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MPF100TLS-FCVG484I

Microchip Technology

MPF100TLS-FCVG484I by Microchip Technology

MPF100TLS-FCVG484I by Microchip: FPGA with 284 inputs/outputs, CMOS tech, 0.97V to 1.03V supply voltage range. Ideal for high-performance computing applications due to fine-pitch grid array package style and operating temp of -40°C to 100°C.

Median Price

$319.998

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 478 parts In-Stock

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Vyrian

USA . 8,583 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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Chip Stock

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AZTECH Wire

Italy . 638 parts In-Stock

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Ampacity Inc.

Singapore . 222 parts In-Stock

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Semicontronic

India . 1,387 parts In-Stock

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Corohmni

South Africa . 280 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,111 parts In-Stock

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Vigor

Singapore . 272 parts In-Stock

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Corphita

USA . 448 parts In-Stock

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Authorized Procurement Solutions

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Montano Global Distributors

Canada . 6,514 parts In-Stock

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LOOK Integrated Logistics

Peru . 6,367 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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LMD Electronica

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Overview

Elevate your projects with the MPF100TLS-FCVG484I by Microchip Technology, a top-tier manufacturer known for their innovative solutions in the FPGA category. This cutting-edge device offers unmatched performance and reliability, making it perfect for a wide range of applications. Experience seamless integration, high-quality design, and optimal functionality with this versatile product. Upgrade your projects today and unlock endless possibilities with the MPF100TLS-FCVG484I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and cost-efficiency.

Surface Mount: YES

Being surface mount allows for easy installation on PCBs, making it ideal for compact designs.

Maximum Supply Voltage: 1.03 V

The maximum supply voltage of 1.03 V ensures safe operation and compatibility with various systems.

Technology Used: CMOS

The CMOS technology used ensures low power consumption and high performance.

No. of Inputs: 284

With 284 inputs, this FPGA offers flexibility and versatility for various applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a PCB.

Form Of Terminal: BALL

The use of ball terminals simplifies the soldering process and enhances reliability.

No. of Terminals: 484

Having 484 terminals provides ample connectivity options for complex circuit designs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array offers customization and adaptability for different functions.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style optimizes signal integrity and thermal performance.

Minimum Supply Voltage: 0.97 V

The minimum supply voltage of 0.97 V ensures compatibility with low-power systems.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, this FPGA can withstand harsh environments.

Pitch Of Terminal: 0.8 mm

The small terminal pitch of 0.8 mm enables high-density mounting and connectivity.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for reliable performance in extreme conditions.

Position Of Terminal: BOTTOM

The bottom position of the terminals facilitates easy PCB layout and component placement.

Maximum Seated Height: 3.32 mm

The maximum seated height of 3.32 mm ensures compatibility with slim-profile designs.

Width: 19 mm

With a width of 19 mm, this FPGA is suitable for applications with space constraints.

No. of Outputs: 284

Having 284 outputs allows for signal routing and processing with ease.

Length: 19 mm

The length of 19 mm makes this FPGA a compact and space-efficient solution.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF100TLS-FCVG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Inputs:

284

No. of Outputs:

284

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

3.32 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF100TLS-FCVG484I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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