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MPF100T-FCG484T2

Microchip Technology

MPF100T-FCG484T2 by Microchip Technology

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

Median Price

$351.280

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 8 parts In-Stock

1+ parts

$351.280

100+ parts

$319.340

1k+ parts

$258.830

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8

$351.280

$319.340

$258.830

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Distributors (In-Stock)

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Digiode

USA . 214 parts In-Stock

1+ parts

$334.276

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214

$334.276

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Vyrian

USA . 373 parts In-Stock

1+ parts

$351.870

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373

$351.870

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Chip Stock

USA . 1,432 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 54 parts In-Stock

1+ parts

$299.090

100+ parts

$291.613

1k+ parts

$290.117

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54

$299.090

$291.613

$290.117

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Corphita

USA . 450 parts In-Stock

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$316.683

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$316.683

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LMD Electronica

Estonia . 3,762 parts In-Stock

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Montano Global Distributors

Canada . 2,648 parts In-Stock

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Microchip USA

USA . 2,637 parts In-Stock

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2,637

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NIA Electronics

USA . 1,983 parts In-Stock

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Ledger Components

France . 1,983 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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LOOK Integrated Logistics

Peru . 703 parts In-Stock

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703

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Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF100T-FCG484T2 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

109000

No. of Inputs:

284

No. of Outputs:

284

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.87 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF100T-FCG484T2 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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