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5CEBA4F23C7N

Intel

5CEBA4F23C7N by Intel

The Intel 5CEBA4F23C7N is a CMOS FPGA with 49000 logic cells and 224 inputs/outputs. It operates at a max supply voltage of 1.13V and is suitable for various applications requiring programmable gate arrays.

Median Price

$103.500

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DigiKey

USA . 74 parts In-Stock

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Mouser Electronics

USA . 56 parts In-Stock

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Verical

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IBS Electronics

USA . 22,547 parts In-Stock

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Digiode

USA . 431 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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France . 6,670 parts In-Stock

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Chip Stock

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AZTECH Wire

Italy . 386 parts In-Stock

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$19.107

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MARBEL Systems

Belgium . 600 parts In-Stock

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Texas Native Microelectronics

USA . 6,800 parts In-Stock

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Kenton Components

USA . 5,935 parts In-Stock

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Semicontronic

India . 58 parts In-Stock

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$70.170

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Ampacity Inc.

Singapore . 42 parts In-Stock

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Modulus Dynamics

Lithuania . 861 parts In-Stock

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Corphita

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$87.950

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Corohmni

South Africa . 436 parts In-Stock

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Continental Prestige Electronics

USA . 1,605 parts In-Stock

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Microchip USA

USA . 2,224 parts In-Stock

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Qasali Group International

UK . 4,139 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Argo Parts USA

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Authorized Procurement Solutions

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Supply Digital

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Netroflash

USA . 1,000 parts In-Stock

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Glotronic Ltd.

UK . 86 parts In-Stock

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Futuretech Components

Singapore . 60 parts In-Stock

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Overview

Discover endless possibilities with the 5CEBA4F23C7N by Intel. This high-quality Field Programmable Gate Array (FPGA) offers incredible flexibility and customization, allowing you to create innovative solutions tailored to your unique needs. With its 49,000 logic cells and 224 inputs and outputs, this FPGA is perfect for a wide range of applications. Whether you're in the automotive, telecommunications, or industrial sector, the 5CEBA4F23C7N provides unmatched performance and reliability. Experience the value and benefits of Intel's cutting-edge technology and unlock new opportunities for success.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material ensures durability and resilience, making the product suitable for various environments and long-term use.

No. of Logic Cells

49000 - With plenty of logic cells, this FPGA can handle complex and large-scale designs, providing ample resources for advanced applications.

Surface Mount

YES - The surface mount feature allows for easy and efficient installation on circuit boards, enhancing convenience and reducing production time.

Maximum Supply Voltage

1.13 V - This high maximum supply voltage enables the FPGA to operate within a wide range of power requirements, accommodating diverse system configurations.

Technology Used

CMOS - CMOS technology ensures low power consumption while delivering high-performance capabilities, making it an energy-efficient choice.

No. of Inputs

224 - With a generous number of inputs, this FPGA allows for extensive connectivity and data acquisition, accommodating large-scale systems and complex control requirements.

Package Shape

SQUARE - The square shape of the package offers efficient use of space when integrating the FPGA into circuit assemblies, optimizing board layout and overall design.

Form Of Terminal

BALL - The ball terminals provide reliable electrical connections, offering excellent signal integrity and ease of soldering during the production process.

Nominal Supply Voltage (V)

1.1 - This stable and appropriate nominal supply voltage ensures consistent and reliable performance of the FPGA, reducing the risk of system instability.

Power Supplies (V)

1.1,1.2/3.3,2.5 - The multiple power supply options enable compatibility with various power sources, providing flexibility and versatility in different applications.

No. of Terminals

484 - Having a generous number of terminals allows for extensive connectivity options and easy integration into complex circuit designs, facilitating seamless system integration.

Programmable IC Type

FIELD PROGRAMMABLE GATE ARRAY - Being a field programmable gate array (FPGA) means that this product offers reconfigurable hardware, allowing for customization and flexibility in application development.

Package Style (Meter)

GRID ARRAY - The grid array package style enhances thermal performance, facilitating effective heat dissipation and contributing to the overall reliability and longevity of the FPGA.

Minimum Supply Voltage

1.07 V - This low minimum supply voltage ensures compatibility with low-power systems while maintaining stable operation, enabling energy-efficient designs.

Maximum Operating Temperature

85 °C - The high maximum operating temperature tolerance enables the FPGA to function reliably in demanding environments with elevated temperatures, enhancing its suitability for industrial applications.

Pitch Of Terminal

1 mm - The small pitch of terminals allows for compact and densely populated circuit designs, optimizing board space utilization and enabling high-density integration.

Minimum Operating Temperature

0 °C - The low minimum operating temperature tolerance ensures that the FPGA can function reliably in cold environments, expanding its applicability in various temperature conditions.

Position Of Terminal

BOTTOM - The bottom position of the terminals simplifies vertical mounting, contributing to ease of assembly and reducing the risk of interference with neighboring components.

Maximum Seated Height

2 mm - The low maximum seated height allows for compact and slim designs, facilitating efficient board stacking and reducing overall system thickness.

Width

23 mm - With a moderate width, this FPGA can fit into various electronic systems and circuit designs, providing flexibility in space-constrained applications.

No. of Outputs

224 - Having a substantial number of outputs allows for extensive control and data distribution capabilities, making the FPGA suitable for applications requiring multiple interfaces.

Length

23 mm - The moderate length of the FPGA facilitates integration into different system layouts, allowing for versatile placement and minimizing space constraints.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5CEBA4F23C7N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

49000

No. of Inputs:

224

No. of Outputs:

224

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Power Supplies:

1.1,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Qualified:

No

Trade Compliance

5CEBA4F23C7N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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