Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Xilinx XCAU25P-L1FFVB676I FPGA features 308437 logic cells, 17625 CLBs, and 208 inputs/outputs. With a package style of grid array and square shape, it is ideal for applications requiring high-performance programmable ICs in various industries. Operating temperature ranges from -40 to 100°C with a max supply voltage of 0.742V.
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Provides durability and protection for the internal components, ensuring a longer lifespan for the product.
Provides a high level of programmability and flexibility for designing complex logic circuits.
Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.
Ensures safe and stable operation within the specified voltage range, protecting the device from potential damage.
Offers a large number of Configurable Logic Blocks for implementing various logic functions, making it suitable for diverse applications.
Provides ample input channels for receiving external signals, enabling the device to process a wide range of input data efficiently.
Facilitates easy integration into square or rectangular layouts on circuit boards, optimizing space usage in electronic designs.
Allows for secure and reliable connections between the FPGA and other components, maintaining signal integrity in the circuit.
Indicates the recommended operating voltage for optimal performance and power efficiency of the FPGA.
Provides a sufficient number of terminals for connecting the FPGA to external devices and peripherals in a complex system.
Enables users to reconfigure the device's logic functions and behavior, allowing for customization and adaptability in different applications.
Facilitates easy alignment and mounting on circuit boards with a grid pattern of terminals, simplifying the assembly process.
Ensures stable operation even at lower voltage levels, providing flexibility in power supply requirements for the device.
Supports reliable operation under high temperature conditions, making it suitable for industrial and automotive applications.
Offers a standard terminal spacing for compatibility with common PCB designs and soldering processes, improving ease of installation.
Specifies the internal organization of the FPGA in terms of Configurable Logic Blocks, providing insight into its logic architecture and capabilities.
Ensures reliable performance even in harsh environments with low temperature conditions, increasing the device's suitability for varied applications.
Provides a reliable and durable finish for the terminals, ensuring good conductivity and resistance to corrosion for long-term performance.
Facilitates easy access and connection of the FPGA to other components on the circuit board, improving overall system integration and maintenance.
Indicates the level of protection against moisture exposure, ensuring the device's reliability in different operating environments.
Helps in determining the vertical clearance required for mounting the FPGA on a PCB, aiding in mechanical compatibility and design considerations.
Specifies the width dimension of the FPGA package, allowing for accurate placement and spacing on the circuit board during assembly.
Provides a sufficient number of output channels for transmitting processed data or control signals, supporting various output configurations.
Specifies the duration for which the FPGA can be exposed to peak reflow temperature during soldering, ensuring proper solder joint formation.
Specifies the maximum temperature limit for reflow soldering, ensuring proper bonding of the FPGA to the PCB for reliable electrical connections.
Specifies the length dimension of the FPGA package, aiding in proper positioning and alignment on the PCB for efficient circuit layout.
Field Programmable Gate Arrays (FPGA) XCAU25P-L1FFVB676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
Programmable IC Type:
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JESD-30 Code:
JESD-609 Code:
XCAU25P-L1FFVB676I Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
MBRM140T1G
Onsemi
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
LM358AN
Texas Instruments
LM358AN by Texas Instruments is an Operational Amplifier with 2 functions. It has a Max Input Offset Voltage of 5000 uV and Nominal Common Mode Reject Ratio of 85 dB. Widely used in voltage-feedback applications due to its high Min Voltage Gain of 15000 and Unity Gain Bandwidth of 1000 kHz.
MBR0520LT1
Motorola
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DP83848IVVX/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
1N4148
Frontier Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
NE555D
NE555D by Texas Instruments is an 8-terminal IC with a supply voltage range of 4.5V to 16V, suitable for analog waveform generation applications. It operates at temperatures from 0°C to 70°C and has a max supply current of 15mA. The package style is small outline, making it ideal for compact electronic designs.
FT232RL-REEL
FTDI
FTDI's FT232RL-REEL is a bus controller with 28 terminals, operating at 3.3V to 5.25V. It supports USB, VBUS, and UART buses with a data transfer rate of 60MBps. Ideal for industrial applications due to its CMOS technology and compatibility with RS232, RS422, and RS485 standards.
BSS138LT1G
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
Bkc Semiconductors
2N2222A
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Fairchild Semiconductor
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
BAV99
Gec Plessey Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
EP3C25F256C8NES
Altera
EP3C25F256C8NES by Altera is a plastic/epoxy FPGA with 24624 CLBs. It operates at a supply voltage range of 1.15V to 1.25V and supports a maximum clock frequency of 472.5 MHz. It has a low-profile, grid array package with 256 terminals.
10M04SAU169I7G
Intel
Intel 10M04SAU169I7G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. Ideal for industrial applications requiring a programmable IC with a supply voltage range of 2.85V to 3.15V and operating temperatures from -40°C to 100°C.
