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MPF100T-1FCG484I

Microchip Technology

MPF100T-1FCG484I by Microchip Technology

Microchip Technology's MPF100T-1FCG484I is a CMOS FPGA with 244 inputs/outputs, operating b/w -40 to 100°C. Its grid array package has 484 terminals on a 23x23mm square body, suitable for applications requiring programmable gate arrays in surface-mount technology.

Median Price

$203.450

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 17 parts In-Stock

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$203.450

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$169.530

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Digiode

USA . 109 parts In-Stock

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$237.072

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Vyrian

USA . 8,798 parts In-Stock

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Chip Stock

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Nova Conductors

Japan . 15 parts In-Stock

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AZTECH Wire

Italy . 255 parts In-Stock

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$7.109

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Aztec Data Supply Inc.

USA . 531 parts In-Stock

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$28.530

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$58.872

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$55.928

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$55.928

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Corohmni

South Africa . 93 parts In-Stock

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Vigor

Singapore . 236 parts In-Stock

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$205.260

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Ampacity Inc.

Singapore . 134 parts In-Stock

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Semicontronic

India . 125 parts In-Stock

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$206.817

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Corphita

USA . 84 parts In-Stock

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NIA Electronics

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France . 5,788 parts In-Stock

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LMD Electronica

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Continental Prestige Electronics

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Montano Global Distributors

Canada . 3,031 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 500 parts In-Stock

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LOOK Integrated Logistics

Peru . 227 parts In-Stock

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Overview

Experience the cutting-edge technology of the MPF100T-1FCG484I by Microchip Technology, a top-tier manufacturer renowned for quality and innovation. This Field Programmable Gate Array (FPGA) offers unparalleled versatility and performance in a compact package, making it ideal for a wide range of applications. Unlock endless possibilities with 244 inputs and outputs, superior CMOS technology, and a grid array package style. Elevate your projects with the MPF100T-1FCG484I and discover the value and benefits it brings to you!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good durability and protection for the FPGA, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount capability allows for easy installation and integration in electronic circuits.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage allows for flexibility in power options and compatibility with a wide range of systems.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA efficient and reliable.

No. of Inputs: 244

With a large number of inputs, this FPGA can handle complex tasks and process a significant amount of data.

Package Shape: SQUARE

Square package shape provides efficient use of space and easy mounting in circuit boards.

Form Of Terminal: BALL

Ball terminals ensure secure connections and reliable performance of the FPGA.

No. of Terminals: 484

High number of terminals allow for versatile connectivity options and greater functionality of the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array gives flexibility in terms of reconfiguration and customization for specific applications.

Package Style (Meter): GRID ARRAY

Grid array package style offers efficient routing of signals and compact design for the FPGA.

Minimum Supply Voltage: 0.97 V

Low minimum supply voltage allows for power-efficient operation and adaptability to different power sources.

Maximum Operating Temperature: 100 °C

High maximum operating temperature range ensures reliable performance in various temperature conditions.

Pitch Of Terminal: 1 mm

Terminal pitch of 1mm allows for precise connections and reduces the risk of signal interference.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the FPGA to be used in both extreme cold and hot environments.

Position Of Terminal: BOTTOM

Bottom terminal position facilitates easy integration and soldering of the FPGA onto circuit boards.

Maximum Seated Height: 2.87 mm

Low maximum seated height helps in compact design and placement of the FPGA in space-constrained applications.

Width: 23 mm

Narrow width of 23mm allows for efficient use of space on the circuit board and easy integration in electronic systems.

No. of Outputs: 244

With a large number of outputs, the FPGA can drive multiple devices and handle complex output signals effectively.

Length: 23 mm

Compact length of 23mm contributes to a space-saving design and easy placement of the FPGA on circuit boards.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF100T-1FCG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Inputs:

244

No. of Outputs:

244

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.87 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF100T-1FCG484I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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