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XC6SLX9-2CSG324C

Xilinx

XC6SLX9-2CSG324C by Xilinx

Xilinx XC6SLX9-2CSG324C FPGA features 9152 logic cells, 715 CLBs, and a max clock frequency of 667 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

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$46.580

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Texas Native Microelectronics

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Overview

Unlock the power of innovation with the Xilinx XC6SLX9-2CSG324C Field Programmable Gate Array. Crafted by industry leader Xilinx, this FPGA boasts unmatched quality and reliability. With 9152 logic cells and 715 CLBs, this versatile device is perfect for a wide range of applications. From telecommunications to automotive, the possibilities are endless. Experience lightning-fast speeds with a maximum clock frequency of 667 MHz. Trust Xilinx to deliver cutting-edge technology that will take your projects to new heights. Elevate your designs with the XC6SLX9-2CSG324C and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides cost-effectiveness and durability to the FPGA.

No. of Logic Cells: 9152

With a large number of logic cells, this FPGA offers high capacity and flexibility for complex designs.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation onto circuit boards.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26V ensures safe operation and protection for the FPGA.

No. of CLBs: 715

The 715 configurable logic blocks offer versatile programming options and customization for various applications.

Technology Used: CMOS

The CMOS technology used in this FPGA provides low power consumption and high performance.

No. of Inputs: 200

With 200 inputs, this FPGA can accommodate a wide range of signals and data for processing.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board.

Form Of Terminal: BALL

The ball terminal design enhances connectivity and reliability of the FPGA.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures consistent and stable operation of the FPGA.

Power Supplies (V): 1.2,2.5/3.3

The availability of multiple power supply options provides flexibility in designing and powering the FPGA.

No. of Terminals: 324

With 324 terminals, this FPGA offers ample connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array, this product allows for reconfiguration and customization as per specific requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enhances reliability and compactness of the FPGA.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand demanding environmental conditions.

Pitch Of Terminal: 0.8 mm

The 0.8mm pitch of terminals allows for precise and secure connections in the circuit.

Maximum Combinatorial Delay of a CLB: 0.26 ns

The low combinatorial delay of 0.26ns ensures fast processing and reduced latency in the FPGA.

Organization: 715 CLBS

The organization of 715 CLBs provides a structured and efficient architecture for logic operations.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this FPGA can function reliably in a wide range of environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finishing ensures good conductivity and resistance to corrosion.

Position Of Terminal: BOTTOM

The bottom position of terminals makes it easier to integrate the FPGA into circuit layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this FPGA can withstand moderate exposure to moisture during handling and storage.

Maximum Seated Height: 1.5 mm

With a maximum seated height of 1.5mm, this FPGA is suitable for applications with space constraints.

Width: 15 mm

The 15mm width of the FPGA allows for compact placement on circuit boards with tight space requirements.

Maximum Clock Frequency: 667 MHz

The high maximum clock frequency of 667MHz enables rapid processing and response times in the FPGA.

No. of Outputs: 200

With 200 outputs, this FPGA can deliver a wide range of signals and data to other components.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures safe and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this FPGA can withstand high-temperature soldering processes.

Length: 15 mm

The 15mm length of the FPGA provides a compact form factor for integration into various electronic devices.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX9-2CSG324C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

9152

No. of Inputs:

200

No. of Outputs:

200

No. of CLBs:

715

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

715 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX9-2CSG324C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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