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M2GL090T-1FG484M

Microchip Technology

M2GL090T-1FG484M by Microchip Technology

M2GL090T-1FG484M by Microchip Technology is a CMOS FPGA with 86316 logic cells, 267 inputs/outputs, and operates at 1.2V. It is used in military-grade applications requiring high performance and reliability in harsh environments.

Median Price

$518.500

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 51 parts In-Stock

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$518.500

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Mouser Electronics

USA . 35 parts In-Stock

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$518.500

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Microchip Technology

USA . 16 parts In-Stock

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$518.500

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$471.360

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$281.350

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16

$518.500

$471.360

$281.350

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Distributors (In-Stock)

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NAC Semi

USA . 13 parts In-Stock

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$483.930

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$453.690

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Digiode

USA . 270 parts In-Stock

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$492.575

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270

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Nova Conductors

Japan . 100 parts In-Stock

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$514.445

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Vyrian

USA . 7,520 parts In-Stock

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Chip Stock

USA . 632 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 891 parts In-Stock

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$11.090

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Aztec Data Supply Inc.

USA . 223 parts In-Stock

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$82.580

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Advanced Electronics

New Zealand . 39 parts In-Stock

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$99.570

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$94.592

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$94.592

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Corohmni

South Africa . 286 parts In-Stock

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$117.454

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Ampacity Inc.

Singapore . 26 parts In-Stock

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$440.720

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Semicontronic

India . 26 parts In-Stock

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$440.720

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$429.702

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$427.498

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26

$440.720

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Corphita

USA . 473 parts In-Stock

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$466.650

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Argo Parts USA

USA . 4,477 parts In-Stock

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$514.445

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$509.300

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$504.156

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$499.011

4,477

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$509.300

$504.156

$499.011

Continental Prestige Electronics

USA . 2,642 parts In-Stock

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$514.445

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$504.156

2,642

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Netroflash

USA . 1,000 parts In-Stock

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$514.445

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$504.156

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Microchip USA

USA . 2,393 parts In-Stock

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$519.000

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2,393

$519.000

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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$0.464

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$0.464

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$0.464

900

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$0.464

$0.464

$0.464

Fulton Briggs Corp.

USA . 337 parts In-Stock

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337

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Overview

Elevate your projects to new heights with the M2GL090T-1FG484M by Microchip Technology. This top-of-the-line Field Programmable Gate Array boasts unparalleled quality and reliability, making it the perfect choice for a wide range of applications. With its advanced technology and impressive number of logic cells, this FPGA is designed to deliver exceptional performance. Embrace innovation and efficiency with the M2GL090T-1FG484M, where value meets excellence. Upgrade your projects today and experience the benefits firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components and ensures durability of the FPGA.

No. of Logic Cells: 86316

Large number of logic cells allows for complex programmable logic designs to be implemented.

Maximum Supply Voltage: 1.26 V

Offers flexibility in power supply options and allows for compatibility with a range of systems.

Technology Used: CMOS

CMOS technology ensures low power consumption and high speed performance.

No. of Inputs: 267

Sufficient number of inputs for connecting external devices and sensors for input.

Package Shape: SQUARE

Square package shape facilitates easy mounting and integration into circuit boards.

Form Of Terminal: BALL

Ball terminals provide good electrical connections and are suitable for surface mounting.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage ensures reliable operation of the FPGA.

Packaging Method: TRAY

Tray packaging simplifies handling and storage of the FPGAs during production and distribution.

Power Supplies (V): 1.2

Consistent power supply voltage for efficient and reliable operation of the FPGA.

No. of Terminals: 484

Sufficient number of terminals for connecting to external components and power sources.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA allows for flexible and customizable logic designs to be implemented.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage allows for energy-efficient operation of the FPGA.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in a variety of environments.

Pitch Of Terminal: 1 mm

1 mm pitch terminals allow for compact and efficient mounting on circuit boards.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for operation in extreme cold conditions.

Finishing Of Terminal Used: TIN LEAD

Tin lead finishing provides corrosion resistance and ensures long-term reliability of the terminals.

Position Of Terminal: BOTTOM

Bottom terminal positioning allows for efficient heat dissipation and easy access for soldering.

Moisture Sensitivity Level (MSL): 3

MSL rating of 3 indicates moderate sensitivity to moisture, requiring proper handling and storage.

Maximum Seated Height: 2.44 mm

Low seated height allows for slim and space-efficient design of the FPGA system.

Width: 23 mm

Compact width makes it suitable for integration into various electronic devices and systems.

No. of Outputs: 267

Ample number of outputs for sending processed data and signals to external devices.

Maximum Time At Peak Reflow Temperature (s): 20

Ability to withstand peak reflow temperature for up to 20 seconds allows for reliable soldering during production.

Peak Reflow Temperature °C: 225

High peak reflow temperature ensures secure solder joints and reliable electrical connections.

Length: 23 mm

Compact length facilitates space-efficient integration into electronic systems and devices.

Grading Of Temperature: MILITARY

Military-grade temperature grading ensures reliable performance in harsh environmental conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M2GL090T-1FG484M attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

86316

No. of Inputs:

267

No. of Outputs:

267

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

20 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.44 mm

Packing Method:

Tray

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

M2GL090T-1FG484M Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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