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XC7A50T-2CSG325I

Xilinx

XC7A50T-2CSG325I by Xilinx

XC7A50T-2CSG325I by Xilinx is a Field Programmable Gate Array (FPGA) with 52160 logic cells and 4075 configurable logic blocks (CLBs). It operates at a max clock frequency of 1286 MHz and is commonly used in industrial applications requiring high-speed processing.

Median Price

$126.268

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Farnell

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Mouser Electronics

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Element14

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DigiKey

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Digiode

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Nova Conductors

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Modulus Dynamics

Lithuania . 1,346 parts In-Stock

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Vigor

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Aztec Data Supply Inc.

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Ampacity Inc.

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One Stop Electronics

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Semicontronic

India . 143 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Texas Native Microelectronics

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Advanced Electronics

New Zealand . 233 parts In-Stock

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Microchip USA

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Bastille Electronics

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Corohmni

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Qasali Group International

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Supply Digital

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Lucentia Tech

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Kenton Components

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Overview

Discover the XC7A50T-2CSG325I by Xilinx, a groundbreaking Field Programmable Gate Array (FPGA) that offers unparalleled quality and performance. Xilinx, a renowned manufacturer in the industry, is known for delivering cutting-edge solutions that exceed customer expectations. With its impressive 52160 logic cells and 4075 CLBs, this FPGA empowers you to unleash your creativity and bring your innovative ideas to life. Whether you're developing advanced communication systems, industrial automation solutions, or high-performance computing applications, the XC7A50T-2CSG325I delivers exceptional value, benefits, and advantages. Unlock limitless possibilities with Xilinx's XC7A50T-2CSG325I and experience the difference that true innovation can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product resilient and suitable for various applications.

No. of Logic Cells: 52160

The high number of logic cells allows for complex digital designs, making this FPGA suitable for advanced and intricate applications.

Surface Mount: YES

The surface mount feature simplifies the installation process and ensures secure and reliable connections, making this FPGA easy to integrate into different systems.

Maximum Supply Voltage: 1.05 V

The ability to handle a high supply voltage provides flexibility and compatibility with a wide range of power sources, enhancing the versatility of this FPGA.

No. of CLBs: 4075

The abundance of configurable logic blocks enables efficient design implementation, allowing for the creation of sophisticated circuits and systems.

No. of Inputs: 250

With numerous available inputs, this FPGA offers substantial capacity for data processing and input/output operations, making it suitable for demanding applications.

Package Shape: SQUARE

The square package shape facilitates efficient space utilization, making this FPGA ideal for compact designs and installations where space is limited.

Form Of Terminal: BALL

The use of ball terminals allows for reliable connections and easy soldering, ensuring a stable and secure interface between the FPGA and other components.

Nominal Supply Voltage (V): 1

The specified nominal supply voltage ensures compatibility with standard power sources, making it easier to integrate this FPGA into different systems.

Power Supplies (V): 1

This FPGA's power supply requirement matches the standard voltage, simplifying the design and minimizing the need for additional power regulation.

No. of Terminals: 325

The abundance of terminals provides ample connectivity options, allowing for versatile configurations and effortless integration into a wide range of systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array, this IC offers flexibility and adaptability to various applications, making it an excellent choice for prototyping and customization.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high-density integration, low profile installation, and precise terminal placement, making it suitable for applications with space limitations and advanced PCB layouts.

Minimum Supply Voltage: 0.95 V

The ability to handle low supply voltages allows for power optimization, making this FPGA beneficial for energy-efficient designs and portable applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand demanding thermal conditions, ensuring reliable operation even in challenging environments.

Pitch Of Terminal: 0.8 mm

The small terminal pitch enables compact PCB designs, allowing for high-density integration and miniaturization of electronic systems.

Maximum Combinatorial Delay of a CLB: 1.05 ns

The low combinatorial delay ensures fast data processing and response times, making this FPGA suitable for applications that require real-time operation.

Organization: 4075 CLBS

The organized configuration of 4075 configurable logic blocks provides a structured framework for efficient circuit design and implementation.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this FPGA can withstand extremely cold environments, making it suitable for applications that require extended temperature ranges.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals enhances conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-term performance.

Position Of Terminal: BOTTOM

The positioning of the terminals at the bottom simplifies PCB layout and enables efficient thermal management, making this FPGA suitable for space-constrained applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures proper handling and storage requirements, minimizing the risk of moisture-related damage during production and transportation.

Maximum Seated Height: 1.5 mm

The low seated height allows for compact overall system design, making this FPGA suitable for applications with height restrictions or space-constrained environments.

Width: 15 mm

The specified width ensures compatibility with standard PCB design guidelines and facilitates seamless integration into various electronic systems.

Maximum Clock Frequency: 1286 MHz

With a high maximum clock frequency, this FPGA offers fast data processing and computational capabilities, making it suitable for applications that require high-speed operation.

No. of Outputs: 250

The abundance of outputs enables the FPGA to handle multiple simultaneous output signals, making it suitable for applications that require extensive data output capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum allowable time at peak reflow temperature ensures proper soldering and PCB assembly processes, guaranteeing reliable product performance during manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures successful soldering and component mounting, meeting industry standards and facilitating efficient PCB assembly.

Length: 15 mm

The specified length ensures compatibility with standard PCB design guidelines and facilitates seamless integration into various electronic systems.

Grading Of Temperature: INDUSTRIAL

The industrial temperature grading ensures reliable operation and performance in a wide range of temperature conditions, making this FPGA suitable for demanding industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A50T-2CSG325I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

52160

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

4075

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

4075 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA325,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A50T-2CSG325I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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