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XC7A200T-1FBG676C

Xilinx

XC7A200T-1FBG676C by Xilinx

Xilinx XC7A200T-1FBG676C FPGA offers 215360 logic cells, 16825 CLBs, and 400 inputs/outputs. Ideal for high-performance applications requiring a max clock frequency of 1098 MHz. Package style is grid array with plastic/epoxy material and tin silver copper finishing.

Median Price

$329.485

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Farnell

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Element14

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Digiode

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Nova Conductors

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Aztec Data Supply Inc.

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Modulus Dynamics

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Advanced Electronics

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Corohmni

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Microchip USA

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Continental Prestige Electronics

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One Stop Electronics

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Ampacity Inc.

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Overview

Unlock endless possibilities with the Xilinx XC7A200T-1FBG676C Field Programmable Gate Array. Manufactured by industry leader Xilinx, this FPGA boasts unmatched quality and reliability. With over 215,000 logic cells and a maximum clock frequency of 1098 MHz, this versatile device is perfect for a wide range of applications. From data processing to machine learning, the XC7A200T-1FBG676C offers unparalleled value and performance, making it the ideal choice for your next project. Elevate your designs with Xilinx today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

No. of Logic Cells: 215360

With a high number of logic cells, this FPGA offers ample resources for complex designs.

Surface Mount: YES

The surface mount option allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage contributes to energy efficiency and reduced power consumption.

No. of CLBs: 16825

A high number of Configurable Logic Blocks provides flexibility in design implementation.

Technology Used: CMOS

CMOS technology ensures high performance and low power consumption.

No. of Inputs: 400

The large number of inputs allows for connectivity to multiple external devices.

Package Shape: SQUARE

The square package shape makes the FPGA easy to handle and mount on PCBs.

Form Of Terminal: BALL

The ball terminal form ensures reliable connections and ease of soldering.

No. of Terminals: 676

Sufficient terminals provide ample connectivity options for various applications.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a FPGA, it offers reconfigurability for rapid prototyping and development.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient routing and space-saving on PCBs.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage allows for operation in low-power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the FPGA can withstand harsh environments.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals enables compact PCB design and layout.

Maximum Combinatorial Delay of a CLB: 1.27 ns

The low combinatorial delay ensures fast signal processing and high-speed operation.

Organization: 16825 CLBS

The organized structure with 16825 CLBs offers scalability and efficiency in design implementation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range allows for reliable performance in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing ensures good conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

The terminal position at the bottom allows for easy and secure PCB mounting.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the FPGA can withstand exposure to moisture during storage and handling.

Maximum Seated Height: 2.54 mm

The low seated height makes it suitable for compact and slim device designs.

Width: 27 mm

The 27mm width provides compatibility with standard PCB sizes and spacing.

Maximum Clock Frequency: 1098 MHz

With a high maximum clock frequency, the FPGA can handle demanding real-time applications.

No. of Outputs: 400

The numerous outputs offer flexibility in driving various external components.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and reliable soldering during assembly.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance allows for reliable solder joints in manufacturing.

Length: 27 mm

The 27mm length provides a compact form factor for space-constrained applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A200T-1FBG676C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

215360

No. of Inputs:

400

No. of Outputs:

400

No. of CLBs:

16825

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

16825 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.54 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A200T-1FBG676C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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