Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Xilinx XCAU20P-1SFVB784E is a FPGA with 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. It operates b/w -40°C to 100°C, with supply voltage range of 0.825V to 0.876V. Ideal for applications requiring high-performance programmable ICs in compact form factors.
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Plastic/epoxy material offers durability and can protect the internal components of the FPGA, making it a reliable choice for various applications.
Large number of logic cells provide flexibility and scalability for implementing complex designs and algorithms on the FPGA.
Surface mount capability allows for easy installation and integration into different electronic systems or PCBs.
Higher maximum supply voltage allows for improved performance and stability of the FPGA under various operating conditions.
Abundance of Configurable Logic Blocks (CLBs) provide ample resources for custom logic implementation and design flexibility.
Plenty of input ports enable connections to external devices or sensors, expanding the capabilities of the FPGA in data processing and control applications.
Square package shape allows for efficient use of space within a PCB layout, facilitating compact and streamlined designs.
Ball terminals offer reliable connections and are suitable for high-density mounting configurations, ensuring secure connections with other components.
Stable nominal supply voltage ensures consistent performance and reduces the risk of damage to the FPGA during operation.
Large number of terminals provide sufficient connectivity options for interfacing with other circuitry, peripherals, and external devices.
Being a field-programmable device, the FPGA allows for customization and reconfiguration of logic functions, making it versatile for a wide range of applications.
Fine pitch grid array package style offers high density and precise alignment for mounting on PCBs, enabling efficient use of board space.
Low minimum supply voltage provides energy efficiency and optimizes power consumption during operation, improving overall performance.
High maximum operating temperature range allows the FPGA to function reliably in a variety of thermal environments, promoting durability and stability.
The terminal pitch of 0.8 mm facilitates precise and secure connections, enabling efficient signal transmission and reducing the risk of signal interference.
Organized structure of 13625 Configurable Logic Blocks (CLBs) provides a systematic layout for logic resources, simplifying design implementation and management.
Low minimum operating temperature ensures reliable performance even in cold conditions, making the FPGA suitable for a wide range of operating environments.
Terminal position at the bottom of the package allows for easy integration and connection with other components, enhancing the overall usability of the FPGA.
With a maximum seated height of 3.32 mm, the FPGA can be accommodated in compact spaces without obstructing surrounding components, enabling efficient PCB layout designs.
Compact width of 23 mm provides space-saving benefits and allows for easy installation in diverse electronic systems or devices.
Abundance of output ports enables the FPGA to deliver processed data or control signals to external devices, enhancing its communication and interface capabilities.
Compact length of 23 mm contributes to the overall small form factor of the FPGA, enabling it to be integrated into tight spaces or applications with size constraints.
Field Programmable Gate Arrays (FPGA) XCAU20P-1SFVB784E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XCAU20P-1SFVB784E Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
1N4148WS
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Semiconductor Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Laube Technology
261
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
LM358N
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
OPA2277UA
Texas Instruments
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
2N7002
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
MBRA340T3G
Onsemi
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
FDV304P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
M24308/2-1F
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
SN6505BDBVR
SN6505BDBVR by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -55 to 125°C and supports a max output current of 1.5A at supply voltages ranging from 2.25V to 5.5V. Ideal for military-grade applications requiring compact design and high reliability.
PAP-06V-S
J S T Mfg
PAP-06V-S by J S T Mfg is a 6-contact BOARD CONNECTOR with 94V-0 UL Flammability Code. It has FEMALE contacts, CRIMP termination, and comes WITH CABLE ASSEMBLY for CABLE mounting applications.
Vishay Intertechnology
Vishay Intertechnology's 1N4148WS is a single rectifier diode with a max forward voltage of 1V and output current of 0.15A. With a fast reverse recovery time of 0.004us, it operates up to 150°C. Ideal for applications requiring high-speed switching and low power consumption in surface mount configurations.
A3P125-VQG100I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC6SLX25T-2CSG324I
Xilinx
Xilinx XC6SLX25T-2CSG324I FPGA features 24051 logic cells, 1879 CLBs, and 190 inputs/outputs. Utilized in industrial applications, it operates at a max frequency of 667 MHz with a combinatorial delay of 0.26 ns per CLB. The package style is grid array with low profile and fine pitch terminals.
LFXP2-8E-5FTN256C
Lattice Semiconductor
LFXP2-8E-5FTN256C by Lattice Semiconductor is a 8000 logic cell FPGA with 201 inputs/outputs, operating at 435 MHz. It uses CMOS technology, has a max supply voltage of 1.26 V, and is suitable for applications requiring high-speed processing in compact electronic systems.
EP4CGX22CF19I7N
Intel
EP4CGX22CF19I7N by Intel is a FPGA with 21280 logic cells, 1330 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable IC capabilities. With a package style of grid array and low profile, it offers versatility in various electronic designs.
