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MPF100TS-FCG484I

Microchip Technology

MPF100TS-FCG484I by Microchip Technology

MPF100TS-FCG484I by Microchip Technology is a CMOS FPGA with 244 inputs/outputs, operating b/w -40 to 100°C. Its grid array package has 484 terminals on a 23x23mm square body, suitable for applications requiring high-density programmable logic solutions.

Median Price

$203.450

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3 parts In-Stock

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$203.450

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$165.300

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$203.450

$165.300

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Digiode

USA . 67 parts In-Stock

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$257.393

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67

$257.393

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Vyrian

USA . 2,072 parts In-Stock

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2,072

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Chip Stock

USA . 1,356 parts In-Stock

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Nova Conductors

Japan . 56 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 826 parts In-Stock

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$16.711

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826

$16.711

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Corohmni

South Africa . 19 parts In-Stock

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$89.418

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Aztec Data Supply Inc.

USA . 3,971 parts In-Stock

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$90.630

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$90.630

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Vigor

Singapore . 622 parts In-Stock

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$205.260

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622

$205.260

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Ampacity Inc.

Singapore . 3 parts In-Stock

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$230.300

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3

$230.300

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Semicontronic

India . 3 parts In-Stock

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$230.300

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$224.542

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$223.391

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3

$230.300

$224.542

$223.391

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Corphita

USA . 285 parts In-Stock

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$243.846

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$243.846

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Montano Global Distributors

Canada . 8,245 parts In-Stock

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Argo Parts USA

USA . 4,646 parts In-Stock

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LOOK Integrated Logistics

Peru . 3,410 parts In-Stock

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NIA Electronics

USA . 2,780 parts In-Stock

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Ledger Components

France . 2,780 parts In-Stock

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2,780

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LMD Electronica

Estonia . 2,445 parts In-Stock

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Continental Prestige Electronics

USA . 887 parts In-Stock

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Bastille Electronics

Australia . 82 parts In-Stock

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Overview

Experience the cutting-edge technology of Microchip Technology with the MPF100TS-FCG484I FPGA. This high-quality field-programmable gate array offers unparalleled flexibility and performance for a wide range of applications. With its advanced CMOS technology and 244 inputs and outputs, this FPGA is perfect for demanding projects that require precision and reliability. Trust in Microchip Technology to deliver top-of-the-line products that exceed expectations and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and reliable housing for the FPGA, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Allows for easy and secure installation on printed circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.03 V

Operates efficiently within a low power supply range, reducing energy consumption and heat generation.

Technology Used: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for high performance and low power consumption.

No. of Inputs: 244

Offers a high number of input channels for versatile and complex logic configurations.

Package Shape: SQUARE

Provides a compact form factor, saving space in the design of electronic devices.

Form Of Terminal: BALL

Enables easy soldering and connection to the circuit board, ensuring a reliable electrical connection.

No. of Terminals: 484

Provides numerous connection points for interfacing with other components and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Offers flexibility and customization in designing complex digital circuits and systems.

Package Style (Meter): GRID ARRAY

Facilitates easy integration and placement on the PCB, enhancing the overall design efficiency.

Minimum Supply Voltage: 0.97 V

Supports operation at low voltages, enabling energy-efficient performance.

Maximum Operating Temperature: 100 °C

Operates reliably in high-temperature environments, ensuring consistent performance under varying conditions.

Pitch Of Terminal: 1 mm

Provides a standard spacing for easy soldering and connection during assembly.

Minimum Operating Temperature: -40 °C

Maintains functionality even in extremely low-temperature conditions, making it suitable for a wide range of applications.

Position Of Terminal: BOTTOM

Facilitates easy connection and integration into the circuit board layout, improving overall design efficiency.

Maximum Seated Height: 2.87 mm

Has a low profile design, saving space and allowing for compact electronic device designs.

Width: 23 mm

Provides a compact form factor, enabling efficient PCB layout and space-saving designs.

No. of Outputs: 244

Offers a high number of output channels for versatile and complex logic configurations.

Length: 23 mm

Optimizes space utilization and allows for compact system designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF100TS-FCG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Inputs:

244

No. of Outputs:

244

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.87 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF100TS-FCG484I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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