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5CEBA2F23C8N

Intel

5CEBA2F23C8N by Intel

5CEBA2F23C8N by Intel is a FPGA with 25000 logic cells, 224 inputs/outputs, and operates at a max temp of 85°C. It is used in applications requiring high-speed processing and programmable ICs for various industries. The package style is grid array with a square shape and measures 23mm x 23mm.

Median Price

$49.840

Lifecycle Status

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Arrow

USA . 120 parts In-Stock

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Verical

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Digiode

USA . 474 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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VNN

France . 13,896 parts In-Stock

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Vyrian

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Modulus Dynamics

Lithuania . 672 parts In-Stock

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$20.586

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Semicontronic

India . 360 parts In-Stock

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$42.360

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$41.301

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$41.089

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Ampacity Inc.

Singapore . 41 parts In-Stock

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Corphita

USA . 735 parts In-Stock

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Component Stockers USA

USA . 1,561 parts In-Stock

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$47.960

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Corohmni

South Africa . 168 parts In-Stock

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Advanced Electronics

New Zealand . 96 parts In-Stock

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Aztec Data Supply Inc.

USA . 708 parts In-Stock

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$51.650

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Netroflash

USA . 2,000 parts In-Stock

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$54.820

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$52.079

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$50.983

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Continental Prestige Electronics

USA . 825 parts In-Stock

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$54.820

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Microchip USA

USA . 2,785 parts In-Stock

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$55.320

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MARBEL Systems

Belgium . 2,773 parts In-Stock

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$60.816

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$58.384

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Texas Native Microelectronics

USA . 95 parts In-Stock

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Kenton Components

USA . 233 parts In-Stock

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$83.885

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Lixinc

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Perfect Parts

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Argo Parts USA

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Qasali Group International

UK . 1,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 746 parts In-Stock

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RC Electronics

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Lucentia Tech

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Supply Digital

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Futuretech Components

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Overview

Unlock the potential of your projects with the 5CEBA2F23C8N by Intel. This top-quality Field Programmable Gate Array (FPGA) offers a multitude of applications, from advanced robotics to cutting-edge IoT solutions. With 25,000 logic cells and 224 inputs and outputs, this FPGA provides unparalleled flexibility and performance. Intel's reputation for excellence ensures that you are getting a reliable and innovative product that will exceed your expectations. Transform your designs with the 5CEBA2F23C8N and experience the value and benefits that only Intel can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the FPGA, ensuring a long lifespan and reliable performance.

No. of Logic Cells: 25000

Allows for complex logic functions to be implemented, making it suitable for a wide range of applications.

Surface Mount: YES

Facilitates easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 1.13 V

Operates within a safe voltage range, protecting the FPGA from potential damage.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the FPGA.

No. of Inputs: 224

Provides ample input options for connecting various external devices and signals to the FPGA.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB space, optimizing layout design.

Form Of Terminal: BALL

Ball terminal design ensures reliable electrical connections and simplifies the mounting process.

Nominal Supply Voltage (V): 1.1

Stable nominal supply voltage helps maintain consistent performance of the FPGA.

Power Supplies (V): 1.1,1.2/3.3,2.5

Flexible power supply options accommodate different voltage requirements, enhancing compatibility with various systems.

No. of Terminals: 484

Sufficient number of terminals for connectivity, allowing for versatile integration with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA offers reconfigurable logic, allowing for customization of functionality and adapting to changing requirements.

Package Style (Meter): GRID ARRAY

Grid array package style provides efficient routing and interconnect options, enhancing signal integrity.

Minimum Supply Voltage: 1.07 V

Low minimum supply voltage ensures operation within safe limits, preventing damage to the FPGA.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Pitch Of Terminal: 1 mm

Narrow terminal pitch enables high-density mounting, optimizing PCB layout and saving space.

Minimum Operating Temperature: 0 °C

Suitable for operation in cold environments, offering versatility in temperature requirements.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

Provides good conductivity and corrosion resistance, ensuring reliable connections and long-term durability.

Position Of Terminal: BOTTOM

Bottom terminal position facilitates easy soldering and maintenance, simplifying assembly and repair processes.

Moisture Sensitivity Level (MSL): 3

MSL rating indicates the level of moisture sensitivity, important for storage and handling of the FPGA to prevent damage.

Maximum Seated Height: 2 mm

Low seated height allows for compact PCB design, reducing overall system size and optimizing space usage.

Width: 23 mm

Suitable width for integration into various electronic devices, providing flexibility in form factor design.

No. of Outputs: 224

Ample output options for delivering processed signals and data, enhancing the versatility of the FPGA.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal time for reflow soldering process, ensuring proper connection and reliability of the FPGA during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature capability allows for reliable soldering of the FPGA to the PCB, ensuring strong mechanical bond.

Length: 23 mm

Compact length for easy integration into electronic systems, suitable for space-constrained applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5CEBA2F23C8N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

25000

No. of Inputs:

224

No. of Outputs:

224

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Power Supplies:

1.1,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

5CEBA2F23C8N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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