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MPF100T-1FCVG484E

Microchip Technology

MPF100T-1FCVG484E by Microchip Technology

MPF100T-1FCVG484E by Microchip is a CMOS FPGA with 284 inputs/outputs, operating b/w 0-100°C. It features a grid array package style with 0.8mm terminal pitch, suitable for applications requiring high-density programmable logic solutions.

Median Price

$186.840

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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DigiKey

USA . 5 parts In-Stock

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$186.840

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$151.812

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Microchip Technology

USA . 3 parts In-Stock

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Digiode

USA . 477 parts In-Stock

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$233.690

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Vyrian

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Chip Stock

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Nova Conductors

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AZTECH Wire

Italy . 656 parts In-Stock

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$6.182

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Semicontronic

India . 490 parts In-Stock

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$33.000

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$32.175

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$32.010

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Corohmni

South Africa . 137 parts In-Stock

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$124.770

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Aztec Data Supply Inc.

USA . 295 parts In-Stock

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Vigor

Singapore . 227 parts In-Stock

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Ampacity Inc.

Singapore . 40 parts In-Stock

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Corphita

USA . 257 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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LOOK Integrated Logistics

Peru . 8,047 parts In-Stock

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NIA Electronics

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Ledger Components

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LMD Electronica

Estonia . 6,045 parts In-Stock

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Montano Global Distributors

Canada . 5,720 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Elevate your projects with the MPF100T-1FCVG484E from Microchip Technology, a leading manufacturer in the field of Field Programmable Gate Arrays (FPGA). This innovative product offers high-quality performance and reliability, making it ideal for a wide range of applications. With its cutting-edge technology and numerous terminals, this FPGA provides unmatched flexibility and customization options. Experience the value and benefits that this versatile component brings to your designs, allowing you to unleash your creativity and achieve remarkable results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into electronic circuits.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage helps in reducing power consumption and heat generation.

Technology Used: CMOS

The CMOS technology offers high performance and low power consumption for efficient operation.

No. of Inputs: 284

With a high number of inputs, this FPGA can handle complex digital circuits and data processing tasks.

Package Shape: SQUARE

The square package shape provides a compact design and efficient use of space on circuit boards.

Form Of Terminal: BALL

The ball terminal form ensures secure connections and reliable electrical contact.

No. of Terminals: 484

The large number of terminals allows for versatile connections and compatibility with different systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array, this product offers flexibility and customization for various applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style enables high-density mounting and space-saving on PCBs.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage supports energy efficiency and stable operation in low-power applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand demanding environmental conditions.

Pitch Of Terminal: 0.8 mm

The small pitch of terminals allows for space-efficient connections and compatibility with modern PCB designs.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance in various temperature environments.

Position Of Terminal: BOTTOM

The bottom terminal position facilitates convenient PCB layout and routing for efficient circuit design.

Maximum Seated Height: 3.32 mm

The maximum seated height of 3.32 mm enables low-profile integration and compact system designs.

Width: 19 mm

The 19 mm width provides a balance between compact size and ease of handling during installation.

No. of Outputs: 284

The high number of outputs enables this FPGA to handle complex digital processing tasks effectively.

Length: 19 mm

With a length of 19 mm, this FPGA offers a compact form factor for space-constrained applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF100T-1FCVG484E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Inputs:

284

No. of Outputs:

284

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

3.32 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF100T-1FCVG484E Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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