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XCAU20P-1SFVB784E

Xilinx

XCAU20P-1SFVB784E by Xilinx

Xilinx XCAU20P-1SFVB784E is a FPGA with 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. It operates b/w -40°C to 100°C, with supply voltage range of 0.825V to 0.876V. Ideal for applications requiring high-performance programmable ICs in compact form factors.

Median Price

$365.478

Lifecycle Status

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5

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1k+

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VNN

France . 185 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 684 parts In-Stock

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Ampacity Inc.

Singapore . 698 parts In-Stock

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Semicontronic

India . 689 parts In-Stock

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One Stop Electronics

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Corohmni

South Africa . 429 parts In-Stock

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MARBEL Systems

Belgium . 2,210 parts In-Stock

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Texas Native Microelectronics

USA . 43 parts In-Stock

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Kenton Components

USA . 75 parts In-Stock

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Modulus Dynamics

Lithuania . 736 parts In-Stock

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Aztec Data Supply Inc.

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Advanced Electronics

New Zealand . 702 parts In-Stock

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Continental Prestige Electronics

USA . 5,353 parts In-Stock

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Argo Parts USA

USA . 48 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Microchip USA

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Qasali Group International

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Overview

Unlock limitless possibilities with the Xilinx XCAU20P-1SFVB784E FPGA, a cutting-edge solution for your digital design needs. Manufactured by industry leader Xilinx, this field programmable gate array boasts 238,437 logic cells and 13625 CLBs, delivering unparalleled performance and flexibility. Whether you're in telecommunications, automotive, or aerospace, this FPGA offers unmatched value, enabling faster time-to-market and cost savings. Take your projects to the next level with the XCAU20P-1SFVB784E and experience the power of innovation at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers durability and can protect the internal components of the FPGA, making it a reliable choice for various applications.

No. of Logic Cells: 238437

Large number of logic cells provide flexibility and scalability for implementing complex designs and algorithms on the FPGA.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into different electronic systems or PCBs.

Maximum Supply Voltage: 0.876 V

Higher maximum supply voltage allows for improved performance and stability of the FPGA under various operating conditions.

No. of CLBs: 13625

Abundance of Configurable Logic Blocks (CLBs) provide ample resources for custom logic implementation and design flexibility.

No. of Inputs: 228

Plenty of input ports enable connections to external devices or sensors, expanding the capabilities of the FPGA in data processing and control applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space within a PCB layout, facilitating compact and streamlined designs.

Form Of Terminal: BALL

Ball terminals offer reliable connections and are suitable for high-density mounting configurations, ensuring secure connections with other components.

Nominal Supply Voltage (V): 0.85

Stable nominal supply voltage ensures consistent performance and reduces the risk of damage to the FPGA during operation.

No. of Terminals: 784

Large number of terminals provide sufficient connectivity options for interfacing with other circuitry, peripherals, and external devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, the FPGA allows for customization and reconfiguration of logic functions, making it versatile for a wide range of applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid array package style offers high density and precise alignment for mounting on PCBs, enabling efficient use of board space.

Minimum Supply Voltage: 0.825 V

Low minimum supply voltage provides energy efficiency and optimizes power consumption during operation, improving overall performance.

Maximum Operating Temperature: 100 °C

High maximum operating temperature range allows the FPGA to function reliably in a variety of thermal environments, promoting durability and stability.

Pitch Of Terminal: 0.8 mm

The terminal pitch of 0.8 mm facilitates precise and secure connections, enabling efficient signal transmission and reducing the risk of signal interference.

Organization: 13625 CLBS

Organized structure of 13625 Configurable Logic Blocks (CLBs) provides a systematic layout for logic resources, simplifying design implementation and management.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance even in cold conditions, making the FPGA suitable for a wide range of operating environments.

Position Of Terminal: BOTTOM

Terminal position at the bottom of the package allows for easy integration and connection with other components, enhancing the overall usability of the FPGA.

Maximum Seated Height: 3.32 mm

With a maximum seated height of 3.32 mm, the FPGA can be accommodated in compact spaces without obstructing surrounding components, enabling efficient PCB layout designs.

Width: 23 mm

Compact width of 23 mm provides space-saving benefits and allows for easy installation in diverse electronic systems or devices.

No. of Outputs: 228

Abundance of output ports enables the FPGA to deliver processed data or control signals to external devices, enhancing its communication and interface capabilities.

Length: 23 mm

Compact length of 23 mm contributes to the overall small form factor of the FPGA, enabling it to be integrated into tight spaces or applications with size constraints.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCAU20P-1SFVB784E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

238437

No. of Inputs:

228

No. of Outputs:

228

No. of CLBs:

13625

Organization:

13625 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

3.32 mm

Package Equivalence Code:

BGA784,28X28,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

Trade Compliance

XCAU20P-1SFVB784E Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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