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M2S090-FCS325

Microchip Technology

M2S090-FCS325 by Microchip Technology

Microchip Technology's M2S090-FCS325 FPGA boasts 86184 logic cells, 180 inputs/outputs, and a max supply voltage of 1.26V. Ideal for applications requiring high-performance computing in compact spaces with its thin profile grid array package style.

Median Price

$146.820

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 8 parts In-Stock

1+ parts

$146.820

100+ parts

$144.690

1k+ parts

$76.800

10k+ parts

-

8

$146.820

$144.690

$76.800

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 6 parts In-Stock

1+ parts

$142.630

100+ parts

$131.370

1k+ parts

$121.760

10k+ parts

-

6

$142.630

$131.370

$121.760

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$146.574

100+ parts

-

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50

$146.574

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Vyrian

USA . 6,184 parts In-Stock

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6,184

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Digiode

USA . 213 parts In-Stock

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213

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Distributors (Availability)

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Semicontronic

India . 170 parts In-Stock

1+ parts

$13.000

100+ parts

$12.675

1k+ parts

$12.610

10k+ parts

-

170

$13.000

$12.675

$12.610

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AZTECH Wire

Italy . 749 parts In-Stock

1+ parts

$13.434

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-

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749

$13.434

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Ampacity Inc.

Singapore . 461 parts In-Stock

1+ parts

$34.000

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461

$34.000

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Corohmni

South Africa . 484 parts In-Stock

1+ parts

$53.385

100+ parts

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484

$53.385

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Aztec Data Supply Inc.

USA . 723 parts In-Stock

1+ parts

$91.660

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723

$91.660

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$143.643

100+ parts

-

1k+ parts

$137.897

10k+ parts

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50

$143.643

-

$137.897

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Continental Prestige Electronics

USA . 1,456 parts In-Stock

1+ parts

$146.574

100+ parts

-

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10k+ parts

$143.643

1,456

$146.574

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-

$143.643

Advanced Electronics

New Zealand . 1,596 parts In-Stock

1+ parts

$176.786

100+ parts

$167.947

1k+ parts

$167.947

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1,596

$176.786

$167.947

$167.947

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Montano Global Distributors

Canada . 6,868 parts In-Stock

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6,868

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NIA Electronics

USA . 5,144 parts In-Stock

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Ledger Components

France . 5,144 parts In-Stock

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LMD Electronica

Estonia . 2,302 parts In-Stock

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LOOK Integrated Logistics

Peru . 650 parts In-Stock

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650

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Argo Parts USA

USA . 404 parts In-Stock

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404

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Corphita

USA . 366 parts In-Stock

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366

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Overview

Experience the superior quality and performance of the M2S090-FCS325 by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers cutting-edge Field Programmable Gate Arrays (FPGA) that provide unparalleled versatility and reliability. With a wide range of applications, this product offers customers exceptional value and benefits, making it the ideal choice for your next project. Trust Microchip Technology to deliver high-quality solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good mechanical strength and electrical insulation, ensuring durability and reliability.

No. of Logic Cells: 86184

High number of logic cells allow for complex programmable logic designs to be implemented efficiently.

Surface Mount: YES

Surface mount technology allows for easy and reliable PCB assembly.

Maximum Supply Voltage: 1.26 V

Operating within this voltage range ensures optimal performance and reliability.

No. of Inputs: 180

Having a high number of inputs allows for versatile input configurations.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into standard PCB layouts.

Form Of Terminal: BALL

Ball terminals provide reliable connections and easy installation.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage ensures consistent performance.

No. of Terminals: 325

Sufficient number of terminals for versatile connectivity options.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA allows for flexible and customizable logic designs, ideal for prototyping and product development.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style provides high density and compact footprint, suitable for space-constrained applications.

Minimum Supply Voltage: 1.14 V

Having a low minimum supply voltage allows for energy-efficient operation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environments.

Pitch Of Terminal: 0.5 mm

Small terminal pitch enables high-density packaging and layout flexibility.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments without compromising performance.

Finishing Of Terminal Used: TIN LEAD

Tin lead finish provides good solderability and reliable connections.

Position Of Terminal: BOTTOM

Bottom terminal position allows for easy PCB assembly and routing.

Maximum Seated Height: 1.16 mm

Low seated height facilitates compact system design and layout.

Width: 11 mm

Compact width allows for space-efficient board layout and integration.

No. of Outputs: 180

High number of outputs allow for versatile output configurations and signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

Quick reflow time ensures efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 240

High peak reflow temperature capability ensures reliable solder joints.

Length: 13.5 mm

Technical Specifications

Field Programmable Gate Arrays (FPGA) M2S090-FCS325 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

86184

No. of Inputs:

180

No. of Outputs:

180

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

240 °C (464 °F)

Peak Reflow Time:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

13.5 mm

Width:

11 mm

Maximum Seated Height:

1.16 mm

Package Equivalence Code:

BGA325,21X21,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

.5 mm

No. of Terminals:

325

Standards

JESD-30 Code:

R-PBGA-B325

Trade Compliance

M2S090-FCS325 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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