EP4CE22F17C8N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
LCMXO3L-1300C-5BG256C
LCMXO3L-1300C-5BG256C by Lattice Semiconductor is a 160 CLBs FPGA with max supply voltage of 3.465V and min operating temp of 0°C. Ideal for applications requiring low profile, fine pitch grid array package style with 256 terminals.
10M04SCU169A7G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
A3P250-FGG256I
Microchip Technology
A3P250-FGG256I by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 6144 CLBs and 250000 gates. It operates at a max clock frequency of 350 MHz and has a package style of GRID ARRAY. This FPGA is commonly used in industrial applications requiring high-speed processing and programmability.
EP4CE10F17C8N
EP4CE10F17C8N by Intel is a FPGA with 10320 logic cells and 179 inputs/outputs. Operating at a max frequency of 472.5 MHz, it's ideal for applications requiring high-speed processing like telecommunications and signal processing. With a low profile grid array package style, it offers flexibility in design and integration.
XC7S50-1CSGA324C
Xilinx XC7S50-1CSGA324C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.
EP3C16F484C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
XC7A50T-2CSG325I
XC7A50T-2CSG325I by Xilinx is a Field Programmable Gate Array (FPGA) with 52160 logic cells and 4075 configurable logic blocks (CLBs). It operates at a max clock frequency of 1286 MHz and is commonly used in industrial applications requiring high-speed processing.
XC6SLX45-3CSG324I
Xilinx XC6SLX45-3CSG324I FPGA features 43661 logic cells, 3411 CLBs, and 218 inputs/outputs. With a max clock frequency of 862 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. Operating temperature ranges from -40 to 100°C, making it suitable for various environments.
LFXP2-5E-5TN144I
LFXP2-5E-5TN144I by Lattice Semiconductor is a 5000 logic cell FPGA with 625 CLBs, operating at max 435 MHz. It has 100 inputs/outputs, uses CMOS tech, and supports supply voltages of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs like IoT devices or industrial automation systems.
A3P1000-FG144I
A3P1000-FG144I by Microchip is a CMOS FPGA with 24576 CLBs and 1000000 gates. It operates at a max frequency of 350 MHz, suitable for industrial applications requiring high-speed processing. With a low profile grid array package, it offers flexibility for various design requirements.
M2GL010T-FGG484I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
EP3C25F256C8NES
EP3C25F256C8NES by Altera is a plastic/epoxy FPGA with 24624 CLBs. It operates at a supply voltage range of 1.15V to 1.25V and supports a maximum clock frequency of 472.5 MHz. It has a low-profile, grid array package with 256 terminals.
LCMXO2-1200UHC-4FTG256C
LCMXO2-1200UHC-4FTG256C by Lattice Semiconductor is a 1280 logic cell FPGA with max clock freq of 133MHz. It operates at 2.5V nominal voltage and supports up to 206 inputs/outputs. Ideal for applications requiring high-speed processing in compact designs.
LCMXO3LF-6900C-5BG324C
LCMXO3LF-6900C-5BG324C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, operating b/w 0-85°C. It features a grid array package style, 0.8mm terminal pitch, and TIN SILVER COPPER finishing. Ideal for applications requiring low profile, fine pitch ICs in compact spaces.
10M50DAF256I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCAU25P-1SFVB784I
FIELD PROGRAMMABLE GATE ARRAY;
XCAU25P-1SFVB784E
XCAU25P-2FFVB676I
Xilinx XCAU25P-2FFVB676I FPGA features 308437 logic cells, 17625 CLBs, and 280 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V.
XCAU25P-2SFVB784E
XCAU20P-1SFVB784I
Xilinx XCAU20P-1SFVB784I FPGA offers 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 100°C. Package style: Grid Array, Fine Pitch.
XCAU10P-2UBVA368E
XCAU25P-L1FFVB676I
Xilinx XCAU25P-L1FFVB676I FPGA features 308437 logic cells, 17625 CLBs, and 208 inputs/outputs. With a package style of grid array and square shape, it is ideal for applications requiring high-performance programmable ICs in various industries. Operating temperature ranges from -40 to 100°C with a max supply voltage of 0.742V.
XCAU10P-2FFVB676I
XCAU10P-1UBVA368I
XCAU20P-L1FFVB676I
XCAU10P-2SBVB484I
XCAU20P-L1SFVB784I
XCAU20P-2SFVB784E
Xilinx XCAU20P-2SFVB784E FPGA offers 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor with a package style of grid array, fine pitch. Operating temperature range from 0 to 100°C makes it versatile for various industrial uses.
XCAU10P-1UBVA368E
XCAU10P-L1SBVB484I
XCAU10P-2UBVA368I
Xilinx XCAU10P-2UBVA368I FPGA features 96250 logic cells, 5500 CLBs, and 128 inputs/outputs. Ideal for applications requiring high-density programmable ICs in a compact GRID ARRAY package with low supply voltage and wide operating temperature range.
XCAU25P-L1SFVB784I
XCAU25P-2FFVB676E
XCAU10P-2SBVB484E
XCAU10P-L1UBVA368I
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