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XC7A50T-2CSG325C

Xilinx

XC7A50T-2CSG325C by Xilinx

Xilinx XC7A50T-2CSG325C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

Median Price

$98.656

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Farnell

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Nova Conductors

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AZTECH Wire

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Aztec Data Supply Inc.

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Corohmni

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Ampacity Inc.

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Corphita

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Vigor

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Continental Prestige Electronics

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Advanced Electronics

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Microchip USA

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Netroflash

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Modulus Dynamics

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Semicontronic

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Texas Native Microelectronics

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Kenton Components

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iodParts Technologies Inc.

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Lixinc

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Overview

Unlock the power of innovation with the XC7A50T-2CSG325C by Xilinx, a leading manufacturer in Field Programmable Gate Arrays (FPGA). With 52160 logic cells and 4075 CLBs, this FPGA offers unparalleled flexibility and performance for a wide range of applications. From telecommunications to automotive electronics, this versatile device empowers you to bring your ideas to life with ease. Trust in Xilinx's reputation for quality and reliability, and experience the value and benefits that the XC7A50T-2CSG325C brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the FPGA suitable for various environments.

No. of Logic Cells: 52160

With a high number of logic cells, this FPGA is capable of handling complex and advanced applications with ease.

Surface Mount: YES

The surface mount feature allows for easy and secure installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage helps minimize power consumption and heat generation, making the FPGA energy-efficient.

No. of CLBs: 4075

The large number of Configurable Logic Blocks (CLBs) enables flexibility and customization in design, offering versatility for various projects.

No. of Inputs: 250

With a high number of inputs, the FPGA can efficiently process and handle a significant amount of data, making it suitable for data-intensive applications.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on circuit boards, optimizing layout and design.

Form Of Terminal: BALL

The ball terminals provide a reliable connection with the circuit board, ensuring stable performance and signal integrity.

No. of Terminals: 325

The ample number of terminals allows for easy and secure connections, enhancing reliability and stability in operation.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a FPGA, this product offers reprogrammable capabilities, allowing for flexibility and adaptability in various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enables high-density integration and efficient signal routing on the circuit board.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, increasing the product's versatility.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the FPGA can withstand harsh environmental conditions and extended usage.

Pitch Of Terminal: 0.8 mm

The small pitch of the terminals allows for compact placement on the circuit board, optimizing space utilization and layout.

Maximum Combinatorial Delay of a CLB: 1.05 ns

The low combinatorial delay ensures fast and efficient processing of logic functions, enhancing the overall performance of the FPGA.

Organization: 4075 CLBS

The organized layout of 4075 CLBs simplifies design and implementation, making the FPGA user-friendly and intuitive to work with.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments, increasing the product's reliability.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of Tin, Silver, and Copper finishing on the terminals provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Position Of Terminal: BOTTOM

The positioning of terminals at the bottom of the package facilitates easy and secure mounting onto the circuit board, enhancing stability and connection.

Moisture Sensitivity Level (MSL): 3

With MSL 3 rating, the FPGA can withstand moderate levels of moisture exposure, making it suitable for a variety of operating conditions.

Maximum Seated Height: 1.5 mm

The low seated height allows for a compact and space-efficient design, making the FPGA suitable for applications with limited space constraints.

Width: 15 mm

The narrow width of the FPGA enables efficient placement and integration into circuit board layouts, optimizing space utilization.

Maximum Clock Frequency: 1286 MHz

With a high maximum clock frequency, the FPGA supports rapid data processing and high-speed performance, making it ideal for time-sensitive applications.

No. of Outputs: 250

The plentiful outputs allow for the FPGA to interface with multiple external devices, expanding its usability and connectivity options.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature ensures quick and efficient soldering during the assembly process, reducing manufacturing time.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures secure and reliable soldering connections, maintaining the integrity of the FPGA during assembly.

Length: 15 mm

The compact length of the FPGA makes it suitable for applications with space constraints, enabling versatile and flexible design options.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A50T-2CSG325C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

52160

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

4075

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

4075 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA325,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A50T-2CSG325C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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