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XC7A15T-3FTG256E

Xilinx

XC7A15T-3FTG256E by Xilinx

The Xilinx XC7A15T-3FTG256E is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1412 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

Median Price

$47.220

Lifecycle Status

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8

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Mouser Electronics

USA . 360 parts In-Stock

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DigiKey

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Digiode

USA . 173 parts In-Stock

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$46.730

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VNN

France . 55 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 211 parts In-Stock

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Modulus Dynamics

Lithuania . 1,388 parts In-Stock

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Ampacity Inc.

Singapore . 284 parts In-Stock

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$41.810

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Semicontronic

India . 283 parts In-Stock

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Vigor

Singapore . 539 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 300 parts In-Stock

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$55.090

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$52.336

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$49.030

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Microchip USA

USA . 1,536 parts In-Stock

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$55.590

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$54.590

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$54.090

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$110.020

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$104.519

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Texas Native Microelectronics

USA . 30 parts In-Stock

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$110.904

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$106.468

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$103.141

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$97.596

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Aztec Data Supply Inc.

USA . 4,497 parts In-Stock

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Corohmni

South Africa . 452 parts In-Stock

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Lixinc

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MARBEL Systems

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Argo Parts USA

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Supply Digital

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Robosynatics

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Lucentia Tech

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Kenton Components

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Qasali Group International

UK . 233 parts In-Stock

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Overview

Discover the cutting-edge technology of Xilinx's XC7A15T-3FTG256E FPGA, designed to deliver superior performance and flexibility for a wide range of applications. With its 16,640 logic cells and 1300 CLBs, this innovative product offers unmatched capabilities in a compact package. Whether you're in need of high-speed data processing, signal processing, or embedded system design, this FPGA provides the power and efficiency to meet your demands. Trust in Xilinx's reputation for quality and reliability, and unlock the limitless possibilities with the XC7A15T-3FTG256E FPGA today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FPGA, making it a reliable choice for various applications.

No. of Logic Cells: 16640

With a large number of logic cells, this FPGA allows for complex designs and high-performance applications.

Surface Mount: YES

The surface mount capability makes installation easy and efficient, saving time during production.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making it energy-efficient.

No. of CLBs: 1300

The high number of Configurable Logic Blocks enables flexibility and customization for different project requirements.

No. of Inputs: 250

With a generous number of inputs, this FPGA can handle a wide range of data inputs, increasing its versatility.

Package Shape: SQUARE

The square shape of the package makes it easy to integrate into circuit designs and conserves space on a PCB.

Form Of Terminal: BALL

The ball terminal design provides reliable connections and makes it suitable for BGA assembly processes.

No. of Terminals: 256

This FPGA offers ample terminals for connecting to external components, enhancing its connectivity options.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array allows for reprogramming and updating the FPGA for different functions, making it adaptable for evolving project needs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A15T-3FTG256E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

16640

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

1300

Maximum Clock Frequency:

1412 MHz

CLB Maximum Delay:

0.94 ns

Organization:

1300 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Trade Compliance

XC7A15T-3FTG256E Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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