M2S090TS-1FG484I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Lead (Sn/Pb);
5CEBA4F17I7N
5CEBA4F17I7N by Intel is a FPGA with 49000 logic cells, CMOS technology, and 128 inputs/outputs. It operates at a nominal voltage of 1.1V and is suitable for applications requiring high-performance programmable ICs in compact form factors. The package style is grid array with low profile, making it ideal for space-constrained designs.
XCKU035-2FBVA900I
Xilinx
Xilinx XCKU035-2FBVA900I FPGA features 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a max operating temperature of 100°C. The package style is a grid array with a square shape and ball terminals for surface mount assembly.
XC6SLX9-3TQG144I
The Xilinx XC6SLX9-3TQG144I is a FPGA with 9152 logic cells, 715 CLBs, and 102 inputs/outputs. It operates at max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for industrial applications requiring high-speed processing in compact form factors with low power consumption.
XC6SLX4-2TQG144C
Xilinx XC6SLX4-2TQG144C is a FPGA with 3840 logic cells, 300 CLBs, and max clock frequency of 667 MHz. It operates at 1.2V nominal voltage and is used in applications requiring high-speed processing like telecommunications and industrial automation.
LFE5U-25F-7BG256I
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
A3P1000-PQG208I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
EP4CE22F17C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
10M40SAE144I7G
The Intel 10M40SAE144I7G is a Field Programmable Gate Array with 40000 logic cells, 2500 CLBs, and 500 inputs/outputs. It operates at temperatures ranging from -40 to 100°C and has a supply voltage of 2.85-3.15V. Ideal for industrial applications requiring high-performance programmable ICs in compact form factors.
EP1C4F324C8N
EP1C4F324C8N by Intel is a 4000 logic cell FPGA with 400 CLBs and 249 inputs/outputs. Operating at a max frequency of 275 MHz, it's ideal for applications requiring high-speed processing such as signal processing, networking, and industrial automation. With a compact square package style and low power consumption at 1.5V, it offers versatile programmability for various electronic designs.
LFE5U-45F-8BG381I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
EP2C5Q208I8N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Maximum Supply Voltage: 1.25 V;
XC7A50T-1FGG484I
The Xilinx XC7A50T-1FGG484I is a FPGA with 52160 logic cells, 4075 CLBs, and operates at a max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
M2S090-FCSG325
Microchip Technology's M2S090-FCSG325 FPGA offers 86184 logic cells, 180 inputs/outputs, and operates at a voltage range of 1.14V to 1.26V. Ideal for applications requiring high-speed processing and programmable logic in compact form factors with a grid array package style.
LFD2NX-40-7BG256C
Lattice Semiconductor's LFD2NX-40-7BG256C FPGA features 39000 logic cells, FDSOI technology, and 9750 CLBs. Ideal for applications requiring high performance with 111 inputs/outputs, low profile grid array package style, and operating temperatures from 0 to 85°C.
EP3C16F256C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: RECTANGULAR;
XC3S50AN-4TQG144I
The Xilinx XC3S50AN-4TQG144I is a FPGA with 1584 logic cells, 176 CLBs, and 50000 equivalent gates. It operates at max frequency of 667 MHz, suitable for industrial applications requiring high-speed processing in compact designs. With a wide temperature range (-40 to 100°C) and low profile package style, it's ideal for diverse electronic systems.
M1A3P250-PQG208I
Actel
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCAU25P-1SFVB784I
FIELD PROGRAMMABLE GATE ARRAY;
XCAU25P-1SFVB784E
XCAU25P-2FFVB676I
Xilinx XCAU25P-2FFVB676I FPGA features 308437 logic cells, 17625 CLBs, and 280 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V.
XCAU25P-2SFVB784E
XCAU20P-1SFVB784I
Xilinx XCAU20P-1SFVB784I FPGA offers 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 100°C. Package style: Grid Array, Fine Pitch.
XCAU10P-2UBVA368E
XCAU10P-2FFVB676I
XCAU10P-1UBVA368I
XCAU20P-L1FFVB676I
XCAU10P-2SBVB484I
XCAU20P-L1SFVB784I
XCAU20P-2SFVB784E
Xilinx XCAU20P-2SFVB784E FPGA offers 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor with a package style of grid array, fine pitch. Operating temperature range from 0 to 100°C makes it versatile for various industrial uses.
XCAU10P-1UBVA368E
XCAU10P-L1SBVB484I
XCAU10P-2UBVA368I
Xilinx XCAU10P-2UBVA368I FPGA features 96250 logic cells, 5500 CLBs, and 128 inputs/outputs. Ideal for applications requiring high-density programmable ICs in a compact GRID ARRAY package with low supply voltage and wide operating temperature range.
XCAU25P-L1SFVB784I
XCAU25P-2FFVB676E
XCAU10P-2SBVB484E
XCAU10P-L1UBVA368I
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