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M2S050T-1FGG484I

Microchip Technology

M2S050T-1FGG484I by Microchip Technology

Microchip Technology's M2S050T-1FGG484I is a FPGA with 56340 logic cells, 267 inputs/outputs, and operates at -40 to 100°C. It features a grid array package style, 484 terminals, and uses tin silver copper finishing. Ideal for applications requiring high-density programmable logic in compact spaces.

Median Price

$158.898

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 69 parts In-Stock

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$158.898

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Chip Stock

USA . 1,216 parts In-Stock

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Vyrian

USA . 280 parts In-Stock

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280

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Digiode

USA . 245 parts In-Stock

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Martec Srl

Italy . 5 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 203 parts In-Stock

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$6.656

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Ampacity Inc.

Singapore . 297 parts In-Stock

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$14.000

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Semicontronic

India . 581 parts In-Stock

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$19.000

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$18.525

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$18.430

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581

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Aztec Data Supply Inc.

USA . 923 parts In-Stock

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$22.130

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Continental Prestige Electronics

USA . 1,695 parts In-Stock

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$158.898

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$155.720

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Netroflash

USA . 50 parts In-Stock

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$158.898

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$150.953

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$147.775

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$160.130

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$160.130

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$160.130

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Corohmni

South Africa . 204 parts In-Stock

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$180.444

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Microchip USA

USA . 2,367 parts In-Stock

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$265.425

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Fulton Briggs Corp.

USA . 2,398 parts In-Stock

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Argo Parts USA

USA . 299 parts In-Stock

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Corphita

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Overview

Discover the power of innovation with the M2S050T-1FGG484I by Microchip Technology, a leading manufacturer in the field of Field Programmable Gate Arrays (FPGA). Designed with precision and quality in mind, this product offers customers unmatched performance and flexibility for a wide range of applications. From industrial automation to telecommunications, this FPGA is the key to unlocking endless possibilities. Experience the value and benefits that this cutting-edge technology brings to your projects, and take your designs to the next level with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection and durability for the FPGA, making it suitable for a variety of applications.

No. of Logic Cells: 56340

Offers a high level of logic cells, allowing for complex programmable configurations and designs.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.26 V

Ensures stable and reliable operation within the specified voltage range.

No. of Inputs: 267

Provides a sufficient number of inputs for connecting various external devices and components.

Package Shape: SQUARE

Offers a compact and uniform design, making it easy to integrate into different systems.

Form Of Terminal: BALL

Facilitates efficient and reliable electrical connections within the system.

Nominal Supply Voltage (V): 1.2

Specifies the standard operating voltage for the FPGA, ensuring compatibility with other components.

No. of Terminals: 484

Provides ample terminals for connecting to various external devices and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Offers flexibility and customization in logic functions, making it suitable for a wide range of applications.

Package Style (Meter): GRID ARRAY

Provides a systematic arrangement of terminals, simplifying the connection process during installation.

Minimum Supply Voltage: 1.14 V

Ensures stable operation even at lower voltage levels, increasing the versatility of the FPGA.

Maximum Operating Temperature: 100 °C

Can withstand high temperatures, making it suitable for industrial and harsh environments.

Pitch Of Terminal: 1 mm

Specifies the spacing between terminals, allowing for precise and efficient connections.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures, expanding the range of possible applications.

Finishing Of Terminal Used: TIN SILVER COPPER

Provides a reliable and corrosion-resistant finish for the terminals, ensuring long-term performance.

Position Of Terminal: BOTTOM

Facilitates easy and secure mounting on circuit boards, enhancing the overall reliability of the system.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring the longevity of the FPGA in various environmental conditions.

Maximum Seated Height: 2.44 mm

Has a low profile design, allowing for compact and space-efficient installations.

Width: 23 mm

Specifies the width of the FPGA, allowing for easy integration into different system designs.

No. of Outputs: 267

Provides a sufficient number of outputs for driving various external devices and components.

Maximum Time At Peak Reflow Temperature (s): 40

Indicates the duration the FPGA can withstand peak reflow temperature during assembly processes.

Peak Reflow Temperature °C: 250

Specifies the maximum temperature the FPGA can withstand during the reflow soldering process.

Length: 23 mm

Specifies the length of the FPGA, allowing for easy integration into different system layouts.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M2S050T-1FGG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

56340

No. of Inputs:

267

No. of Outputs:

267

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

40 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.44 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

M2S050T-1FGG484I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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