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M2GL010-TQG144

Microchip Technology

M2GL010-TQG144 by Microchip Technology

M2GL010-TQG144 by Microchip Technology is a Field Programmable Gate Array (FPGA) with 144 terminals. It operates b/w 0-85°C, with supply voltage ranging from 1.14V to 1.26V. Ideal for applications requiring low profile, fine pitch package style in plastic/epoxy material.

Median Price

$17.412

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4 parts In-Stock

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$6.533

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Verical

USA . 4 parts In-Stock

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$6.533

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$6.533

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DigiKey

USA . 69 parts In-Stock

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$28.290

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$25.730

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69

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$25.730

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Microchip Technology

USA . 5 parts In-Stock

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$28.290

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$25.730

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$15.360

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5

$28.290

$25.730

$15.360

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Distributors (In-Stock)

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Digiode

USA . 239 parts In-Stock

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$23.874

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Nova Conductors

Japan . 50 parts In-Stock

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$26.550

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Vyrian

USA . 5,645 parts In-Stock

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Chip Stock

USA . 1,183 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 779 parts In-Stock

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$11.124

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Semicontronic

India . 48 parts In-Stock

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$21.360

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$20.826

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$20.719

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48

$21.360

$20.826

$20.719

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Ampacity Inc.

Singapore . 29 parts In-Stock

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$21.360

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Corphita

USA . 85 parts In-Stock

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Continental Prestige Electronics

USA . 4,281 parts In-Stock

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$26.550

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$26.019

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Netroflash

USA . 500 parts In-Stock

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$26.550

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$26.550

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$41.866

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$39.773

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$39.773

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$41.866

$39.773

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Aztec Data Supply Inc.

USA . 2,790 parts In-Stock

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$42.155

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2,790

$42.155

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Corohmni

South Africa . 87 parts In-Stock

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$156.955

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Argo Parts USA

USA . 2,705 parts In-Stock

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Fulton Briggs Corp.

USA . 1,663 parts In-Stock

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Overview

Unlock endless possibilities with the M2GL010-TQG144 by Microchip Technology. This top-quality Field Programmable Gate Array (FPGA) boasts unmatched reliability and performance, making it the ideal choice for a wide range of applications. From telecommunications to automotive electronics, this versatile product delivers exceptional value, benefits, and advantages to customers looking for innovation and cutting-edge technology. Experience the difference with Microchip Technology's M2GL010-TQG144 FPGA today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the components inside, making the FPGA resilient to handling and environmental factors.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving both time and effort during production.

Maximum Supply Voltage: 1.26 V

Higher maximum supply voltage ensures stability and efficient performance of the FPGA.

Minimum Supply Voltage: 1.14 V

Lower minimum supply voltage allows for energy efficiency and potentially longer battery life in portable devices using this FPGA.

Package Shape: SQUARE

Square package shape provides uniformity and ease of integration into circuit designs.

No. of Terminals: 144

Having 144 terminals allows for a higher level of connectivity and versatility in the FPGA's application.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FPGA can handle demanding industrial or automotive environments.

Pitch Of Terminal: 0.5 mm

A small pitch of terminals enables high density integration and compact designs, making this FPGA suitable for space-constrained applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the FPGA has a moderate reflow sensitivity, allowing for standard reflow processes during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and connection of the FPGA during production.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M2GL010-TQG144 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

20 mm

Width:

20 mm

Maximum Seated Height:

1.6 mm

Packing Method:

Tray

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

144

Standards

JESD-30 Code:

S-PQFP-G144

Trade Compliance

M2GL010-TQG144 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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