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XC7S6-2CSGA225I

Xilinx

XC7S6-2CSGA225I by Xilinx

Xilinx XC7S6-2CSGA225I FPGA offers 6000 logic cells, 469 CLBs, and 1286 MHz clock frequency. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style: Grid Array, Low Profile, Fine Pitch.

Median Price

$24.070

Lifecycle Status

Suppliers In-Stock

5

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1k+

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Digiode

USA . 51 parts In-Stock

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$22.866

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VNN

France . 451 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 267 parts In-Stock

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Vigor

Singapore . 414 parts In-Stock

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Ampacity Inc.

Singapore . 8 parts In-Stock

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Semicontronic

India . 8 parts In-Stock

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$19.948

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$19.846

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Corphita

USA . 227 parts In-Stock

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Component Stockers USA

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Aranea Global

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Continental Prestige Electronics

USA . 8 parts In-Stock

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MARBEL Systems

Belgium . 896 parts In-Stock

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Texas Native Microelectronics

USA . 90 parts In-Stock

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Kenton Components

USA . 323 parts In-Stock

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Corohmni

South Africa . 1,195 parts In-Stock

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Aztec Data Supply Inc.

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A-Z Elektronik GmbH

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Qasali Group International

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Supply Digital

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Argo Parts USA

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Overview

Unlock limitless possibilities with the XC7S6-2CSGA225I by Xilinx. As a leading manufacturer in the FPGA industry, Xilinx delivers top-quality products that cater to a wide range of applications. With 6000 logic cells and 469 CLBs, this FPGA offers unparalleled flexibility and performance. Whether you're designing innovative electronics, optimizing data processing, or enhancing communication systems, the XC7S6-2CSGA225I provides the power and reliability you need to bring your ideas to life. Elevate your projects with the cutting-edge technology and unmatched value of Xilinx's XC7S6-2CSGA225I FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the FPGA lightweight and cost-effective.

No. of Logic Cells: 6000

With a high number of logic cells, this FPGA can handle complex operations and calculations efficiently.

Surface Mount: YES

Being surface mountable makes it easy to integrate this FPGA onto a circuit board, reducing assembly time and costs.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage requirement helps in reducing power consumption and heat dissipation, making it energy-efficient.

No. of CLBs: 469

Having a high number of Configurable Logic Blocks (CLBs) allows for flexible and versatile programming options.

No. of Inputs: 100

A generous number of inputs enable the FPGA to handle multiple input signals simultaneously, increasing its versatility in various applications.

Package Shape: SQUARE

The square package shape allows for easy placement and alignment on a circuit board, optimizing board space utilization.

No. of Terminals: 225

Having a sufficient number of terminals provides versatility in connectivity and interfacing with other components in a circuit.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device allows for custom logic configurations and quick reprogramming when needed, making it suitable for prototyping and development.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style allows for high-density mounting and efficient heat dissipation, ideal for compact and high-performance applications.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage requirement increases compatibility with different power sources and improves power efficiency.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature range ensures reliable performance in harsh industrial environments.

Pitch Of Terminal: 0.8 mm

The small pitch of terminals enables high-density packaging and minimizes signal interference for improved performance.

Maximum Combinatorial Delay of a CLB: 1.05 ns

The low maximum combinatorial delay of a Configurable Logic Block (CLB) ensures fast response times and efficient logic operations.

Organization: 469 CLBs

The organized structure of 469 Configurable Logic Blocks (CLBs) allows for systematic logic design and implementation, enhancing programming efficiency.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures reliable performance even in extreme cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper as terminal finishing materials ensures good conductivity, corrosion resistance, and durability.

Position Of Terminal: BOTTOM

Having terminals at the bottom provides ease of soldering and connection to the circuit board, simplifying the assembly process.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for compact and slim designs, suitable for applications with space constraints.

Width: 13 mm

The compact width of 13 mm enables easy integration into various electronic systems and PCB layouts.

Maximum Clock Frequency: 1286 MHz

The high maximum clock frequency capability allows for fast processing speeds and real-time data handling in demanding applications.

No. of Outputs: 100

A generous number of outputs enables the FPGA to drive multiple external devices or interfaces, enhancing its functionality.

Length: 13 mm

The compact length of 13 mm complements the width and seated height specifications, making this FPGA suitable for space-constrained designs.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in challenging industrial environments with varying temperature conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7S6-2CSGA225I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

6000

No. of Inputs:

100

No. of Outputs:

100

No. of CLBs:

469

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Organization:

469 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

13 mm

Width:

13 mm

Maximum Seated Height:

1.4 mm

Package Equivalence Code:

BGA225,15X15,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

225

Standards

JESD-30 Code:

S-PBGA-B225

JESD-609 Code:

e1

Trade Compliance

XC7S6-2CSGA225I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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