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XC7A35T-1FGG484C

Xilinx

XC7A35T-1FGG484C by Xilinx

Xilinx XC7A35T-1FGG484C is a CMOS FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing like telecommunications, networking, and industrial automation. Package style: Grid Array, terminals: Ball grid array (BGA), operating temp range: 0-85°C.

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$94.950

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Overview

Unlock the power of innovation with the Xilinx XC7A35T-1FGG484C Field Programmable Gate Array. Designed by industry leader Xilinx, this FPGA offers unparalleled quality, reliability, and performance. Whether you're working on aerospace, automotive, or telecommunications projects, this versatile device provides endless possibilities for customization and optimization. Elevate your designs with the cutting-edge technology and advanced features that only Xilinx can deliver. Upgrade to the XC7A35T-1FGG484C today and experience the difference in quality, speed, and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable and rugged applications.

No. of Logic Cells: 33280

With a high number of logic cells, this FPGA allows for complex and advanced digital designs to be implemented efficiently.

Surface Mount: YES

The surface mount capability of this FPGA ensures easy and secure installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage requirement results in reduced power consumption and heat generation, making it energy-efficient.

No. of CLBs: 2600

The large number of Configurable Logic Blocks allows for versatile and customizable logic functions to be implemented effectively.

Technology Used: CMOS

Utilizing CMOS technology ensures high-speed performance and low power consumption, making it an efficient choice for digital circuit designs.

No. of Inputs: 250

The ample number of inputs allows for versatile connectivity options, enabling complex input/output configurations to be easily achieved.

Package Shape: SQUARE

The square shape of the package ensures efficient use of space on the PCB, making it suitable for compact and densely populated designs.

Form Of Terminal: BALL

The ball terminal design offers secure connections and easy soldering, ensuring reliable and stable electrical contact.

No. of Terminals: 484

The high number of terminals provides ample connectivity options for interfacing with external components and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers flexibility and reconfigurability, making it a versatile choice for prototyping and development.

Package Style (Meter): GRID ARRAY

The grid array package style provides a robust and secure mounting solution, ensuring stability and reliability in harsh operating conditions.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage requirement enables operation in low-power applications, making it suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions, ensuring reliable operation in challenging settings.

Pitch Of Terminal: 1 mm

The small pitch of terminals allows for high-density PCB layouts, facilitating compact and space-efficient designs.

Maximum Combinatorial Delay of a CLB: 1.27 ns

The low combinatorial delay of a Configurable Logic Block ensures fast signal processing and reduced latency in digital circuits.

Organization: 2600 CLBS

The organization of 2600 Configurable Logic Blocks provides a versatile platform for implementing complex logic functions and algorithms efficiently.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this FPGA can reliably operate in cold environments, making it suitable for a wide range of applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishes on terminals ensures excellent conductivity and corrosion resistance, enhancing the reliability and longevity of the connections.

Position Of Terminal: BOTTOM

The bottom position of terminals allows for easy routing of traces on the PCB, optimizing signal integrity and reducing interference.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this FPGA is resistant to moisture-induced damage, ensuring reliability in humid or damp environments.

Maximum Seated Height: 2.6 mm

The low maximum seated height of the package allows for compact and slim designs, making it suitable for space-constrained applications.

Width: 23 mm

The moderate width of the package provides a balance between space efficiency and robustness, making it suitable for a wide range of PCB layouts.

Maximum Clock Frequency: 1098 MHz

With a high maximum clock frequency, this FPGA can handle high-speed data processing and complex algorithms, making it ideal for demanding applications.

No. of Outputs: 250

The ample number of outputs allows for versatile signal routing options, enabling complex digital circuits to be efficiently implemented.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable soldering and thermal performance during assembly, minimizing the risk of damage.

Peak Reflow Temperature °C: 250

With a high peak reflow temperature of 250°C, this FPGA can withstand the rigors of soldering processes, ensuring robust and reliable connections.

Length: 23 mm

The moderate length of the package strikes a balance between space efficiency and compatibility with standard PCB sizes, making it easy to integrate into various designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A35T-1FGG484C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

33280

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

2600

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

2600 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A35T-1FGG484C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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