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LCMXO3LF-9400C-6BG256C

Lattice Semiconductor

LCMXO3LF-9400C-6BG256C by Lattice Semiconductor

LCMXO3LF-9400C-6BG256C by Lattice Semiconductor is a 1175 CLBs FPGA with max supply voltage of 3.465V and operating temp up to 85°C. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

Median Price

$26.290

Lifecycle Status

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Verical

USA . 78 parts In-Stock

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$20.049

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Chip1Stop

Japan . 94 parts In-Stock

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$23.200

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Farnell

UK . 35 parts In-Stock

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$25.110

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$21.370

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Future Electronics

Canada . 1,884 parts In-Stock

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$25.580

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$24.360

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Mouser Electronics

USA . 1 parts In-Stock

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$27.000

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$23.550

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$22.590

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Newark

USA . 151 parts In-Stock

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$27.810

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$22.400

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Element14

Singapore . 47 parts In-Stock

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Adafruit Industries

USA . 500 parts In-Stock

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$57.453

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$54.581

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$57.453

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Bristol Electronics

USA . 158 parts In-Stock

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$18.300

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$14.823

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Nova Conductors

Japan . 550 parts In-Stock

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$20.640

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Component Sense

UK . 25,127 parts In-Stock

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Vyrian

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Dan-Mar Components

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Chip Stock

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Cyclops Electronics Ltd

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Semicontronic

India . 327 parts In-Stock

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$16.660

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$16.244

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$16.160

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Ampacity Inc.

Singapore . 121 parts In-Stock

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$16.660

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Continental Prestige Electronics

USA . 69 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$20.640

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$19.608

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$19.195

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$20.640

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$19.195

Microchip USA

USA . 1,424 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$57.453

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$54.581

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Aztec Data Supply Inc.

USA . 86 parts In-Stock

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Corohmni

South Africa . 237 parts In-Stock

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Argo Parts USA

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Authorized Procurement Solutions

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Robosynatics

Brazil . 1,500 parts In-Stock

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$2.077

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Lucentia Tech

USA . 1,500 parts In-Stock

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$2.077

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Overview

Unlock limitless possibilities with the LCMXO3LF-9400C-6BG256C by Lattice Semiconductor. As a leading manufacturer in Field Programmable Gate Arrays (FPGA), this innovative product offers unparalleled flexibility and customization for a wide range of applications. With a low profile, fine pitch package style and a grid array design, this FPGA boasts 1175 CLBs and 256 terminals, allowing you to create complex designs with ease. Experience the reliability and high performance that comes with Lattice Semiconductor products, and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy material makes this FPGA lightweight and cost-effective.

Surface Mount: YES

With the ability to be surface mounted, this FPGA can be easily integrated into various electronics projects.

Maximum Supply Voltage: 3.465 V

This high maximum supply voltage allows for flexibility in power supply options for the FPGA.

No. of CLBs: 1175

With a high number of Configurable Logic Blocks, this FPGA offers a wide range of programmable functions.

Package Shape: SQUARE

The square package shape optimizes space utilization and makes it easy to mount on PCBs.

Form Of Terminal: BALL

The ball terminals ensure a reliable connection and ease of installation for this FPGA.

Nominal Supply Voltage (V): 2.5

The nominal supply voltage of 2.5V provides stable performance for the FPGA.

No. of Terminals: 256

With a high number of terminals, this FPGA can handle complex input/output configurations.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array allows for customization and adaptability in various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style with low profile and fine pitch enables high-density mounting and efficient PCB layout.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage requirement enhances energy efficiency for the FPGA.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions.

Pitch Of Terminal: 0.8 mm

The small terminal pitch allows for compact design and space-saving integration of the FPGA.

Organization: 1175 CLBS

The organization of 1175 Configurable Logic Blocks offers a high degree of customization and functionality for the FPGA.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this FPGA can operate in a wide range of environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper as finishing materials ensures reliable contacts and long-term durability for the FPGA.

Position Of Terminal: BOTTOM

The terminal position at the bottom facilitates easy PCB mounting and efficient signal routing.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this FPGA is suitable for a variety of humidity conditions.

Maximum Seated Height: 1.7 mm

The low maximum seated height of 1.7mm allows for compact and space-efficient PCB design with this FPGA.

Width: 14 mm

The moderate width of 14mm makes this FPGA suitable for a range of board sizes and configurations.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand 30 seconds at peak reflow temperature ensures reliability during soldering processes.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, this FPGA can be used in high-temperature soldering environments.

Length: 14 mm

The compact length of 14 mm allows for efficient use of space on the PCB when integrating this FPGA.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO3LF-9400C-6BG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of CLBs:

1175

Organization:

1175 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

3.465 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.7 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Trade Compliance

LCMXO3LF-9400C-6BG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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