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M2GL025-FGG484I

Microchip Technology

M2GL025-FGG484I by Microchip Technology

M2GL025-FGG484I by Microchip Technology is a CMOS FPGA with 27696 logic cells, 267 inputs/outputs, and operates at 1.2V. Ideal for industrial applications requiring high-performance computing in a compact 23x23mm grid array package with bottom terminals for surface mounting.

Median Price

$79.835

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 63 parts In-Stock

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$82.300

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$74.800

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$44.660

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$82.300

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Richardson RFPD

USA . 20 parts In-Stock

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$77.370

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Nova Conductors

Japan . 300 parts In-Stock

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$76.076

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$76.076

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Digiode

USA . 469 parts In-Stock

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$78.185

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IBS Electronics

USA . 40 parts In-Stock

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$107.740

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Vyrian

USA . 3,652 parts In-Stock

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Chip Stock

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Prism Electronics

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AZTECH Wire

Italy . 318 parts In-Stock

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$8.688

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Aztec Data Supply Inc.

USA . 3,235 parts In-Stock

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$33.988

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Semicontronic

India . 61 parts In-Stock

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$69.950

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$68.201

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$67.852

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Ampacity Inc.

Singapore . 50 parts In-Stock

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$69.950

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Corphita

USA . 374 parts In-Stock

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$74.070

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Continental Prestige Electronics

USA . 295 parts In-Stock

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$76.076

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Advanced Electronics

New Zealand . 1,695 parts In-Stock

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$138.070

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$131.167

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Corohmni

South Africa . 811 parts In-Stock

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Argo Parts USA

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Robosynatics

Brazil . 950 parts In-Stock

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Lucentia Tech

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West Coast Incorporated

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GreenTree Electronics

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Eastek

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Overview

Looking for top-quality Field Programmable Gate Arrays? Look no further than the M2GL025-FGG484I by Microchip Technology. With 27696 logic cells and 267 inputs/outputs, this FPGA is perfect for a wide range of applications. From industrial automation to telecommunications, this versatile device offers unparalleled value and performance. Trust in Microchip's reputation for excellence and innovation to take your projects to the next level. Experience the benefits of cutting-edge technology with the M2GL025-FGG484I!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the FPGA, making it a reliable choice for various applications.

No. of Logic Cells: 27696

With a large number of logic cells, this FPGA offers high flexibility and customization for complex designs.

Surface Mount: YES

Being surface mountable makes installation and integration of this FPGA easy and efficient.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage allows for greater power capabilities and performance of the FPGA.

Technology Used: CMOS

CMOS technology ensures low power consumption and high speed operation for efficient FPGA processing.

No. of Inputs: 267

With a large number of inputs, this FPGA can handle a wide range of input signals, enabling versatile functionality.

Package Shape: SQUARE

The square shape of the package offers a compact design, saving space in electronic circuits.

Form Of Terminal: BALL

The ball terminal design provides secure connections and reliable conductivity for the FPGA.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures stable and consistent power delivery to the FPGA.

Packing Method: TRAY

The tray packing method simplifies storage and transportation of the FPGA, ensuring convenience for users.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M2GL025-FGG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

27696

No. of Inputs:

267

No. of Outputs:

267

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.44 mm

Packing Method:

Tray

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Qualified:

No

Trade Compliance

M2GL025-FGG484I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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