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10M40DCF484C8G

Intel

10M40DCF484C8G by Intel

Intel's 10M40DCF484C8G FPGA boasts 40000 logic cells, 2500 CLBs, and 500 inputs/outputs. Ideal for applications requiring high-speed data processing and complex algorithm implementation in fields like telecommunications and industrial automation.

Median Price

$124.160

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DigiKey

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Nova Conductors

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Digiode

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Vyrian

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Sensible Micro Corp

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AZTECH Wire

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Modulus Dynamics

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Vigor

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MARBEL Systems

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Corohmni

South Africa . 385 parts In-Stock

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Continental Prestige Electronics

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Netroflash

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Corphita

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One Stop Electronics

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Semicontronic

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Ampacity Inc.

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Kenton Components

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Microchip USA

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Texas Native Microelectronics

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A-Z Elektronik GmbH

Germany . 7,560 parts In-Stock

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Argo Parts USA

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Supply Digital

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Qasali Group International

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Overview

Unlock limitless possibilities with the Intel 10M40DCF484C8G Field Programmable Gate Array (FPGA). Crafted by the industry-leading manufacturer, Intel, this FPGA boasts 40000 logic cells and 2500 CLBs, offering unparalleled flexibility for a wide range of applications. With 500 inputs and outputs, this FPGA is designed to deliver high performance and reliability. Elevate your projects with this cutting-edge technology and embrace the power of innovation. Experience the next level of computing with Intel's premium quality FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

No. of Logic Cells: 40000

With a high number of logic cells, this FPGA offers ample capacity for complex programmable logic designs.

Maximum Supply Voltage: 1.25 V

The high maximum supply voltage allows for flexibility in power requirements.

Surface Mount: YES

Being surface mountable simplifies the assembly process and enables space-saving in applications.

No. of CLBs: 2500

The large number of Configurable Logic Blocks (CLBs) provides versatility in implementing logic functions.

No. of Inputs: 500

Having a high number of inputs allows for extensive connectivity and input options in designs.

Package Shape: SQUARE

The square package shape facilitates easier integration and placement on circuit boards.

Nominal Supply Voltage (V): 1.2

The consistent nominal supply voltage ensures stable performance in various operating conditions.

Form Of Terminal: BALL

Ball terminals provide reliable connections and enable good heat dissipation during operation.

Power Supplies (V): 1.2

The presence of multiple power supplies at 1.2V supports different voltage requirements within the FPGA.

No. of Terminals: 484

Having a high number of terminals allows for enhanced connectivity options and signal routing flexibility.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device offers reconfigurability and flexibility for custom logic implementation.

Package Style (Meter): GRID ARRAY

The grid array package style ensures easy alignment and integration with other components on the PCB.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage supports energy-efficient operation and aids in reducing power consumption.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable performance in demanding environments.

Pitch Of Terminal: 1 mm

The small pitch of terminals enables high-density mounting and space-saving in circuit board designs.

Organization: 2500 CLBS

The well-organized structure of 2500 Configurable Logic Blocks (CLBs) simplifies design implementation and logic routing.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures operational reliability even in extreme cold conditions.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin/silver/copper finishing on terminals enhances conductivity and corrosion resistance for long-term durability.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom facilitates easier PCB layout and routing of signals.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the FPGA can withstand moderate exposure to moisture during handling and storage.

Maximum Seated Height: 2 mm

The low maximum seated height allows for thin and compact overall PCB designs.

Width: 23 mm

The moderate width of 23mm offers a good balance between space-saving and ease of handling during assembly.

No. of Outputs: 500

Having a high number of outputs provides flexibility in routing logic signals and interfacing with external components.

Length: 23 mm

The overall length of 23mm complements the square package shape for a compact and streamlined form factor.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M40DCF484C8G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

40000

No. of Inputs:

500

No. of Outputs:

500

No. of CLBs:

2500

Sub-Category:

Field Programmable Gate Arrays

Organization:

2500 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

10M40DCF484C8G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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