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XC7A200T-2FFG1156I

Xilinx

XC7A200T-2FFG1156I by Xilinx

XC7A200T-2FFG1156I by Xilinx is a Field Programmable Gate Array (FPGA) with 215360 logic cells. It has a max clock frequency of 1286 MHz and can operate at temperatures up to 100°C. This FPGA is commonly used in industrial applications requiring high-speed processing and programmability.

Median Price

$471.090

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Mouser Electronics

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Advanced Electronics

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Texas Native Microelectronics

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Kenton Components

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Semicontronic

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Argo Parts USA

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XScomponents

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Overview

Experience the power of innovation with the XC7A200T-2FFG1156I by Xilinx, a leading manufacturer in Field Programmable Gate Arrays (FPGA). With its cutting-edge technology and unrivaled quality, this versatile device offers endless possibilities for your applications. Discover the advantages of its 215360 logic cells and 16825 CLBs, providing you with exceptional performance and flexibility. Its compact design and surface mount capability make it easy to integrate into any project. Whether you're in the industrial or consumer electronics field, the XC7A200T-2FFG1156I will exceed your expectations, delivering value, benefits, and unmatched advantages to your customers. Unlock the future of technology with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This FPGA is designed with a plastic/epoxy package body material, ensuring durability and reliability for long-term use in various environments.

No. of Logic Cells: 215360

With a large number of logic cells, this FPGA can support complex logic functions and accommodate larger-scale designs, making it suitable for demanding applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation, making this FPGA suitable for high-volume production and automated assembly processes.

Maximum Supply Voltage: 1.05 V

Operating with a maximum supply voltage of 1.05 V, this FPGA provides enhanced power efficiency and reduces the risk of damage due to excessive voltage levels.

No. of CLBs: 16825

The high number of configurable logic blocks (CLBs) in this FPGA enables versatile and flexible implementation of complex digital circuits, making it a preferred choice for advanced designs.

No. of Inputs: 500

With 500 inputs, this FPGA can accommodate a wide range of input signals, allowing for connectivity with various external devices and interfaces.

Package Shape: SQUARE

The square shape of the package provides a compact form factor, making it easier to integrate this FPGA into space-constrained systems or PCB layouts.

Form Of Terminal: BALL

Featuring terminal balls, this FPGA facilitates reliable solder connections and improves signal integrity, ensuring robust performance in demanding applications.

No. of Terminals: 1156

With 1156 terminals, this FPGA offers ample connectivity options for interfacing with other components and devices, enabling seamless integration within complex electronic systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array, this IC provides the flexibility to be reconfigured and customized for specific applications, making it highly versatile and adaptable.

Package Style (Meter): GRID ARRAY

The grid array package style offers higher contact density and improved electrical performance, enhancing signal transmission and making this FPGA ideal for high-speed applications.

Minimum Supply Voltage: 0.95 V

Operating with a minimum supply voltage of 0.95 V, this FPGA ensures compatibility with low-voltage power sources, enabling energy-efficient and low-power designs.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this FPGA can withstand high-temperature environments, making it suitable for industrial and automotive applications.

Pitch Of Terminal: 1 mm

The 1 mm terminal pitch provides a standardized and widely used interface, simplifying PCB layout and enabling easy integration with other components.

Maximum Combinatorial Delay of a CLB: 1.05 ns

Having a maximum combinational delay of 1.05 ns ensures fast and efficient data processing, making this FPGA suitable for applications that require real-time operations.

Organization: 16825 CLBS

With an organizational structure of 16825 configurable logic blocks (CLBs), this FPGA allows for efficient utilization of resources and supports complex designs with optimal performance.

Minimum Operating Temperature: -40 °C

Operating within a wide temperature range, including a minimum of -40°C, makes this FPGA suitable for both harsh and extreme temperature environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals enhances corrosion resistance and solderability, ensuring reliable connections and improved product lifespan.

Position Of Terminal: BOTTOM

The bottom position of the terminals facilitates easy and convenient PCB integration, allowing for simplified assembly processes and efficient routing of signals.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this FPGA is designed to withstand typical levels of humidity during storage and assembly, ensuring product reliability and preventing moisture-related issues.

Maximum Seated Height: 3.1 mm

The low seated height of 3.1 mm enables this FPGA to be utilized in space-constrained applications and allows for efficient thermal management and cooling.

Width: 35 mm

The compact width of 35 mm ensures compatibility with standardized PCB footprints and simplifies the design process, making integration of this FPGA into existing systems easier.

Maximum Clock Frequency: 1286 MHz

Operating at a maximum clock frequency of 1286 MHz, this FPGA facilitates high-speed data processing and enables real-time performance in demanding applications.

No. of Outputs: 500

With 500 outputs, this FPGA provides ample options for driving external devices and interfaces, allowing for efficient communication and signal routing.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures reliable and robust solder joints during the assembly process, enhancing the overall product quality and longevity.

Peak Reflow Temperature °C: 245

With a peak reflow temperature of 245°C, this FPGA can endure high-temperature soldering processes, facilitating smooth and efficient manufacturing processes.

Length: 35 mm

The length of 35 mm offers a compact form factor, making this FPGA suitable for applications where space is limited and allowing for efficient utilization of PCB real estate.

Grading Of Temperature: INDUSTRIAL

Designed to operate in industrial temperature ranges, this FPGA is capable of withstanding extreme temperature variations and harsh environmental conditions, ensuring reliable performance in demanding industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A200T-2FFG1156I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

215360

No. of Inputs:

500

No. of Outputs:

500

No. of CLBs:

16825

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

16825 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.1 mm

Package Equivalence Code:

BGA1156,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1156

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A200T-2FFG1156I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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