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MPF100T-1FCG484E

Microchip Technology

MPF100T-1FCG484E by Microchip Technology

MPF100T-1FCG484E by Microchip is a CMOS FPGA with 244 inputs/outputs, 484 terminals, and max supply voltage of 1.03V. Ideal for applications requiring high-density programmable logic in compact spaces due to its small form factor and grid array package style.

Median Price

$174.420

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5 parts In-Stock

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$174.420

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$141.712

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Microchip Technology

USA . 3 parts In-Stock

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$174.420

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Mouser Electronics

USA . 2 parts In-Stock

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$174.420

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$145.340

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$145.340

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Distributors (In-Stock)

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Digiode

USA . 362 parts In-Stock

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$203.224

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362

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Nova Conductors

Japan . 750 parts In-Stock

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$243.860

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Vyrian

USA . 8,870 parts In-Stock

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Chip Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 576 parts In-Stock

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$16.656

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Aztec Data Supply Inc.

USA . 2,065 parts In-Stock

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$25.650

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$38.308

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$36.392

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$36.392

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$38.308

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$36.392

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Corohmni

South Africa . 343 parts In-Stock

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$51.674

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Vigor

Singapore . 413 parts In-Stock

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$175.940

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Ampacity Inc.

Singapore . 3 parts In-Stock

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$181.830

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Semicontronic

India . 3 parts In-Stock

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$181.830

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$177.284

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$176.375

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$181.830

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Corphita

USA . 315 parts In-Stock

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$192.528

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Continental Prestige Electronics

USA . 5,078 parts In-Stock

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$243.860

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$238.983

5,078

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$238.983

Netroflash

USA . 50 parts In-Stock

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$243.860

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$238.983

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QUARKTWIN TECHNOLOGY LTD

USA . 9,520 parts In-Stock

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LMD Electronica

Estonia . 4,228 parts In-Stock

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Argo Parts USA

USA . 4,141 parts In-Stock

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NIA Electronics

USA . 3,271 parts In-Stock

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Ledger Components

France . 3,271 parts In-Stock

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Montano Global Distributors

Canada . 732 parts In-Stock

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LOOK Integrated Logistics

Peru . 702 parts In-Stock

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Overview

Unlock endless possibilities with the MPF100T-1FCG484E by Microchip Technology. This cutting-edge Field Programmable Gate Array (FPGA) offers unparalleled quality and reliability, backed by the trusted manufacturer, Microchip Technology. With its versatile applications and advanced technology, this FPGA provides customers with unmatched value, benefits, and advantages. Experience seamless integration, high performance, and innovative design with the MPF100T-1FCG484E. Elevate your projects to the next level with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers durability and protection for the FPGA chip, ensuring long-term performance and reliability.

Surface Mount: YES

Surface mount capability enables easy integration into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.03 V

Support for a high maximum supply voltage allows for flexibility in power input options, catering to different system requirements.

Technology Used: CMOS

CMOS technology ensures low power consumption and efficient operation, making the FPGA chip suitable for energy-efficient applications.

No. of Inputs: 244

A high number of inputs provides versatility and flexibility for connecting to various external devices and components.

Package Shape: SQUARE

The square package shape facilitates easy placement and alignment on circuit boards, optimizing space utilization.

Form Of Terminal: BALL

Ball terminals offer reliable connections and secure attachment to circuit boards, enhancing overall connectivity and signal transmission.

No. of Terminals: 484

The numerous terminals enable extensive connectivity options, accommodating a wide range of input and output configurations.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, the FPGA chip allows for customization and reconfiguration of logic functions, suiting diverse application requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers a robust and stable mounting structure, ensuring secure placement and alignment during the assembly process.

Minimum Supply Voltage: 0.97 V

Having a low minimum supply voltage enables efficient power utilization and operation at lower power levels, contributing to energy savings.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, the FPGA chip can withstand elevated heat levels, making it suitable for industrial and harsh environment applications.

Pitch Of Terminal: 1 mm

The 1 mm terminal pitch allows for precise and compact placement on circuit boards, enhancing overall design flexibility and space efficiency.

Minimum Operating Temperature: 0 °C

The FPGA chip can operate effectively at low temperatures, ensuring reliable performance in various environmental conditions.

Position Of Terminal: BOTTOM

Bottom-positioned terminals facilitate secure and stable attachment to circuit boards, maintaining consistent electrical connections.

Maximum Seated Height: 2.87 mm

The low maximum seated height minimizes the overall profile of the FPGA chip, allowing for compact integration into electronic devices and systems.

Width: 23 mm

The 23 mm width offers a compact form factor, enabling the FPGA chip to be easily accommodated in space-constrained designs.

No. of Outputs: 244

A high number of outputs support versatile signal routing and communication with external components, enhancing the functionality and compatibility of the FPGA chip.

Length: 23 mm

The 23 mm length complements the compact width of the FPGA chip, providing a space-efficient and streamlined form factor for integration into electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF100T-1FCG484E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Inputs:

244

No. of Outputs:

244

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.87 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF100T-1FCG484E Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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