secure connections.

Length: 23 mm

The length of 23 mm is suitable for various PCB sizes, providing flexibility in board layout and design.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX45T-2FGG484C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

43661

No. of Inputs:

296

No. of Outputs:

296

No. of CLBs:

3411

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

3411 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX45T-2FGG484C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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