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XC7S25-1CSGA324C

Xilinx

XC7S25-1CSGA324C by Xilinx

The Xilinx XC7S25-1CSGA324C is a FPGA with 23360 logic cells, 1825 CLBs, and operates at a max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

Median Price

$44.075

Lifecycle Status

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8

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Mouser Electronics

USA . 122 parts In-Stock

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$42.800

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DigiKey

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Digiode

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$39.159

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VNN

France . 175 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

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AZTECH Wire

Italy . 763 parts In-Stock

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$13.260

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Continental Prestige Electronics

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Vigor

Singapore . 589 parts In-Stock

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One Stop Electronics

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$35.040

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Ampacity Inc.

Singapore . 80 parts In-Stock

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Semicontronic

India . 19 parts In-Stock

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$35.050

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Corphita

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Aranea Global

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$39.515

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Microchip USA

USA . 1,792 parts In-Stock

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$41.730

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$40.730

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$40.230

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$39.730

Advanced Electronics

New Zealand . 59 parts In-Stock

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$44.254

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$40.714

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MARBEL Systems

Belgium . 50 parts In-Stock

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Aztec Data Supply Inc.

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Texas Native Microelectronics

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Kenton Components

USA . 21,397 parts In-Stock

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Modulus Dynamics

Lithuania . 1,776 parts In-Stock

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Corohmni

South Africa . 186 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Qasali Group International

UK . 2,801 parts In-Stock

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Supply Digital

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Perfect Parts

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Argo Parts USA

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Futuretech Components

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Overview

Unlock the potential of your projects with the XC7S25-1CSGA324C by Xilinx, a top-tier manufacturer in the Field Programmable Gate Arrays (FPGA) category. Boasting 23360 logic cells and 1825 CLBs, this FPGA offers unparalleled flexibility and power for your designs. With a maximum clock frequency of 1098 MHz and a wide range of applications, this product provides exceptional value and performance. Trust Xilinx to deliver cutting-edge technology that will elevate your projects to new heights. Elevate your designs with the XC7S25-1CSGA324C FPGA from Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

No. of Logic Cells: 23360

With a high number of logic cells, this FPGA can handle complex processing tasks efficiently.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage helps in reducing power consumption and heat generation.

No. of CLBs: 1825

Having a large number of Configurable Logic Blocks (CLBs) provides flexibility in designing and implementing custom logic functions.

No. of Inputs: 150

The high number of inputs allows for a wide range of external signals to be processed.

Package Shape: SQUARE

The square package shape simplifies mounting and placement in tight spaces, optimizing board layout.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable device, this FPGA offers flexibility for rapid prototyping and customization.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in harsh environmental conditions.

No. of Outputs: 150

Having a high number of outputs allows for driving multiple external devices or signals.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7S25-1CSGA324C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

23360

No. of Inputs:

150

No. of Outputs:

150

No. of CLBs:

1825

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Organization:

1825 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Trade Compliance

XC7S25-1CSGA324C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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